A method and apparatus for producing AlN whiskers includes reduced incorporation of metal particles, an AlN whisker body, AlN whiskers, a resin molded body, and a method for producing the resin molded body. The method for producing AlN whiskers includes heating an Al-containing material in a material accommodation unit to thereby generate Al gas; and introducing the Al gas into a reaction chamber through a communication portion while introducing nitrogen gas into the reaction chamber through a gas inlet port, to thereby grow AlN whiskers on the surface of an Al.sub.2O.sub.3 substrate placed in the reaction chamber.

The present disclosure is directed to compositions comprising at least one layer having first and second surfaces, each layer comprising: a substantially two-dimensional array of crystal cells, each crystal cell having an empirical formula of M′.sub.2M″nX.sub.n+1, such that each X is positioned within an octahedral array of M′ and M″; wherein M′ and M″ each comprise different Group 11113, WE, VB, or VIB metals; each X is C, N, or a combination thereof; n=1 or 2; and wherein the M′ atoms are substantially present as two-dimensional outer arrays of atoms within the two-dimensional array of crystal cells; the M″ atoms are substantially present as two-dimensional inner arrays of atoms within the two-dimensional array of crystal cells; and the two dimensional inner arrays of M″ atoms are sandwiched between the two-dimensional outer arrays of M′ atoms within the two-dimensional army of crystal cells.

The present disclosure is directed to compositions comprising at least one layer having first and second surfaces, each layer comprising: a substantially two-dimensional array of crystal cells, each crystal cell having an empirical formula of M′.sub.2M″nX.sub.n+1, such that each X is positioned within an octahedral array of M′ and M″; wherein M′ and M″ each comprise different Group 11113, WE, VB, or VIB metals; each X is C, N, or a combination thereof; n=1 or 2; and wherein the M′ atoms are substantially present as two-dimensional outer arrays of atoms within the two-dimensional array of crystal cells; the M″ atoms are substantially present as two-dimensional inner arrays of atoms within the two-dimensional array of crystal cells; and the two dimensional inner arrays of M″ atoms are sandwiched between the two-dimensional outer arrays of M′ atoms within the two-dimensional army of crystal cells.

A method for growing a GaN crystal suitable as a material of GaN substrates including C-plane GaN substrates includes: a first step of preparing a GaN seed having a nitrogen polar surface; a second step of arranging a pattern mask on the nitrogen polar surface of the GaN seed, the pattern mask being provided with a periodical opening pattern comprising linear openings and including intersections, the pattern mask being arranged such that longitudinal directions of at least part of the linear openings are within ±3° from a direction of an intersection line between the nitrogen polar surface and an M-plane; and a third step of ammonothermally growing a GaN crystal through the pattern mask such that a gap is formed between the GaN crystal and the pattern mask.

A method for growing a GaN crystal suitable as a material of GaN substrates including C-plane GaN substrates includes: a first step of preparing a GaN seed having a nitrogen polar surface; a second step of arranging a pattern mask on the nitrogen polar surface of the GaN seed, the pattern mask being provided with a periodical opening pattern comprising linear openings and including intersections, the pattern mask being arranged such that longitudinal directions of at least part of the linear openings are within ±3° from a direction of an intersection line between the nitrogen polar surface and an M-plane; and a third step of ammonothermally growing a GaN crystal through the pattern mask such that a gap is formed between the GaN crystal and the pattern mask.

An aluminum nitride plate satisfies a “c1>97.5%”, a “c2>97.0%”, a “w1<2.5 degrees”, and a “w1/w2<0.995” where c1 is a c-plane degree of orientation that is defined as a ratio of a diffraction intensity of (002) plane when a surface layer of the aluminum nitride plate is subjected to an X-ray diffraction measurement, and c2 is a c-plane degree of orientation that is defined as a ratio of the diffraction intensity of (002) plane when a portion other than the surface layer of the aluminum nitride plate is subjected to the X-ray diffraction measurement, wherein w1 is a half-value width in an X-ray rocking curve profile of (102) plane of the surface layer and w2 is a half-value width in the X-ray rocking curve profile of (102) plane of the portion other than the surface layer.

An aluminum nitride plate satisfies a “c1>97.5%”, a “c2>97.0%”, a “w1<2.5 degrees”, and a “w1/w2<0.995” where c1 is a c-plane degree of orientation that is defined as a ratio of a diffraction intensity of (002) plane when a surface layer of the aluminum nitride plate is subjected to an X-ray diffraction measurement, and c2 is a c-plane degree of orientation that is defined as a ratio of the diffraction intensity of (002) plane when a portion other than the surface layer of the aluminum nitride plate is subjected to the X-ray diffraction measurement, wherein w1 is a half-value width in an X-ray rocking curve profile of (102) plane of the surface layer and w2 is a half-value width in the X-ray rocking curve profile of (102) plane of the portion other than the surface layer.

An object is to improve quality of a nitride crystal. A crystal represented by a composition formula In.sub.xAl.sub.yGa.sub.1−x−yN (satisfying 0≤x≤1, 0≤y≤1, and 0≤x+y≤1), wherein the concentration of carbon in the crystal is less than 1×10.sup.15 cm.sup.−3, and the concentration of an electron trap E3 that exits in an energy range from 0.5 eV to 0.65 eV from a lower end of a conduction band in the crystal is less than 1×10.sup.14 cm.sup.−3.

An object is to improve quality of a nitride crystal. A crystal represented by a composition formula In.sub.xAl.sub.yGa.sub.1−x−yN (satisfying 0≤x≤1, 0≤y≤1, and 0≤x+y≤1), wherein the concentration of carbon in the crystal is less than 1×10.sup.15 cm.sup.−3, and the concentration of an electron trap E3 that exits in an energy range from 0.5 eV to 0.65 eV from a lower end of a conduction band in the crystal is less than 1×10.sup.14 cm.sup.−3.

A composite nitride-based film structure includes a bulk single crystal, a plurality of nitride microcrystals, and an amorphous nitride thin film. The plurality of nitride microcrystals is provided on the bulk single crystal, and has a specific orientation relationship with a crystal structure of the bulk single crystal. The nitride thin film is provided on the bulk single crystal, surrounds the nitride microcrystal, and covers a surface of the bulk single crystal.