Patent classifications
C01B32/956
Silicon carbide ingot, method of preparing the same, and method for preparing silicon carbide wafer
A SiC ingot includes: a main body including a first cross-sectional plane of the main body and a second cross-sectional plane of the main body facing the first cross-sectional plane; and a protrusion disposed on the second cross-sectional plane and including a convex surface from the second cross-sectional plane of the main body, wherein a first end point disposed at one end of the second cross sectional plane, a second end point disposed at another end of the second cross sectional plane, and a peak point disposed on the convex surface are disposed on a third cross-sectional plane of the main body perpendicular to the first cross-sectional plane, and wherein a radius of curvature of an arc corresponding to a line of intersection between the third cross-sectional plane and the convex surface satisfies Equation 1 below:
3D≤r≤37D [Equation 1]
where r is the radius of curvature of the arc corresponding to the line of intersection between the third cross-sectional plane and the convex surface, and D is a length of a line of intersection between the first cross-sectional plane and the third cross-sectional plane.
METHOD FOR SEPARATING IMPURITIES FROM SILICON CARBIDE, AND TEMPERATURE-TREATED AND PURIFIED SILICON CARBIDE POWDER
The invention concerns the area of ceramics an relates to a method for separating impurities from silicon carbide, said method being applicable to SiC powders from grinding sludges, and to temperature-treated and purified silicon carbide powder. The aim of the invention is to provide a method with which different impurities are substantially completely removed using a simple and economical process. This is achieved by a method in which pulverulent SiC waste products that have a mass percent of SiC of at least 50% and an average grain size d.sub.50 ranging from 0.5 to 1000 μm and have been subjected to a temperature treatment and cooled are mechanically treated and physically separated. The physically separated SiC powder is then divided into two fractions, one of which has a mass of impurities that is greater than the mass of impurities in the other fraction at least by a factor of 2.
METHOD FOR SEPARATING IMPURITIES FROM SILICON CARBIDE, AND TEMPERATURE-TREATED AND PURIFIED SILICON CARBIDE POWDER
The invention concerns the area of ceramics an relates to a method for separating impurities from silicon carbide, said method being applicable to SiC powders from grinding sludges, and to temperature-treated and purified silicon carbide powder. The aim of the invention is to provide a method with which different impurities are substantially completely removed using a simple and economical process. This is achieved by a method in which pulverulent SiC waste products that have a mass percent of SiC of at least 50% and an average grain size d.sub.50 ranging from 0.5 to 1000 μm and have been subjected to a temperature treatment and cooled are mechanically treated and physically separated. The physically separated SiC powder is then divided into two fractions, one of which has a mass of impurities that is greater than the mass of impurities in the other fraction at least by a factor of 2.
Scanning probe microscope with use of composite materials
Scanning Probe Microscope (SPM) system configured with the use of a composite material employing a non-metallic matrix and at least one of diamond particles, fused silica particles, boron carbide particles, silicon carbide particles, aluminum oxide particles, carbon fiber elements, carbon nanotube elements, and doped diamond particles to increase the structural integrity and/or strength of the SPM system, and a fraction of reinforcement ranging from at least 25% to at least 75% with advantageous modification of the Young's modulus, coefficient of thermal expansion, and thermal conductivity.
SiC single crystal composite and SiC ingot
A SiC single crystal composite includes: a central portion positioned at a center in plan view; and an outer circumferential portion surrounding an outer circumference of the central portion, in which crystal planes of the central portion and the outer circumferential portion are inclined to each other or different from each other, a boundary is present between the central portion and the outer circumferential portion, and a direction of a crystal constituting the central portion and a direction of a crystal constituting the outer circumferential portion are different from each other via the boundary.
SiC single crystal composite and SiC ingot
A SiC single crystal composite includes: a central portion positioned at a center in plan view; and an outer circumferential portion surrounding an outer circumference of the central portion, in which crystal planes of the central portion and the outer circumferential portion are inclined to each other or different from each other, a boundary is present between the central portion and the outer circumferential portion, and a direction of a crystal constituting the central portion and a direction of a crystal constituting the outer circumferential portion are different from each other via the boundary.
METHOD OF MANUFACTURING HIGH-PURITY SiC CRYSTAL
A method of preparing a high-purity silicon carbide (SiC) crystal, and more specifically, to a method of preparing high-purity SiC having an extremely low impurity content in an excellent yield and in large quantities. The method including preparing a reactor containing a reaction chamber; heating the conductive heating element in the reaction chamber; mixing a silicon precursor, a carbon precursor, and a carrier gas; injecting the mixed gas into the reaction chamber, depositing SiC on the conductive heating element and harvesting the deposited SiC crystals.
SILICON CARBIDE INGOT MANUFACTURING METHOD, SILICON CARBIDE INGOTS, AND GROWTH SYSTEM THEREFOR
In a method for manufacturing a silicon carbide ingot, a silicon carbide ingot, a system for manufacturing a silicon carbide into according to embodiments of the present invention, a crucible assembly comprising a crucible body having an inner space and a crucible cover covering the crucible body, a silicon carbide ingot is grown after disposing a raw material and a silicon carbide seed, wherein a weight of the crucible assembly is set to have a weight ratio of 1.5 to 2.7 when a weight of the raw material is regarded as 1. Thus, a silicon carbide ingot has a large area and reduced defects can be manufactured.
SILICON CARBIDE INGOT MANUFACTURING METHOD, SILICON CARBIDE INGOTS, AND GROWTH SYSTEM THEREFOR
In a method for manufacturing a silicon carbide ingot, a silicon carbide ingot, a system for manufacturing a silicon carbide into according to embodiments of the present invention, a crucible assembly comprising a crucible body having an inner space and a crucible cover covering the crucible body, a silicon carbide ingot is grown after disposing a raw material and a silicon carbide seed, wherein a weight of the crucible assembly is set to have a weight ratio of 1.5 to 2.7 when a weight of the raw material is regarded as 1. Thus, a silicon carbide ingot has a large area and reduced defects can be manufactured.
SILICON CARBIDE POWDER AND METHOD FOR MANUFACTURING SILICON CARBIDE INGOT USING THE SAME
Disclosed are a silicon carbide powder and a method of manufacturing a silicon carbide ingot using the same. More particularly, the silicon carbide powder includes carbon and silicon and has a particle circularity of 0.4 to 0.9 measured through 2D image analysis.