C01F17/218

FILM-FORMING MATERIAL

A film-forming material of the present invention contains an oxyfluoride of yttrium represented by YO.sub.XF.sub.Y (X and Y are numbers satisfying 0<X and X<Y) and YF.sub.3, wherein a ratio I.sub.2/I.sub.1 of a peak height I.sub.2 of the (020) plane of YF.sub.3 to a peak height I.sub.1 of the main peak of YO.sub.XF.sub.Y as analyzed by XRD is from 0.005 to 100. It is preferable that a ratio I.sub.4/I.sub.1 of a peak height I.sub.4 of the main peak of Y.sub.2O.sub.3 to the peak height I.sub.1 of the main peak of YO.sub.XF.sub.Y as analyzed by XRD is 0.01 or less.

Film-forming material

A film-forming material of the present invention contains an oxyfluoride of yttrium represented by YO.sub.XF.sub.Y (X and Y are numbers satisfying 0<X and X<Y) and YF.sub.3, wherein a ratio I.sub.2/I.sub.1 of a peak height I.sub.2 of the (020) plane of YF.sub.3 to a peak height I.sub.1 of the main peak of YO.sub.XF.sub.Y as analyzed by XRD is from 0.005 to 100. It is preferable that a ratio I.sub.4/I.sub.1 of a peak height I.sub.4 of the main peak of Y.sub.2O.sub.3 to the peak height I.sub.1 of the main peak of YO.sub.XF.sub.Y as analyzed by XRD is 0.01 or less.

DOWN-CONVERTED LIGHT EMITTING COMBINATION AND METHOD OF MANUFACTURING THE SAME

A down-converted light emitting combination that generates a visible light when an ultraviolet light is incident is provided. The down-converted light emitting combination includes a first structure made of a first material that generates a visible light of a first color when an ultraviolet light of a first wavelength range is incident and a second structure made of a second material that generates a visible light of a second color different from the first color when the ultraviolet light of a second wavelength range different from the first wavelength range is incident, and the first material and the second material have different emission colors and distributions of intensities of the visible lights generated depending on a wavelength of the incident ultraviolet light.

DOWN-CONVERTED LIGHT EMITTING COMBINATION AND METHOD OF MANUFACTURING THE SAME

A down-converted light emitting combination that generates a visible light when an ultraviolet light is incident is provided. The down-converted light emitting combination includes a first structure made of a first material that generates a visible light of a first color when an ultraviolet light of a first wavelength range is incident and a second structure made of a second material that generates a visible light of a second color different from the first color when the ultraviolet light of a second wavelength range different from the first wavelength range is incident, and the first material and the second material have different emission colors and distributions of intensities of the visible lights generated depending on a wavelength of the incident ultraviolet light.

Material For Plasma Spray Comprising Y-O-F Compound Method For Producing The Same And Spray Coating Prepared Using The Same
20230416897 · 2023-12-28 ·

Disclosed are a material for spray for plasma spray coating having high plasma resistance and a method for producing the same. The material for plasma spray comprises an yttrium compound, and the numbers of moles of Y (yttrium), O (oxygen), and F (fluorine) in the yttrium compound satisfy 1.5<(O+F)/Y<2.0.

PLASMA PROCESSING DEVICE MEMBER AND PLASMA PROCESSING DEVICE
20210035776 · 2021-02-04 ·

A plasma processing device member of the present disclosure is made of an yttrium oxide sintered body containing 98% by mass or more of yttrium oxide and having a plurality of open pores, in which when an average of the distances between centers of gravity of the open pores adjacent to each other is set to L1, L1 is 50 m or more. Additionally, a plasma processing device of the present disclosure includes the plasma processing device member and a plasma generator.

PLASMA PROCESSING DEVICE MEMBER AND PLASMA PROCESSING DEVICE
20210035776 · 2021-02-04 ·

A plasma processing device member of the present disclosure is made of an yttrium oxide sintered body containing 98% by mass or more of yttrium oxide and having a plurality of open pores, in which when an average of the distances between centers of gravity of the open pores adjacent to each other is set to L1, L1 is 50 m or more. Additionally, a plasma processing device of the present disclosure includes the plasma processing device member and a plasma generator.

FILM-FORMING MATERIAL

A film-forming material of the present invention contains an oxyfluoride of yttrium represented by YO.sub.XF.sub.Y (X and Y are numbers satisfying 0<X and X<Y) and YF.sub.3, wherein a ratio I.sub.2/I.sub.1 of a peak height I.sub.2 of the (020) plane of YF.sub.3 to a peak height I.sub.1 of the main peak of YO.sub.XF.sub.Y as analyzed by XRD is from 0.005 to 100. It is preferable that a ratio I.sub.4/I.sub.1 of a peak height I.sub.4 of the main peak of Y.sub.2O.sub.3 to the peak height I.sub.1 of the main peak of YO.sub.XF.sub.Y as analyzed by XRD is 0.01 or less.

Rare Earth Oxyfluoride Sintered Body And Method For Producing Same
20200407280 · 2020-12-31 ·

A sintered rare earth oxyfluoride compact is composed of Ln.sub.aO.sub.bF.sub.c (wherein Ln is a rare earth element; and a, b, and c each independently represent a positive number, provided that they are not equal to each other) or Ca-stabilized LnOF as a primary phase and LnOF unstabilized with Ca as a secondary phase. The intensity ratio of the XRD peak of the (018) or (110) plane of the unstabilized LnOF to the highest XRD peak of Ln.sub.aO.sub.bF.sub.c is preferably 0.5% to 30%.

SUBSTRATE SUPPORT COVER FOR HIGH-TEMPERATURE CORROSIVE ENVIRONMENT

Embodiments of the present disclosure generally relate to an apparatus and a method for cleaning a processing chamber. In one embodiment, a substrate support cover includes a bulk member coated with a fluoride coating. The substrate support cover is placed on a substrate support disposed in the processing chamber during a cleaning process. The fluoride coating does not react with the cleaning species. The substrate support cover protects the substrate support from reacting with the cleaning species, leading to reduced condensation formed on chamber components, which in turn leads to reduced contamination of the substrate in subsequent processes.