A sintered body, a method of fabricating the sintered body, a semiconductor fabricating device, and a method of fabricating the semiconductor fabricating device, the sintered body including 50 mass % or more of Y.sub.5O.sub.4F.sub.7, wherein the sintered body has a relative density of 97.0% or more and a Vickers hardness of 2.4 GPa or more.

A sintered body, a method of fabricating the sintered body, a semiconductor fabricating device, and a method of fabricating the semiconductor fabricating device, the sintered body including 50 mass % or more of Y.sub.5O.sub.4F.sub.7, wherein the sintered body has a relative density of 97.0% or more and a Vickers hardness of 2.4 GPa or more.

A sintered body, a method of fabricating the sintered body, a semiconductor fabricating device, and a method of fabricating the semiconductor fabricating device, the sintered body including 50 mass % or more of Y.sub.5O.sub.4F.sub.7, wherein the sintered body has a relative density of 97.0% or more and a Vickers hardness of 2.4 GPa or more.

A sintered body, a method of fabricating the sintered body, a semiconductor fabricating device, and a method of fabricating the semiconductor fabricating device, the sintered body including 50 mass % or more of Y.sub.5O.sub.4F.sub.7, wherein the sintered body has a relative density of 97.0% or more and a Vickers hardness of 2.4 GPa or more.