C01F17/265

Sprayed coating, method for manufacturing sprayed coating, sprayed member and spraying material

A sprayed coating having a multilayer structure including a lower layer made a sprayed coating containing a rare earth oxide, and a surface layer made of another sprayed coating containing a rare earth fluoride and/or a rare earth oxyfluoride, the multilayered sprayed coating having a volume resistivity at 23° C. and a volume resistivity at 200° C., the volume resistivity at 23° C. being 1×10.sup.9 to 1×10.sup.12 Ω.Math.cm, and a temperature index of the volume resistivities defined by the ratio of the volume resistivity at 200° C. to the volume resistivity at 23° C. being 0.1 to 10.

FILM-FORMING MATERIAL

A film-forming material of the present invention contains an oxyfluoride of yttrium represented by YO.sub.XF.sub.Y (X and Y are numbers satisfying 0<X and X<Y) and YF.sub.3, wherein a ratio I.sub.2/I.sub.1 of a peak height I.sub.2 of the (020) plane of YF.sub.3 to a peak height I.sub.1 of the main peak of YO.sub.XF.sub.Y as analyzed by XRD is from 0.005 to 100. It is preferable that a ratio I.sub.4/I.sub.1 of a peak height I.sub.4 of the main peak of Y.sub.2O.sub.3 to the peak height I.sub.1 of the main peak of YO.sub.XF.sub.Y as analyzed by XRD is 0.01 or less.

FILM-FORMING MATERIAL

A film-forming material of the present invention contains an oxyfluoride of yttrium represented by YO.sub.XF.sub.Y (X and Y are numbers satisfying 0<X and X<Y) and YF.sub.3, wherein a ratio I.sub.2/I.sub.1 of a peak height I.sub.2 of the (020) plane of YF.sub.3 to a peak height I.sub.1 of the main peak of YO.sub.XF.sub.Y as analyzed by XRD is from 0.005 to 100. It is preferable that a ratio I.sub.4/I.sub.1 of a peak height I.sub.4 of the main peak of Y.sub.2O.sub.3 to the peak height I.sub.1 of the main peak of YO.sub.XF.sub.Y as analyzed by XRD is 0.01 or less.

Film-forming material

A film-forming material of the present invention contains an oxyfluoride of yttrium represented by YO.sub.XF.sub.Y (X and Y are numbers satisfying 0<X and X<Y) and YF.sub.3, wherein a ratio I.sub.2/I.sub.1 of a peak height I.sub.2 of the (020) plane of YF.sub.3 to a peak height I.sub.1 of the main peak of YO.sub.XF.sub.Y as analyzed by XRD is from 0.005 to 100. It is preferable that a ratio I.sub.4/I.sub.1 of a peak height I.sub.4 of the main peak of Y.sub.2O.sub.3 to the peak height I.sub.1 of the main peak of YO.sub.XF.sub.Y as analyzed by XRD is 0.01 or less.

Film-forming material

A film-forming material of the present invention contains an oxyfluoride of yttrium represented by YO.sub.XF.sub.Y (X and Y are numbers satisfying 0<X and X<Y) and YF.sub.3, wherein a ratio I.sub.2/I.sub.1 of a peak height I.sub.2 of the (020) plane of YF.sub.3 to a peak height I.sub.1 of the main peak of YO.sub.XF.sub.Y as analyzed by XRD is from 0.005 to 100. It is preferable that a ratio I.sub.4/I.sub.1 of a peak height I.sub.4 of the main peak of Y.sub.2O.sub.3 to the peak height I.sub.1 of the main peak of YO.sub.XF.sub.Y as analyzed by XRD is 0.01 or less.

Material For Plasma Spray Comprising Y-O-F Compound Method For Producing The Same And Spray Coating Prepared Using The Same
20230416897 · 2023-12-28 ·

Disclosed are a material for spray for plasma spray coating having high plasma resistance and a method for producing the same. The material for plasma spray comprises an yttrium compound, and the numbers of moles of Y (yttrium), O (oxygen), and F (fluorine) in the yttrium compound satisfy 1.5<(O+F)/Y<2.0.

FILM-FORMING MATERIAL

A film-forming material of the present invention contains an oxyfluoride of yttrium represented by YO.sub.XF.sub.Y (X and Y are numbers satisfying 0<X and X<Y) and YF.sub.3, wherein a ratio I.sub.2/I.sub.1 of a peak height I.sub.2 of the (020) plane of YF.sub.3 to a peak height I.sub.1 of the main peak of YO.sub.XF.sub.Y as analyzed by XRD is from 0.005 to 100. It is preferable that a ratio I.sub.4/I.sub.1 of a peak height I.sub.4 of the main peak of Y.sub.2O.sub.3 to the peak height I.sub.1 of the main peak of YO.sub.XF.sub.Y as analyzed by XRD is 0.01 or less.

FILM-FORMING MATERIAL

A film-forming material of the present invention contains an oxyfluoride of yttrium represented by YO.sub.XF.sub.Y (X and Y are numbers satisfying 0<X and X<Y) and YF.sub.3, wherein a ratio I.sub.2/I.sub.1 of a peak height I.sub.2 of the (020) plane of YF.sub.3 to a peak height I.sub.1 of the main peak of YO.sub.XF.sub.Y as analyzed by XRD is from 0.005 to 100. It is preferable that a ratio I.sub.4/I.sub.1 of a peak height I.sub.4 of the main peak of Y.sub.2O.sub.3 to the peak height I.sub.1 of the main peak of YO.sub.XF.sub.Y as analyzed by XRD is 0.01 or less.

SUBSTRATE SUPPORT COVER FOR HIGH-TEMPERATURE CORROSIVE ENVIRONMENT

Embodiments of the present disclosure generally relate to an apparatus and a method for cleaning a processing chamber. In one embodiment, a substrate support cover includes a bulk member coated with a fluoride coating. The substrate support cover is placed on a substrate support disposed in the processing chamber during a cleaning process. The fluoride coating does not react with the cleaning species. The substrate support cover protects the substrate support from reacting with the cleaning species, leading to reduced condensation formed on chamber components, which in turn leads to reduced contamination of the substrate in subsequent processes.