A mold includes a mold component, a plurality of ejector pins and a stop block. The mold component has a molding surface for forming a glass product and a bottom surface disposed opposite to the molding surface. The mold component defines a plurality of passing through holes through the molding surface and the bottom surface. Each ejector pin passes movably through one corresponding through hole and is configured to separate the glass product from the mold component. The stop block for forming a stop on the ejector pins disposed on one side of the bottom surface. Separates the glass product from the mold component before the glass product is completely cooled down by using the combination of the ejector pins together with the stop block, which can make the cooling of the glass product more uniform.

A mold for molding a glass product is provided. The mold includes a first pressing mold having a first surface and a second pressing mold having a second surface. The first surface is located on a side of the first pressing mold. The second surface is located on a side of the second pressing mold. The first pressing mold includes a first molding portion formed by bending from the first surface. The second pressing mold includes a second molding portion and is formed by bending from the second surface. The first pressing mold further includes a plurality of first hydraulic resistance portions that are spaced apart from each other, close to an outer edge of the first pressing mold, and protrude from the first surface. The disclosure achieves a technical effect of increasing a peripheral molding pressure of the mold and improving yield of products.

A glass manufacturing apparatus configured to manufacture glass through a process of lowering the temperature of a non-contact supported glass material. The glass manufacturing apparatus comprises a heating unit configured to heat the glass material; and a forming unit configured to form the molten glass material while its temperature decreases after the heating by the heating unit has stopped.

A method for treating a mold includes grinding an outer metal surface of a mold body of the mold with a first material; lapping the outer metal surface after the grinding with a second material that is finer than the first material; and polishing the outer metal surface after the lapping to achieve an average surface roughness (R.sub.a) less than or equal to about 0.15 m and a waviness height (W.sub.a) less than or equal to about 100 nm. A mold for shaping glass-based material can include a mold body having an outer metal surface, wherein the outer metal surface has an average surface roughness (R.sub.a) less than or equal to about 0.15 m and a waviness height (W.sub.a) less than or equal to about 100 nm.

The present invention provides an infrared-transmitting glass that is a chalcogenide glass, has a reduced Ge content, can sufficiently cover atmospheric windows, is free from highly toxic elements, such as Se and As, and is suitable for mold forming. Specifically, the present invention provides an infrared-transmitting glass suitable for mold forming, comprising, in terms of molar concentration: 0 to 2% of Ge, 3 to 30% of Ga, 10 to 40% of Sb, 45 to 70% of S, 3 to 30% of at least one member selected from the group consisting of Sn, Ag, Cu, Te, and Cs, and 0 to 30% of at least one member selected from the group consisting of Cl, Br, and I.

A method for treating a mold includes grinding an outer metal surface of a mold body of the mold with a first material; lapping the outer metal surface after the grinding with a second material that is finer than the first material; and polishing the outer metal surface after the lapping to achieve an average surface roughness (R.sub.a) less than or equal to about 0.15 m and a waviness height (W.sub.a) less than or equal to about 100 nm. A mold for shaping glass-based material can include a mold body having an outer metal surface, wherein the outer metal surface has an average surface roughness (R.sub.a) less than or equal to about 0.15 m and a waviness height (W.sub.a) less than or equal to about 100 nm.

An array of glass members is arranged in a glass substrate includes a plurality of depressions formed in a first main surface of the glass substrate, and a plurality of openings formed in a second main surface of the glass substrate.

The present invention relates to a production method for a glassy carbon mold, and, more specifically, relates to a production method for a glassy carbon mold including the steps of: placing a mixture having a thermosetting resin, a curing agent, and a viscosity adjusting solvent between a thermosetting resin substrate and a master pattern formed by a micro-nano process; pressing either the master pattern or the thermosetting resin substrate and applying heat to form a cured thermosetting resin pattern part on the substrate; and removing the master pattern, and subjecting the substrate and the cured thermosetting resin pattern.

A method of manufacturing a plurality of glass members comprises bringing a first main surface of a glass substrate in contact with a first working surface of a first mold substrate, the first working surface being provided with a plurality of first protruding portions, and bringing a second main surface of the glass substrate in contact with a second working surface of a second mold substrate, the second working surface being provided with a plurality of second protruding portions. The method further comprises controlling a temperature of the glass substrate to a temperature above a glass-transition temperature to form the plurality of glass members, removing the first and the second mold substrates from the glass substrate, and separating adjacent ones of the plurality of glass members.

The present invention relates to a silicon mold device for production of an optical element in a high temperature environment and a preparation method thereof. The silicon mold device utilized in this invention features a symmetrical structure, ensuring uniform deformation during heating to mitigate eccentricity issues. Additionally, a stepped silicon mold core is employed and secured by applying force through an electrode pressure plate, thereby enhancing overall parallelism. Support columns assist in the closure and alignment of the upper and lower molds. Each support column can be individually adjusted for parallelism, facilitating the enhancement of precision and reliability in the preparation of optical elements.