A method is provided that includes providing a glass sheet of a thickness of at most 300 μm and irradiating the glass sheet with a pulsed laser beam. The laser beam has a light intensity inside the glass sheet leaves a filamentary damage along its path through the glass sheet. The laser beam and the glass sheet are moved relative to each other so that due to the pulses of the laser beam filamentary damages are inserted next to one another along a path running on the glass sheet. During the insertion of the filamentary damages, a tensile stress is applied on the glass at the filamentary damages and in the direction transverse to the path of the adjacent filamentary damages so that the glass sheet separates along the path during insertion of the filamentary damages.

An apparatus for manufacturing a display device includes: a stage unit; and a suction unit located above the stage unit, wherein the suction unit includes: a main body including an outer box with top and bottom openings and an inner cup disposed in the outer box; a first air blower disposed above the main body and including a first main pipe extending in a first direction and a second air blower including a second main pipe extending in a second direction intersecting the first direction; a lower plate coupled to a lower end of the outer box and including a through hole; and a suction inlet defined by an inner end of the lower plate defining the through hole and a lower end of the inner cup, wherein the suction inlet is opened downward.

The present disclosure relates to an apparatus for cutting substrate material, the apparatus including: a mounting frame; a base mounted to the mounting frame; an upper cutter device disposed on the mounting frame; and a substrate material clamp disposed on the upper cutter device and used to clamp substrate material, the substrate material clamp including a clamp body and a flattening member connected to the clamp body, and the flattening member being used to flatten the substrate material. In the above technical solution, the flattening member is provided on the lower surface of the substrate material clamp, and during the process that the substrate material clamp approaches the base, the flattening member flattens the curled substrate material, and thus the quality of the substrate material is improved.

A method is provided for producing a patterned glass wafer for packaging electronic devices in a wafer assembly. The method includes placing a glass sheet between two mold halves and heating until the glass sheet softens, while the mold halves are pressed against one another so that the glass sheet is reshaped and forms a patterned glass wafer. The first mold half has an array of projections and the second mold half has an array of recesses. The mold halves are arranged and shaped so that the recesses and projections oppose each other. The projections introduce cavities into the glass sheet during the reshaping and with the glass flowing into the recesses of the second mold half during the reshaping. The recesses are deep enough for the glass to at least partially not come in contact therewith and to form a convexly shaped glass surface in each recess.

A laser irradiation step in the present method includes irradiating a first surface (MG1) of a mother glass sheet (MG) with laser light (L) to heat a surface layer (SL) and an inner portion (IL) of the first surface (MG1), to thereby cause, through a thermal shock caused by the heating, a crack (CR) to propagate to a second surface (MG2) of the mother glass sheet (MG) along a thickness direction of the mother glass sheet (MG) while propagating along a preset cleaving line (CL).

Methods for singulating an optical waveguide material at a contour include directing a first laser beam onto a first side of the optical waveguide material to generate a first group of perforations in the optical waveguide material. A second laser beam is directed onto a second side of the optical waveguide material to generate a second group of perforations in the optical waveguide material. The second side is opposite the first side. The first group of perforations and the second group of perforations define a perforation zone at the contour. A third laser beam is directed at the perforation zone to singulate the optical waveguide material at the perforation zone.

A cutting system for slabs which includes a longitudinal guide having a pair of surfaces opposite to each other, the pair made up of a lower surface and an opposite upper surface, a suction cup coupled to the lower surface of the longitudinal guide suitable to selectively adhere to a slab and defining a contact surface of the longitudinal guide on the slab, the longitudinal guide further including a pair of rails parallel to each other coupled to the upper surface of the longitudinal guide and suitable for slidably coupling to a scoring slider. The rails are arranged on opposite sides with respect to a median plane of the suction cup perpendicular to the contact surface thereof.

A cutting system for slabs which includes a longitudinal guide having a pair of surfaces opposite to each other, the pair made up of a lower surface and an opposite upper surface, a suction cup coupled to the lower surface of the longitudinal guide suitable to selectively adhere to a slab and defining a contact surface of the longitudinal guide on the slab, the longitudinal guide further including a pair of rails parallel to each other coupled to the upper surface of the longitudinal guide and suitable for slidably coupling to a scoring slider. The rails are arranged on opposite sides with respect to a median plane of the suction cup perpendicular to the contact surface thereof.

A glass plate bend-breaking machine for a glass plate is comprised of: a supporting mechanism by which a glass plate with a predetermined bend-breaking line as a cut line formed on an upper surface, i.e., one surface, thereof is supported at a lower surface, i.e., another surface, of the glass plate; and press-breaking devices and for press-breaking the glass plate along the predetermined bend-breaking line, wherein each of the press-breaking devices and has a pressing body for simultaneously pressing a plurality of parts and along the predetermined bend-breaking line on the upper surface of the glass plate at the time of press-breaking the glass plate along the predetermined bend-breaking line at each of press-breaking positions P1, P2, P3, P4 and P5 on the glass plate.

A glass plate bend-breaking machine for a glass plate is comprised of: a supporting mechanism by which a glass plate with a predetermined bend-breaking line as a cut line formed on an upper surface, i.e., one surface, thereof is supported at a lower surface, i.e., another surface, of the glass plate; and press-breaking devices and for press-breaking the glass plate along the predetermined bend-breaking line, wherein each of the press-breaking devices and has a pressing body for simultaneously pressing a plurality of parts and along the predetermined bend-breaking line on the upper surface of the glass plate at the time of press-breaking the glass plate along the predetermined bend-breaking line at each of press-breaking positions P1, P2, P3, P4 and P5 on the glass plate.