A method of continuous processing of flexible glass ribbon having a thickness of no more than 0.35 mm using a glass processing apparatus is provided. The method includes providing the glass processing apparatus having at least three processing zones including a first processing zone, a second processing zone and a third processing zone. The flexible glass ribbon is continuously fed from the first processing zone, through the second processing zone to the third processing zone. Rate of the flexible glass ribbon is controlled through each of the first processing zone, second processing zone and third processing zone using a global control device. The second processing zone has a conveyance path for the flexible glass ribbon through a cutting zone having a radius of curvature of from about 100 inches to about 400 inches.

A method of continuous processing of flexible glass ribbon having a thickness of no more than 0.35 mm using a glass processing apparatus is provided. The method includes providing the glass processing apparatus having at least three processing zones including a first processing zone, a second processing zone and a third processing zone. The flexible glass ribbon is continuously fed from the first processing zone, through the second processing zone to the third processing zone. Rate of the flexible glass ribbon is controlled through each of the first processing zone, second processing zone and third processing zone using a global control device. The second processing zone has a conveyance path for the flexible glass ribbon through a cutting zone having a radius of curvature of from about 100 inches to about 400 inches.

A method and apparatus for processing glass comprising a forming apparatus in a first processing zone, the forming apparatus configured to form a glass ribbon having a first direction of travel in the first processing zone. The apparatus also includes a first cutting apparatus in a second processing zone, the first cutting apparatus configured to separate one or more portions of the glass ribbon, the glass ribbon having a second direction of travel. The apparatus includes a first buffer zone between the first processing zone and the second processing zone in which the glass ribbon is supported in a first catenary between two, spaced-apart payoff positions. The second direction of travel in the second processing zone can be orthogonal to the first direction of travel in the first processing zone.

A method and apparatus for processing glass comprising a forming apparatus in a first processing zone, the forming apparatus configured to form a glass ribbon having a first direction of travel in the first processing zone. The apparatus also includes a first cutting apparatus in a second processing zone, the first cutting apparatus configured to separate one or more portions of the glass ribbon, the glass ribbon having a second direction of travel. The apparatus includes a first buffer zone between the first processing zone and the second processing zone in which the glass ribbon is supported in a first catenary between two, spaced-apart payoff positions. The second direction of travel in the second processing zone can be orthogonal to the first direction of travel in the first processing zone.

In a substrate processing method in which, for a substrate including a first layer made of a glass substrate and second layers made of a material different from that of the first layer and provided on a front surface and a back surface of the first layer, respectively, an intended mark is formed in each of the second layers, the substrate processing method includes the step of irradiating with a laser beam having an energy density capable of processing the second layers but incapable of processing the first layer from one surface side of the substrate, thereby simultaneously forming the mark at corresponding positions on each of a front surface and a back surface of the substrate.

A method for cutting a substrate by laser and a laser cutting device are disclosed. The method includes the following steps: engraving a plurality of intercrossed first parallel lines and second parallel lines on a substrate, in which regions for engraving a shape of sub-substrates are encircled between the first parallel lines and the second parallel lines; shaped lines are disposed in the regions; auxiliary split lines are engraved on an outside of the shaped lines; and a minimum distance from end portions of the auxiliary split lines towards the shaped lines to the shaped lines falls within the first default threshold. The method adopts the arrangement of the parallel lines and the auxiliary split lines to help splitting the substrate, and can increase stress rupture points in the process of cutting the substrate, avoid the phenomenon of rupture of the glass substrate in the cutting process, and effectively improve the yield of substrate cutting.

A method for cutting a substrate by laser and a laser cutting device are disclosed. The method includes the following steps: engraving a plurality of intercrossed first parallel lines and second parallel lines on a substrate, in which regions for engraving a shape of sub-substrates are encircled between the first parallel lines and the second parallel lines; shaped lines are disposed in the regions; auxiliary split lines are engraved on an outside of the shaped lines; and a minimum distance from end portions of the auxiliary split lines towards the shaped lines to the shaped lines falls within the first default threshold. The method adopts the arrangement of the parallel lines and the auxiliary split lines to help splitting the substrate, and can increase stress rupture points in the process of cutting the substrate, avoid the phenomenon of rupture of the glass substrate in the cutting process, and effectively improve the yield of substrate cutting.

A brittle plate processing method includes having a first portion of a brittle plate supported flat on a flat part of a support member that supports a first surface of the brittle plate, pressing a cutter against a second surface of the brittle plate opposite to the first surface, and forming a scribe line in the second surface of the brittle plate by moving the cutter and the support member relative to each other. In pressing the cutter, the cutter is pressed to a predetermined position on a second portion of the brittle plate other than the first portion. When the cutter is pressed to the predetermined position on the second portion of the brittle plate, the shape of the brittle plate due to bending deformation is defined by a defining part of the support member.

A brittle plate processing method includes having a first portion of a brittle plate supported flat on a flat part of a support member that supports a first surface of the brittle plate, pressing a cutter against a second surface of the brittle plate opposite to the first surface, and forming a scribe line in the second surface of the brittle plate by moving the cutter and the support member relative to each other. In pressing the cutter, the cutter is pressed to a predetermined position on a second portion of the brittle plate other than the first portion. When the cutter is pressed to the predetermined position on the second portion of the brittle plate, the shape of the brittle plate due to bending deformation is defined by a defining part of the support member.

A glass sheet processing apparatus includes a first gantry assembly that extends across a glass sheet in a cross-machine direction. The first gantry assembly includes a processing head that moves along a length of the first gantry assembly and includes a laser comprising an optical arrangement positioned in a beam path of the laser providing a laser beam focal line that is formed on a beam output side of the optical arrangement. A second gantry assembly extends across the glass sheet in the cross-machine direction. The second gantry assembly includes a processing head that moves along a length of the second gantry assembly.