An objective of the present invention is to provide a brittle material chip and the like having excellent flexibility. The present invention is a brittle material chip including a brittle material layer formed of a brittle material. The brittle material chip includes first processed marks formed on one side in a thickness direction of the brittle material layer on at least one end surface of the brittle material layer and having depths of 1 m or more and less than half the thickness of the brittle material layer and includes or does not include second processed marks formed on the other side in the thickness direction on the end surface of the brittle material layer, facing the first processed marks in the thickness direction, and having depths of less than 1 m.

An objective of the present invention is to provide a brittle material chip and the like having excellent flexibility. The present invention is a brittle material chip including a brittle material layer formed of a brittle material. The brittle material chip includes first processed marks formed on one side in a thickness direction of the brittle material layer on at least one end surface of the brittle material layer and having depths of 1 m or more and less than half the thickness of the brittle material layer and includes or does not include second processed marks formed on the other side in the thickness direction on the end surface of the brittle material layer, facing the first processed marks in the thickness direction, and having depths of less than 1 m.

Laser processing techniques may be used to form structures for electronic devices. A laser processing system may be provided with lasers and positioners for moving laser beams across a structure to be processed such as a layer of glass or other material. A laser such as a pulsed infrared laser may be move along a path across the layer of material. The laser may create a series of damaged regions along the path. A portion of the layer may be removed from other portions of the layer by breaking off the portion of the layer along the path. Laser-induced heating techniques and mechanical stress-inducing techniques may be used to impart stress to the layer of material to help break off the portion. The layer may include one or more sublayers such as layers of glass substrate material in a display.

To provide a method of processing a tempered glass in which a length of time required for manufacturing one plate of a product glass is significantly reduced while the quality of the product glass is secured. In the method of processing the tempered glass in which a stacked block (1a) acting as a chemical tempered glass (1) is processed by using a processing device (8) under a condition that the processing device (8) is rotated and vibrated, the stacked block (1a) is cut out from a stack (1A) acting as the chemical tempered glass (1) by using a dicing blade (84), prior to the processing of the stacked block (1a) by using the processing device (8), and a finishing to an outer periphery of the stacked block (1a) is also performed during the processing of the stacked block (1a) by using the processing device (8).

To provide a method of processing a tempered glass in which a length of time required for manufacturing one plate of a product glass is significantly reduced while the quality of the product glass is secured. In the method of processing the tempered glass in which a stacked block (1a) acting as a chemical tempered glass (1) is processed by using a processing device (8) under a condition that the processing device (8) is rotated and vibrated, the stacked block (1a) is cut out from a stack (1A) acting as the chemical tempered glass (1) by using a dicing blade (84), prior to the processing of the stacked block (1a) by using the processing device (8), and a finishing to an outer periphery of the stacked block (1a) is also performed during the processing of the stacked block (1a) by using the processing device (8).

A cutter edge is caused to slide to generate a plastic deformation on a first surface of a brittle substrate, thus forming a trench line. The trench line is formed so as to obtain a crack-free state in which the brittle substrate seamlessly continues in a direction intersecting the trench line directly below the trench line. The crack-free state is then maintained. A crack of the brittle substrate in its thickness direction is extended along the trench line to form a crack line. The brittle substrate is divided along the crack line.

A method for cutting out pieces of glass from a glass sheet, includes, a step of automatic generation by a computer with a storage unit, containing programs to calculate a first optimum plan for guillotine cutting at a number of hierarchical levels of different pieces from each of the glass sheet, as a function of information; a step of reading information relating to defects in the glass sheet, a step of automatic generation by a computer with a storage unit, containing programs to calculate a second optimum plan for guillotine cutting at a number of hierarchical levels from the glass sheet, based on the first optimum cutting plan and at least some of the information relating to the defects, including permutations of cross cut sections at the same hierarchical level within the glass sheet; a step of cutting pieces of glass in accordance with the second optimum cutting plan generated.

A method for cutting out pieces of glass from a glass sheet, includes, a step of automatic generation by a computer with a storage unit, containing programs to calculate a first optimum plan for guillotine cutting at a number of hierarchical levels of different pieces from each of the glass sheet, as a function of information; a step of reading information relating to defects in the glass sheet, a step of automatic generation by a computer with a storage unit, containing programs to calculate a second optimum plan for guillotine cutting at a number of hierarchical levels from the glass sheet, based on the first optimum cutting plan and at least some of the information relating to the defects, including permutations of cross cut sections at the same hierarchical level within the glass sheet; a step of cutting pieces of glass in accordance with the second optimum cutting plan generated.

A method includes introducing light into a glass article such that at least a portion of the introduced light is emitted from an edge of the glass article. The light emitted from an edge of the glass article is detected. An intensity profile of the emitted light is an intensity of the emitted light as a function of axial position. A first intensity boundary of the intensity profile and a second intensity boundary of the intensity profile are determined. A thickness of a layer of the glass article is determined based on an axial distance between the first intensity boundary and the second intensity boundary.

Disclosed are a cutting method of flexible display panel, a controlling device in the cutting method and a cutting apparatus of flexible display panel. The cutting method comprises steps of placing a transparent substrate (21) carried with a flexible film layer (22) on a base (10); cutting only the transparent substrate (21) by means of a cutting tool (30); obtaining a cutting trace of the cutting tool (30); and controlling a laser knife (40) to cut the flexible film layer (22) carried on the transparent substrate (21) along the cutting trace of the cutting tool cutting the transparent substrate. In this way, by controlling the laser knife (40) to cut the flexible film layer (22) disposed on the transparent substrate (21) following the cutting trace of the cutting tool (30) cutting the transparent substrate (21), the flexible film layer (22) can be completely cut at the same time when or after the transparent substrate (21) is completely cut, so as to avoid rough selvedges during cutting the flexible film layer (22), thereby improving the cutting effect of cutting the flexible display panel; besides, in case that the cutting tool (30) and the laser knife (40) operate in parallel cutting mode, it can also improve the cutting efficiency.