C03B33/037

METHOD AND DEVICE FOR OPTIMIZING A PLAN FOR CUTTING BY GUILLOTINE OF PIECES OF GLASS

A method determines an optimized cutting plan for using a guillotine to cut a batch of rectangular pieces of glass out from at least one sheet of glass. The method includes initializing including defining cutting constraints and positioning constraints for the pieces together with an optimization criterion; creating a tree comprising a root, leaves, each presenting a complete cutting plan enabling all of the pieces of the batch to be cut out, the cutting plan associated with a node of the tree being obtained by adding to the partial cutting plan associated with the parent node of the node, and in compliance with the constraints, the next piece for the frame determined in compliance with the sequence predetermined for the frame; and selecting a complete cutting plan associated with a leaf of the tree as a function of the optimization criterion.

METHOD AND DEVICE FOR OPTIMIZING A PLAN FOR CUTTING BY GUILLOTINE OF PIECES OF GLASS

A method determines an optimized cutting plan for using a guillotine to cut a batch of rectangular pieces of glass out from at least one sheet of glass. The method includes initializing including defining cutting constraints and positioning constraints for the pieces together with an optimization criterion; creating a tree comprising a root, leaves, each presenting a complete cutting plan enabling all of the pieces of the batch to be cut out, the cutting plan associated with a node of the tree being obtained by adding to the partial cutting plan associated with the parent node of the node, and in compliance with the constraints, the next piece for the frame determined in compliance with the sequence predetermined for the frame; and selecting a complete cutting plan associated with a leaf of the tree as a function of the optimization criterion.

METHOD FOR PRODUCING GLASS PLATE
20190225529 · 2019-07-25 ·

In a scribing operation, first through fourth auxiliary scribe lines are formed in a glass original sheet in addition to a main scribe line extending along a preset cutting line. A cutting operation includes a straight line portion cutting operation of cutting the glass original sheet along a first straight line portion of the main scribe line and the first and second auxiliary scribe lines, and cutting the glass original sheet along a second straight line portion of the main scribe line and the third and fourth auxiliary scribe lines, and a connection portion cutting operation of cutting the glass original sheet, which has been subjected to the straight line portion cutting operation, along a first connection portion of the main scribe line, and cutting the glass original sheet along a second connection portion of the main scribe line.

Method for dividing brittle substrate

A cutter edge is caused to slide to generate a plastic deformation on a first surface of a brittle substrate, thus forming a trench line. The trench line is formed so as to obtain a crack-free state in which the brittle substrate seamlessly continues in a direction intersecting the trench line directly below the trench line. The crack-free state is then maintained. A crack of the brittle substrate in its thickness direction is extended along the trench line to form a crack line. The brittle substrate is divided along the crack line.

Method for dividing brittle substrate

A cutter edge is caused to slide to generate a plastic deformation on a first surface of a brittle substrate, thus forming a trench line. The trench line is formed so as to obtain a crack-free state in which the brittle substrate seamlessly continues in a direction intersecting the trench line directly below the trench line. The crack-free state is then maintained. A crack of the brittle substrate in its thickness direction is extended along the trench line to form a crack line. The brittle substrate is divided along the crack line.

APPARATUS AND METHOD OF MANAGING MECHANICALLY INDUCED STRESS ON A CRACK TIP WHEN SEPARATING A FLEXIBLE GLASS RIBBON

A method of managing mechanical stress on a crack tip when separating a flexible glass ribbon includes directing the flexible glass ribbon to an edge trimming apparatus including a cutting device. The flexible glass ribbon includes a first broad surface and a second broad surface that extend laterally between a first edge and a second edge. The first edge of the flexible glass ribbon is separated as the flexible glass ribbon moves by the cutting device forming a continuous strip of edge trim connected to a central portion of the flexible glass ribbon at a crack tip. A width of a gap between the first edge and the central portion is detected using a gap measurement device. A signal is supplied to a controller indicative of the width of the gap. The width of the gap between the first edge and the central portion is adjusted based on the signal using a gap adjustment device.

APPARATUS AND METHOD OF MANAGING MECHANICALLY INDUCED STRESS ON A CRACK TIP WHEN SEPARATING A FLEXIBLE GLASS RIBBON

A method of managing mechanical stress on a crack tip when separating a flexible glass ribbon includes directing the flexible glass ribbon to an edge trimming apparatus including a cutting device. The flexible glass ribbon includes a first broad surface and a second broad surface that extend laterally between a first edge and a second edge. The first edge of the flexible glass ribbon is separated as the flexible glass ribbon moves by the cutting device forming a continuous strip of edge trim connected to a central portion of the flexible glass ribbon at a crack tip. A width of a gap between the first edge and the central portion is detected using a gap measurement device. A signal is supplied to a controller indicative of the width of the gap. The width of the gap between the first edge and the central portion is adjusted based on the signal using a gap adjustment device.

METHOD OF CUTTING GLASS USING A LASER

A method having steps of placing a glass sheet having a front surface, a reverse surface and a thickness onto a sacrificial substrate; directing a beam from a laser at the front surface and through the glass sheet; pulsing the beam at a frequency of between 10 kHz and 30 kHz, and at the sacrificial substrate; moving the beam across the glass sheet at a rate of between 30 millimeters per second and 90 millimeters per second; ablating the sacrificial substrate with the beam; generating a superheated vapor in response to the ablating of the sacrificial substrate; and ablating the reverse surface of the glass sheet with the superheated vapor, whereby the glass sheet is cut.

METHOD OF CUTTING GLASS USING A LASER

A method having steps of placing a glass sheet having a front surface, a reverse surface and a thickness onto a sacrificial substrate; directing a beam from a laser at the front surface and through the glass sheet; pulsing the beam at a frequency of between 10 kHz and 30 kHz, and at the sacrificial substrate; moving the beam across the glass sheet at a rate of between 30 millimeters per second and 90 millimeters per second; ablating the sacrificial substrate with the beam; generating a superheated vapor in response to the ablating of the sacrificial substrate; and ablating the reverse surface of the glass sheet with the superheated vapor, whereby the glass sheet is cut.

GLASS PLATE PROCESSING SYSTEM
20240190752 · 2024-06-13 ·

A glass plate processing system includes a first aligning means. When first and second glass plates different upper and lower surface areas are processed, the first aligning means aligns a first side edge extending in a front-rear direction on one side in a width direction of a first glass plate to be processed first with a first side edge extending in the front-rear direction on the one side in the width direction of a second glass plate to be processed later. The glass plate processing system causes the first aligning means to align the first side edge of the second glass plate at a position of the first side edge of the first glass plate to perform processing on the second glass plate. The glass plate processing system shortens a moving distance and arrival time for a processing device and shortens cycle time of processing.