Patent classifications
C03B33/093
Tempered glass cutting method and cutting apparatus
The present invention is devised to solve the problems of the above-described conventional technologies. The purpose of the present invention is to provide a tempered glass cutting method and cutting apparatus which can prevent the defects of the tempered glass breaking when same is cut and improve the reliability of the product. To this end, provided is a tempered glass cutting method which comprises: a tempering step of generating compressive stress on a glass sheet to temper the glass sheet; a compressive stress relaxation step of applying heat to the cut portion of the tempered glass sheet to relax the compressive stress; and a cutting step of cutting the cut portion.
DUAL-AIRY-BEAM SYSTEMS AND METHODS FOR PROCESSING GLASS SUBSTRATES
Systems and methods utilizing two Airy beams to process a non-rounded edge of a glass substrate or to cleave a glass substrate are disclosed. The method includes generating first and second Airy beams and causing them to cross at a crossing to define a curved intensity profile in the vicinity of the crossing point where the first and second Airy beams have respective local radii of curvature RA and RB. The method also includes scanning the curved intensity profile either along the non-rounded outer edge or through the glass along a scan path to form on the glass substrate a rounded outer edge having a radius of curvature RE that is smaller than the first and second local radii of curvature RA and RB. The radius of curvature RE can be adjusted by changing a beam angle between the first and second Airy beams.
METHOD FOR CUTTING A LAMINATED ULTRA-THIN GLASS LAYER
A method and a device for cutting a laminate including at least one glass layer with a thickness less than or equal to 0.3 mm and including at least one polymeric layer are disclosed. The method includes generating a surface scratch on a first surface of the glass layer, wherein the scratch, starting from a lateral edge, extends along a cutting line. The method further includes moving a first laser beam, starting from the scratch, across the first surface along the cutting line. The method also includes cooling the glass layer along the cutting line, wherein the glass layer breaks along the cutting line The polymeric layer is severed by moving a second laser beam along the cutting line. The device includes means for cutting the laminate according to the disclosed method.
Methods for laser cutting glass substrates
A method for cutting a glass article from a strengthened glass substrate having a surface compression layer and a tensile layer includes forming an edge defect in the surface compression layer on a first edge of the strengthened glass substrate. The method further includes propagating a through vent through the surface compression and tensile layers at the edge defect. The through vent precedes a region of separation along a cut line between the glass article and the strengthened glass substrate.