A brittle object cutting apparatus and the method thereof are disclosed. Wherein, the brittle object cutting apparatus comprises a first heating laser unit, a second heating laser unit, a scribing laser unit, two cooling units and a processing module. A heating laser from the heating laser units respectively located on opposite sides of a scribing laser from the scribing laser unit, and a coolant of the cooling unit followed behind the heating laser. In the moving process of the brittle object, the processing module controls the scribing laser for a scribing operation, and controls one of the heating lasers and the coolant form one of the cooling units to heat and cool the brittle object. As a result, the machining time of dicing the brittle objects may be effectively reduced.

Embodiments of the present method of laser cutting a laser wavelength transparent glass article comprises feeding at least one glass article to a pulsed laser assembly having at least one pulsed laser, wherein the pulsed laser defines a laser beam focal line with a length of 0.1-100 mm, the glass article being comprised of two end sections, and at least one lateral surface disposed lengthwise between the end sections. The method further comprises laser cutting at least one perforation line onto the lateral surface of the glass article while there is relative motion between the glass article and the pulsed laser and separating the glass article along the at least one perforation line to yield a laser cut glass article.

A cleaving assembly and a method for cleaving a glass body having a face at a desired angle greater than 0 degrees are disclosed. The assembly comprises a laser device for emitting a laser beam, a rotating device, and a positioning fixture. The rotating device has a head that rotates about a central axis that is orthogonal to the laser beam. The positioning fixture is operatively mounted to the head and centered axially along the central axis and is also rotatably driven by the rotating device. The positioning fixture has a tapered surface that is transverse to the central axis and that supports the glass body at a predetermined angle relative to the central axis. Rotation of the positioning fixture about the central axis when the glass body is exposed to the laser beam, cleaves the face of the glass body at the desired angle due to the glass body being supported transverse to the central axis.

A method for processing glass elements is provided. The method includes introducing a perforation line for parting a glass element introduced into the glass element during or after a hot processing process at an elevated temperature of at least 100 C. Spaced-apart filamentary flaws are introduced into the glass element along the predetermined course of the perforation line by a pulsed laser beam of an ultrashort pulse laser, and, during or after the introduction of the filamentary flaws, the glass element is cooled down so as to produce a temperature gradient, which induces a mechanical stress at the filamentary flaws, whereby the breaking force required for parting the glass element along the perforation line is reduced.