Patent classifications
C03B2215/07
Method of manufacturing a plurality of glass members, a method of manufacturing an optical member, and array of glass members in a glass substrate
A method of manufacturing a plurality of glass members comprises bringing a first main surface of a glass substrate in contact with a first working surface of a first mold substrate, the first working surface being provided with a plurality of first protruding portions, and bringing a second main surface of the glass substrate in contact with a second working surface of a second mold substrate, the second working surface being provided with a plurality of second protruding portions. The method further comprises controlling a temperature of the glass substrate to a temperature above a glass-transition temperature to form the plurality of glass members, removing the first and the second mold substrates from the glass substrate, and separating adjacent ones of the plurality of glass members.
METHOD FOR FABRICATING PIXELATED SCINTILLATORS
In a method of making pixelated scintillators, an amorphous scintillator material in a molten state is pressed into a plurality of cavities defined by a plurality of walls of a mesh array. The molten scintillator material in the plurality of cavities is cooled to form a pixelated scintillator array. An x-ray imager including a pixelated scintillator is also described.
Method for fabricating pixelated scintillators
In a method of making pixelated scintillators, an amorphous scintillator material in a molten state is pressed into a plurality of cavities defined by a plurality of walls of a mesh array. The molten scintillator material in the plurality of cavities is cooled to form a pixelated scintillator array. An x-ray imager including a pixelated scintillator is also described.
Glass Piece and Methods of Manufacturing Glass Pieces and Semiconductor Devices with Glass Pieces
A semiconductor element is formed in a mesa portion of a semiconductor substrate. A cavity is formed in a working surface of the semiconductor substrate. The semiconductor substrate is brought in contact with a glass piece made of a glass material and having a protrusion. The glass piece and the semiconductor substrate are arranged such that the protrusion extends into the cavity. The glass piece is bonded to the semiconductor substrate. The glass piece is in-situ bonded to the semiconductor substrate by pressing the glass piece against the semiconductor substrate. During the pressing a temperature of the glass piece exceeds a glass transition temperature and the temperature and a force exerted on the glass piece are controlled to fluidify the glass material and after re-solidifying the protrusion completely fills the cavity.
METHOD FOR MOULDING A GLASS ITEM, IN PARTICULAR A THREE-DIMENSIONALLY MOULDED PLANAR GLASS ITEM, AND DEVICE FOR CARRYING OUT THE METHOD, AND USE OF A METAL MELT FOR CARRYING OUT THE METHOD
The invention relates to a method for forming a glass item, in particular a three-dimensionally formed flat glass item, wherein the following steps are carried out: arranging a flat formation of glass, for example a flat glass pane of homogeneous thickness or a flat glass pane of inhomogeneous thickness or a preformed flat glass pane blank or liquid two-dimensionally spread glass, between a mould plunger and a melt of liquid metal, in particular tin; tempering of at least one part to be formed of the flat formation of glass to a forming temperature of the glass at which the glass has a viscosity in the range from 10 Pas to 106.5 Pas, preferably in the range from 10 Pas to 104 Pas and particularly preferably in the range from 10 Pas to 103 Pas; forming the flat formation of glass by moving the mould plunger and a surface of the molten metal towards each other, preferably by means of at least one linear movement, for example by means of a linear motor or servomotor, so that the flat formation of glass is pressurised either by the mould plunger on the one hand and by the molten metal on the other hand and is formed by the pressurisation on both sides and/or by suctioning and conforming the flat formation of glass onto the mould plunger; cooling the formed flat formation of glass to a handling temperature below the forming temperature at which the glass has a viscosity of ?107 Pas; and demoulding the cooled flat formation; as well as a device for carrying out the method and a use of a molten metal for carrying out the method.
Method of manufacturing semiconductor device with glass pieces
A source material, which is based on a glass, is arranged on a working surface of a mold substrate. The mold substrate is made of a single-crystalline material. A cavity is formed in the working surface. The source material is pressed against the mold substrate. During pressing a temperature of the source material and a force exerted on the source material are controlled to fluidify source material. The fluidified source material flows into the cavity. Re-solidified source material forms a glass piece with a protrusion extending into the cavity. After re-solidifying, the glass piece may be bonded to the mold substrate. On the glass piece, protrusions and cavities can be formed with slope angles less than 80 degrees, with different slope angles, with different depths and widths of 10 micrometers and more.
GLASS FORMING DEVICE AND METHOD
A tooling for forming a sheet of glass includes a forming die made of electrically conductive material and a heating unit, distant from the forming die. The forming die includes a molding surface, a support to hold a sheet of glass away from and opposite the molding surface, and an induction circuit having an inductor extending in a cavity in the forming die. The heating unit includes a surface configured to produce thermal radiation opposite the molding surface, and an induction circuit having an inductor extending in a cavity of the heating unit. A connector connects the induction circuits to a high-frequency current generator.
APPARATUS FOR FABRICATING MATERIALS
Provided is apparatus for fabricating materials, including: a first mold including a first forming unit pressing a first material, and a second forming mold arranged at a bottom surface of the first forming unit to have an opening exposing the first material and to form at least a part of the first material by being meshed at a part with the first forming unit; a second mold arranged at a bottom surface of the first mold to support a second material; and an interlocking mold including a fixing unit interposed between the first and second molds to fix the second material arranged at the second mold by pressing the second material, and an interlocking unit ascendably and descendibly coupled to the fixing unit to form the second material by pressing the second material in association with the forming of the first material.
Process to make textured glass
Systems and methods for texturing substrates (e.g., glass, metal, and the like) and the textured substrates produced using such systems and methods are disclosed. An exemplary system for texturing a substrate includes a first roller and a second roller. The first roller has a first textured surface. The first textured surface has a root mean square roughness between 40 to 1000 microns and an autocorrelation function greater than 0.5 for distances less than 50 microns.
METHOD FOR FABRICATING PIXELATED SCINTILLATORS
In a method of making pixelated scintillators, an amorphous scintillator material in a molten state is pressed into a plurality of cavities defined by a plurality of walls of a mesh array. The molten scintillator material in the plurality of cavities is cooled to form a pixelated scintillator array. An x-ray imager including a pixelated scintillator is also described.