A method for producing a glass article having high hydrolytic resistance is provided. A glass tube consisting of borosilicate glass and having an Al.sub.2O.sub.3 content of less than 1 weight-%, a ZrO.sub.2 content of 2-12 weight-%, and a glass transition temperature T.sub.g is reshaped into a glass article and is subsequently subjected to a thermal post-treatment. To reduce the alkali release of the glass article, the glass article is subjected to a treatment temperature of T.sub.B≥T.sub.g+5° K over a treatment time of t.sub.B≥5 min and is subsequently cooled during the thermal post-treatment.

A method for producing a glass article having high hydrolytic resistance is provided. A glass tube consisting of borosilicate glass and having an Al.sub.2O.sub.3 content of less than 1 weight-%, a ZrO.sub.2 content of 2-12 weight-%, and a glass transition temperature T.sub.g is reshaped into a glass article and is subsequently subjected to a thermal post-treatment. To reduce the alkali release of the glass article, the glass article is subjected to a treatment temperature of T.sub.B≥T.sub.g+5° K over a treatment time of t.sub.B≥5 min and is subsequently cooled during the thermal post-treatment.

A method for producing miniaturized electronic components is provided, where the miniaturized electronic components are obtained as singularized parts of a sheet-like glass which has structures applied thereon, in particular at least one layer. The method includes the steps of: providing a sheet-like glass toughened at least during a time period, as a substrate material; applying structures onto the substrate, in particular in the form of a sequence of coating processes and by processes for patterning of layers, so that at least portions of the substrate carry structures while other portions of the substrate remain free; subjecting the substrate carrying the structures to a thermal load; and singularizing so that the portions of the substrate carrying structures are obtained in singularized form. A miniaturized electronic component produced in this manner is also provided.

A method for producing miniaturized electronic components is provided, where the miniaturized electronic components are obtained as singularized parts of a sheet-like glass which has structures applied thereon, in particular at least one layer. The method includes the steps of: providing a sheet-like glass toughened at least during a time period, as a substrate material; applying structures onto the substrate, in particular in the form of a sequence of coating processes and by processes for patterning of layers, so that at least portions of the substrate carry structures while other portions of the substrate remain free; subjecting the substrate carrying the structures to a thermal load; and singularizing so that the portions of the substrate carrying structures are obtained in singularized form. A miniaturized electronic component produced in this manner is also provided.

A tempered glass of the present invention includes, as a glass composition, in terms of mass %, 45 to 75% of SiO.sub.2, 0 to 30% of Al.sub.2O.sub.3, and 0 to 30% of Li.sub.2O+Na.sub.2O+K.sub.2O and has a β-OH value of 0.3 to 1/mm.

A tempered glass of the present invention includes, as a glass composition, in terms of mass %, 45 to 75% of SiO.sub.2, 0 to 30% of Al.sub.2O.sub.3, and 0 to 30% of Li.sub.2O+Na.sub.2O+K.sub.2O and has a β-OH value of 0.3 to 1/mm.

The present invention provides a tempered glass sheet having a compressive stress layer in a surface thereof, the tempered glass sheet including as a glass composition, in terms of mol %, 50% to 80% of SiO.sub.2, 8% to 25% of Al.sub.2O.sub.3, 0% to 10% of B.sub.2O.sub.3, 3% to 15% of Li.sub.2O, 3% to 21% of Na.sub.2O, 0% to 10% of K.sub.2O, 0% to 10% of MgO, 0% to 10% of ZnO, and 0% to 15% of P.sub.2O.sub.5.

The present invention provides a tempered glass sheet having a compressive stress layer in a surface thereof, the tempered glass sheet including as a glass composition, in terms of mol %, 50% to 80% of SiO.sub.2, 8% to 25% of Al.sub.2O.sub.3, 0% to 10% of B.sub.2O.sub.3, 3% to 15% of Li.sub.2O, 3% to 21% of Na.sub.2O, 0% to 10% of K.sub.2O, 0% to 10% of MgO, 0% to 10% of ZnO, and 0% to 15% of P.sub.2O.sub.5.

The present invention relates to a float glass substrate including an alkali-free glass, the float glass substrate having a Cl content of from 0.10 to 0.50 mass %, containing substantially no SnO.sub.2, and having a Pt content of, by mass, from 0.001 to 0.30 ppm. The float glass substrate may have a Rh content of, by mass, from 0.001 to 0.50 ppm.

An alkali-free glass includes, in mol % in terms of oxides: SiO.sub.2: 63-75%; Al.sub.2O.sub.3:10-16%; B.sub.2O.sub.3: larger than 0.5% and 5% or smaller; MgO: 0.1-15%; CaO: 0.1-12%; SrO: 0-8%; and BaO: 0-6%. [MgO]/[CaO] is larger than 1.5. A value of Formula (A) is 82.5 or larger. A value of Formula (B) is 690 or larger and 800 or smaller. A value of Formula (C) is 100 or smaller. A value of Formula (D) is 20 or smaller. The alkali-free glass has a Young's modulus of 83 GPa or larger and a surface devitrification viscosity η.sub.c of 10.sup.4.2 dPa.Math.s or higher.