The present disclosure provides a glass substrate to which water repellency that is not lost by a heat treatment is imparted. Provided is a water-repellent-film-attached glass article including a glass substrate and a water-repellent film on the glass substrate. The water-repellent film includes cerium oxide, a contact angle of water on a surface of the water-repellent film is 75° or greater, and the contact angle is 75° or greater after the glass article is exposed to a thermal treatment at 760° C. for 4 minutes.

A coated glass article including a glass substrate and a coating deposited over the glass substrate. The coating includes a first inorganic metal oxide layer deposited over a major surface of the glass substrate. A second inorganic metal oxide layer is deposited over the first inorganic metal oxide layer. A third inorganic metal oxide layer is deposited over the second inorganic metal oxide layer. A fourth inorganic metal oxide layer is deposited over the third inorganic metal oxide layer. The coated glass article exhibits a total visible light transmittance (Illuminant C) of 40% or more and a visible light reflectance (Illuminant C) of 30% or more.

A coated glass article including a glass substrate and a coating deposited over the glass substrate. The coating includes a first inorganic metal oxide layer deposited over a major surface of the glass substrate. A second inorganic metal oxide layer is deposited over the first inorganic metal oxide layer. A third inorganic metal oxide layer is deposited over the second inorganic metal oxide layer. A fourth inorganic metal oxide layer is deposited over the third inorganic metal oxide layer. The coated glass article exhibits a total visible light transmittance (Illuminant C) of 40% or more and a visible light reflectance (Illuminant C) of 30% or more.

Provided are an oxide sintered compact whereby low carrier density and high carrier mobility are obtained when the oxide sintered compact is used to obtain an oxide semiconductor thin film by a sputtering method, and a sputtering target which uses the oxide sintered compact. This oxide sintered compact contains oxides of indium, gallium, and aluminum. The gallium content is from 0.15 to 0.49 by Ga/(In+Ga) atomic ratio, and the aluminum content is from 0.0001 to less than 0.25 by Al/(In+Ga+Al) atomic ratio. A crystalline oxide semiconductor thin film formed using this oxide sintered compact as a sputtering target is obtained at a carrier density of 4.0×10.sup.18 cm.sup.−3 or less and a carrier mobility of 10 cm.sup.−2V.sup.−1sec.sup.−1 or greater.

The present invention relates generally to a plasma source utilizing a macro-particle reduction coating and method of using a plasma source utilizing a macro-particle reduction for deposition of thin film coatings and modification of surfaces. More particularly, the present invention relates to a plasma source comprising one or more plasma-generating electrodes, wherein a macro-particle reduction coating is deposited on at least a portion of the plasma-generating surfaces of the one or more electrodes to shield the plasma-generating surfaces of the electrodes from erosion by the produced plasma and to resist the formation of particulate matter, thus enhancing the performance and extending the service life of the plasma source.

An apparatus is provided for coating deposition, particularly by chemical vapour deposition, on three-dimensional glass articles such as bottles. The apparatus lends itself to incorporation in a plant for a continuous production process for glass containers.

An apparatus is provided for coating deposition, particularly by chemical vapour deposition, on three-dimensional glass articles such as bottles. The apparatus lends itself to incorporation in a plant for a continuous production process for glass containers.

An article is described herein that includes: a substrate having a glass, glass-ceramic or a ceramic composition and comprising a primary surface; and a protective film disposed on the primary surface. The protective film comprises a thickness of greater than 1.5 microns and a maximum hardness of greater than 15 GPa at a depth of 500 nanometers, as measured on the film disposed on the substrate. Further, the protective film comprises a metal oxynitride that is graded such that an oxygen concentration in the film varies by 1.3 or more atomic %. In addition, the substrate comprises an elastic modulus less than an elastic modulus of the film.

An article is described herein that includes: a substrate having a glass, glass-ceramic or a ceramic composition and comprising a primary surface; and a protective film disposed on the primary surface. The protective film comprises a thickness of greater than 1.5 microns and a maximum hardness of greater than 15 GPa at a depth of 500 nanometers, as measured on the film disposed on the substrate. Further, the protective film comprises a metal oxynitride that is graded such that an oxygen concentration in the film varies by 1.3 or more atomic %. In addition, the substrate comprises an elastic modulus less than an elastic modulus of the film.

A method is disclosed, for removal of tin deposits from a glass substrate during a float glass manufacturing process. An acidic gas, such as hydrogen fluoride, is delivered to the substrate surface using chemical vapour deposition apparatus.