A nanoparticle coater includes a housing; a nanoparticle discharge slot; a first combustion slot; and a second combustion slot.

A nanoparticle coater includes a housing; a nanoparticle discharge slot; a first combustion slot; and a second combustion slot.

Deadfront articles that include a tactile element formed on a first surface of a substrate and a visual element disposed on a second surface of the substrate opposite the first surface. The tactile element is positioned on the first surface of the substrate in a complimentary fashion to the visual element disposed on the second surface of the substrate. The tactile element may include a surface roughness portion having a surface roughness different than the surface roughness of an area bordering the surface roughness portion. The deadfront articles may be incorporated into an automobile interior to provide a visual and haptic display interface for a user.

Deadfront articles that include a tactile element formed on a first surface of a substrate and a visual element disposed on a second surface of the substrate opposite the first surface. The tactile element is positioned on the first surface of the substrate in a complimentary fashion to the visual element disposed on the second surface of the substrate. The tactile element may include a surface roughness portion having a surface roughness different than the surface roughness of an area bordering the surface roughness portion. The deadfront articles may be incorporated into an automobile interior to provide a visual and haptic display interface for a user.

Provided is a Low-E glass plate protection method capable of preventing or inhibiting Low-E layer alteration. The protection method includes a step of applying a protective sheet to a surface of a Low-E glass plate having a Low-E layer comprising a zinc component. Here, the protective sheet has a PSA layer. The Low-E layer comprises a zinc component. The PSA layer includes ammonia and an acid or acid salt capable of forming a counterion to an ammonium ion.

A process for the manufacture of a heat strengthened glass substrate, includes the application of a temporary layer including a polymer on a glass substrate including a glass sheet, then the application to the glass substrate coated with the temporary layer of a treatment for the heat strengthening of the glass including heating, leading to the removal of the temporary layer, and then cooling by blowing of air through nozzles. The glass substrate thus obtained exhibits a reduced level of iridescences.

An electronic device may include electrical components and other components mounted within a housing. The device may have a display on a front face of the device and may have a glass layer that forms part of the housing on a rear face of the device. The glass layer and other glass structures in the electronic device may be provided with coatings. An interior coating on a glass layer may include multiple layers of material such as an adhesion promotion layer, thin-film layers of materials such as silicon, niobium oxide and other metal oxides, and metals to help adjust the appearance of the coating. A metal layer may be formed on top of the coating to serve as an environmental protection layer and opacity enhancement layer. In some configurations, the coating may include four layers.

An electronic device may include electrical components and other components mounted within a housing. The device may have a display on a front face of the device and may have a glass layer that forms part of the housing on a rear face of the device. The glass layer and other glass structures in the electronic device may be provided with coatings. An interior coating on a glass layer may include multiple layers of material such as an adhesion promotion layer, thin-film layers of materials such as silicon, niobium oxide and other metal oxides, and metals to help adjust the appearance of the coating. A metal layer may be formed on top of the coating to serve as an environmental protection layer and opacity enhancement layer. In some configurations, the coating may include four layers.

A method of fabricating a semiconductor device, which includes a separation step and has a high yield, is provided. A metal layer is formed over a substrate, fluorine is supplied to the metal layer, and the metal layer is then oxidized, whereby a metal compound layer is formed. A functional layer is formed over the metal compound layer, heat treatment is performed on the metal compound layer, and the functional layer is separated from the substrate with use of the metal compound layer. By performing first plasma treatment using a gas containing fluorine, fluorine can be supplied to the metal layer. By performing second plasma treatment using a gas containing oxygen, the metal layer supplied with fluorine can be oxidized.

A method of fabricating a semiconductor device, which includes a separation step and has a high yield, is provided. A metal layer is formed over a substrate, fluorine is supplied to the metal layer, and the metal layer is then oxidized, whereby a metal compound layer is formed. A functional layer is formed over the metal compound layer, heat treatment is performed on the metal compound layer, and the functional layer is separated from the substrate with use of the metal compound layer. By performing first plasma treatment using a gas containing fluorine, fluorine can be supplied to the metal layer. By performing second plasma treatment using a gas containing oxygen, the metal layer supplied with fluorine can be oxidized.