A synthetic quartz glass lid for use in optical device packages is prepared by furnishing a synthetic quartz glass lid precursor comprising a synthetic quartz glass substrate (1) and a metal or metal compound film (2), and forming a metal base adhesive layer (3) on the metal or metal compound film (2). The metal or metal compound film contains Ag, Bi, and at least one element selected from P, Sb, Sn and In.

A through electrode substrate includes a substrate having a through hole extending through between a first face and a second face, a diameter of the through hole not having a minimum value inside the through hole; and a conductor arranged inside the through hole, wherein the through hole has a shape having a value obtained by summing a first to an eighth inclination angle at a first to an eighth position, respectively, of an inner face of the through hole of 8.0 or more, each of the first to the eighth inclination angle is an angle of the inner face with respect to a center axis of the through hole, and the first to the eighth position correspond to positions at distances of 6.25%, 18.75%, 31.25%, 43.75%, 56.25%, 68.75%, 81.25%, and 93.75%, respectively, from the first face in a section from the first face to the second face.

A through electrode substrate includes a substrate having a through hole extending through between a first face and a second face, a diameter of the through hole not having a minimum value inside the through hole; and a conductor arranged inside the through hole, wherein the through hole has a shape having a value obtained by summing a first to an eighth inclination angle at a first to an eighth position, respectively, of an inner face of the through hole of 8.0 or more, each of the first to the eighth inclination angle is an angle of the inner face with respect to a center axis of the through hole, and the first to the eighth position correspond to positions at distances of 6.25%, 18.75%, 31.25%, 43.75%, 56.25%, 68.75%, 81.25%, and 93.75%, respectively, from the first face in a section from the first face to the second face.

A glass article including a spatial location encoding layer for use in a digital inking system, an associated electronic device, a method of making and a digital inking system are provided. The glass article utilizes a plurality of light converting regions disposed on the surface of the glass in a pattern encoding spatial location. The plurality of light converting regions are formed from an inorganic, environmentally stable material, such as alternating stacks of III-V compound materials.

A glass article including a spatial location encoding layer for use in a digital inking system, an associated electronic device, a method of making and a digital inking system are provided. The glass article utilizes a plurality of light converting regions disposed on the surface of the glass in a pattern encoding spatial location. The plurality of light converting regions are formed from an inorganic, environmentally stable material, such as alternating stacks of III-V compound materials.

Disclosed herein are nanostructured plasmonic materials. The nanostructured plasmonic materials can include a first nanostructured layer comprising: a first layer of a first plasmonic material permeated by a first plurality of spaced-apart holes, wherein the first plurality of spaced apart holes comprise a first array; and a second nanostructured layer comprising a second layer of a second plasmonic material permeated by a second plurality of spaced-apart holes, wherein the second plurality of spaced apart holes comprise a second array; wherein the second nanostructured layer is located proximate the first nanostructured layer; and wherein the first principle axis of the first array is rotated at a rotation angle compared to the first principle axis of the second array.

According to various embodiments, an article including a glass or glass-ceramic substrate having a first major surface and a second major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length, L, the via defining a first axial portion, a third axial portion, and a second axial portion disposed between the first and third axial portions. The article further includes a helium hermetic adhesion layer disposed on the interior surface in the first and/or third axial portions and a metal connector disposed within the via, the metal connector being adhered to the helium hermetic adhesion layer. The metal connector fully fills the via over the axial length, L, the via has a maximum diameter, .sub.max, of less than or equal to 30 m, and the axial length, L, and the maximum diameter, .sub.max, satisfy an equation:

[00001]$\frac{L}{\sqrt{{}_{\max }}}>20.Math..Math.{\mathrm{micron}}^{1/2}.$

The present disclosure provides a composite conductive substrate exhibiting enhanced properties both in the folding endurance and the electric conductivity and a method of manufacturing the composite conductive substrate. A composite conductive substrate according to an exemplary embodiment of the present disclosure includes: an insulating layer; a metal nanowire structure embedded beneath one surface of the insulating layer; and a metal thin film coupled to the metal nanowire structure. The composite conductive substrate may be fabricated in an order of the insulating film, the metal nanowire structure, and the metal thin film, or vice versa.

The present disclosure provides a composite conductive substrate exhibiting enhanced properties both in the folding endurance and the electric conductivity and a method of manufacturing the composite conductive substrate. A composite conductive substrate according to an exemplary embodiment of the present disclosure includes: an insulating layer; a metal nanowire structure embedded beneath one surface of the insulating layer; and a metal thin film coupled to the metal nanowire structure. The composite conductive substrate may be fabricated in an order of the insulating film, the metal nanowire structure, and the metal thin film, or vice versa.

The present invention includes a method of creating electrical air gap or other low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.