The invention is directed at sputter targets including 50 atomic % or more molybdenum, a second metal element of titanium, and a third metal element of chromium or tantalum, and deposited films prepared by the sputter targets. In a preferred aspect of the invention, the sputter target includes a phase that is rich in molybdenum, a phase that is rich in titanium, and a phase that is rich in the third metal element.

The invention is directed at sputter targets including 50 atomic % or more molybdenum, a second metal element of titanium, and a third metal element of chromium or tantalum, and deposited films prepared by the sputter targets. In a preferred aspect of the invention, the sputter target includes a phase that is rich in molybdenum, a phase that is rich in titanium, and a phase that is rich in the third metal element.

A method for bonding a conductive metal to an oxide substrate includes applying a porous coating to a surface of the oxide substrate, the porous coating including a porous oxide and catalyst nanoparticles dispersed therein, and depositing a conductive metal onto the porous coating. A portion of the conductive metal may be deposited within the pores of the porous coating to couple the conductive metal to the porous coating. Articles are also disclosed that include the oxide substrate, the porous coating coupled to a surface of the oxide substrate, and the conductive metal coupled to the porous coating. The porous coating may include a porous oxide and catalyst nanoparticles dispersed within the metal oxide. A portion of the conductive metal may be deposited within the pores of the porous coating to interlock the conductive metal to the porous coating.

The present invention includes a method of creating high Q empty substrate integrated waveguide devices and/or system with low loss, mechanically and thermally stabilized in photodefinable glass ceramic substrate. The photodefinable glass ceramic process enables high performance, high quality, and/or low-cost structures. Compact low loss RF empty substrate integrated waveguide devices are a cornerstone technological requirement for RF systems, in particular, for portable systems.

Provided is a glass sheet (1) with a film, including a laminated film (2), which includes a plurality of films laminated together, formed on a glass sheet (3). The laminated film (2) includes: an inorganic material film (4), which contains at least a noble metal, formed on the glass sheet (3); a plated metal film (5) formed on the inorganic material film; and a metal film (6) formed on the plated metal film (5). The laminated film (2) is black when viewed from a glass sheet (3) side.

Provided is a glass sheet (1) with a film, including a laminated film (2), which includes a plurality of films laminated together, formed on a glass sheet (3). The laminated film (2) includes: an inorganic material film (4), which contains at least a noble metal, formed on the glass sheet (3); a plated metal film (5) formed on the inorganic material film; and a metal film (6) formed on the plated metal film (5). The laminated film (2) is black when viewed from a glass sheet (3) side.

The invention is directed at sputter targets including 50 atomic % or more molybdenum, a second metal element of titanium, and a third metal element of chromium or tantalum, and deposited films prepared by the sputter targets. In a preferred aspect of the invention, the sputter target includes a phase that is rich in molybdenum, a phase that is rich in titanium, and a phase that is rich in the third metal element.

The invention is directed at sputter targets including 50 atomic % or more molybdenum, a second metal element of titanium, and a third metal element of chromium or tantalum, and deposited films prepared by the sputter targets. In a preferred aspect of the invention, the sputter target includes a phase that is rich in molybdenum, a phase that is rich in titanium, and a phase that is rich in the third metal element.

In order to reduce the degree of relaxation after an optical substrate has been compacted, in particular after a longer period, substrates (51) or reflective optical elements (50), in particular for EUV lithography, with substrates (51) of this type, are proposed. These substrates (51), which have a surface region (511) with a reflective coating (54), are characterised in that, at least near to the surface region (511), the titanium-doped quartz glass has a proportion of SiOOSi bonds of at least 1*10.sup.16/cm.sup.3 and/or a proportion of SiSi bonds of at least 1*10.sup.16/cm.sup.3 or, along a notional line (513) perpendicular to the surface region (511), over a length (517) of 500 nm or more, a hydrogen content of more than 5?10.sup.18 molecules/cm.sup.3.

A through electrode substrate includes a substrate having a through hole extending through between a first face and a second face, a diameter of the through hole not having a minimum value inside the through hole; and a conductor arranged inside the through hole, wherein the through hole has a shape having a value obtained by summing a first to an eighth inclination angle at a first to an eighth position, respectively, of an inner face of the through hole of 8.0? or more, each of the first to the eighth inclination angle is an angle of the inner face with respect to a center axis of the through hole, and the first to the eighth position correspond to positions at distances of 6.25%, 18.75%, 31.25%, 43.75%, 56.25%, 68.75%, 81.25%, and 93.75%, respectively, from the first face in a section from the first face to the second face.