A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((.sub.tensile stress location)/(.sub.interface laser weld))<<1 or <1 and .sub.interface laser weld>10 MPa or >1 MPa where .sub.tensile stress location is the stress present in the first substrate and .sub.interface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.

Methods are provided for forming high temperature coating over ceramic components, such as ceramic turbomachine components. In various embodiments, the method includes the step or process of at least partially filling a reactor vessel with a reaction solution containing a solution-borne rare earth cation source. A silicon-containing surface region of a ceramic component is submerged in the reaction solution, and a solvothermal growth process is carried-out. During the solvothermal growth process, the reaction solution is subject to elevated temperature and pressure conditions within the reactor vessel in the presence of a silicate anion source, which reacts with the solution-borne rare earth cation source to grow a rare earth silicate layer over the silicon-containing surface region of the ceramic component.

An apparatus including a first substrate, a second substrate, an inorganic film provided between the first substrate and the second substrate and in contact with both the first substrate and the second substrate, a laser welded zone formed between the first and second substrate by the inorganic film, where the laser welded zone has a heat affected zone (HAZ), where the HAZ is defined as a region in which .sub.HAZ is at least 1 MPa higher than average stress in the first substrate and the second substrate, wherein .sub.HAZ is compressive stress in the HAZ, and wherein the laser welded zone is characterized by its .sub.interface laser weld>.sub.HAZ, wherein .sub.interface laser weld is peak value of compressive stress in the laser welded zone.

A stress-engineered frangible structure includes multiple discrete glass members interconnected by inter-structure bonds to form a complex structural shape. Each glass member includes strengthened (i.e., by way of stress-engineering) glass material portions that are configured to transmit propagating fracture forces throughout the glass member. Each inter-structure bond includes a bonding member (e.g., glass-frit or adhesive) connected to weaker (e.g., untreated, unstrengthened, etched, or thinner) glass member region(s) disposed on one or both interconnected glass members that function to reliably transfer propagating fracture forces from one glass member to other glass member. An optional trigger mechanism generates an initial fracture force in a first (most-upstream) glass member, and the resulting propagating fracture forces are transferred by way of inter-structure bonds to all downstream glass members. One-way crack propagation is achieved by providing a weaker member region only on the downstream side of each inter-structure bond.

A method of manufacturing a bonded body in which a first body and a second body are bonded using a glass paste. The glass paste includes a crystallized glass frit (A) and a solvent (B). A remelting temperature of the crystallized glass frit (A) is higher than a crystallization temperature thereof which is higher than a glass transition temperature thereof. The method includes: applying the glass paste on at least one of the first and second bodies, bonding the first and second bodies by interposing the glass paste therebetween, heating the bonded first and second bodies to a temperature that is not lower than the crystallization temperature and lower than the remelting temperature of the crystallized glass frit (A), and obtaining the bonded body by cooling the bonded first and second bodies to a temperature that is not higher than the glass transition temperature of the crystallized glass frit.

The disclosure relates to a bond produced with an at least partially crystallized glass, such as a metal-to-glass bond, in particular a metal-to-glass bond in a feed-through element or connecting element, and to a method for producing such a bond, in particular in a feed-through element or connecting element. The at least partially crystallized glass includes at least one crystal phase and pores which are distributed in the at least partially crystallized glass in a structured manner.

A stress-engineered frangible structure includes multiple discrete glass members interconnected by inter-structure bonds to form a complex structural shape. Each glass member includes strengthened (i.e., by way of stress-engineering) glass material portions that are configured to transmit propagating fracture forces throughout the glass member. Each inter-structure bond includes a bonding member (e.g., glass-frit or adhesive) connected to weaker (e.g., untreated, unstrengthened, etched, or thinner) glass member region(s) disposed on one or both interconnected glass members that function to reliably transfer propagating fracture forces from one glass member to other glass member. An optional trigger mechanism generates an initial fracture force in a first (most-upstream) glass member, and the resulting propagating fracture forces are transferred by way of inter-structure bonds to all downstream glass members. One-way crack propagation is achieved by providing a weaker member region only on the downstream side of each inter-structure bond.

An integrated dental porcelain system for making dental prostheses and restorations is provided. The system includes three universal major components: a) opaque porcelain composition; b) pressable dentin ingot; and c) veneering porcelain composition that can be used interchangeably for making restorations. Techniques for making the prostheses and restorations include porcelain fused-to-metal (PFM), press-to-metal (PTM), and either pressed and/or machined all-ceramic methods. The system uses both a hand-layering of veneering porcelain (PFM technique) and a hot-pressing process (PTM and all-ceramic technique) to fabricate the prostheses and restorations.

A cover for a light emitter having one or more light emitting devices includes a glass plate, a frame made of metal having an opening smaller than the glass plate, and a low melting glass having a lower melting point than the glass plate, the glass plate being sealed to the frame with the low melting glass to close the opening, wherein the frame has an encircling step, and the encircling step includes a placement face situated at a recessed position relative to an upper surface of the frame and a wall face, wherein the wall face includes first wall faces situated at opposite ends of each inner side of the encircling step and a second wall face situated between the first wall faces, and the second wall face includes a face extending at a smaller inclination angle than the first wall faces with respect to the placement face.

A cover for a light emitter having one or more light emitting devices includes a glass plate, a frame made of metal having an opening smaller than the glass plate, and a low melting glass having a lower melting point than the glass plate, the glass plate being sealed to the frame with the low melting glass to close the opening, wherein the frame has an encircling step, and the encircling step includes a placement face situated at a recessed position relative to an upper surface of the frame and a wall face, wherein the wall face includes first wall faces situated at opposite ends of each inner side of the encircling step and a second wall face situated between the first wall faces, and the second wall face includes a face extending at a smaller inclination angle than the first wall faces with respect to the placement face.