Patent classifications
C03C27/046
Vehicle window glass with electrical connector soldered by lead-free solder
A vehicle window glass comprises a glass substrate layer, an electrically conductive layer forming a conductive pattern over the glass substrate, a lead-free solder layer on the conductive layer and a metal plate element of an electrical connector on the solder layer. Optionally a coloured ceramic band layer is sintered between the glass substrate layer and the conductive layer. The thickness of the metal plate element is between 0.5 mm and 0.7 mm.
Machine arrangement
A machine arrangement, comprising at least one carrier, wherein a glass fiber is connected with the machine arrangement. To allow a proper measurement of stresses even at curved surfaces of the machine arrangement, as it is typical in the case of a carrier being attached to bearing rings, the connection between the glass fiber and the machine arrangement is established by a metallic material which metal material is connected by material bonding with the machine arrangement as well as with the glass fiber.
VEHICLE WINDOW GLASS WITH ELECTRICAL CONNECTOR SOLDERED BY LEAD-FREE SOLDER
A vehicle window glass comprises a glass substrate layer, an electrically conductive layer forming a conductive pattern over the glass substrate, a lead-free solder layer on the conductive layer and a metal plate element of an electrical connector on the solder layer. Optionally a colored ceramic band layer is sintered between the glass substrate layer and the conductive layer. The thickness of the metal plate element is between 0.5 mm and 0.7 mm.5
LEAD-FREE SOLDER COMPOSITION
A solder composition includes about 20% to about 25% by weight tin, about 0.03% to about 3% by weight nickel, about 66% to about 75% by weight indium, and about 0.5% to about 2% by weight silver. The solder composition can further include about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.2% to about 6% by weight zinc, and/or about 0.01% to about 0.3% by weight germanium. The solder composition can be used to solder an electrical connector to an electrical contact surface on a glass component.
Glazing with a soldered connector
A glazing is disclosed comprising at least one ply of glass having an electrically conductive component on at least one surface, and an electrical connector electrically connected to the electrically conductive component through a soldered joint, the solder of the joint having a composition comprising 0.5 wt % or more indium, wherein the electrical connector comprises a nickel plated contact for contacting the solder. Also disclosed are solders having a composition comprising 14 to 75 wt % In, 14 to 75 wt % Sn, to 5 wt % Ag, to 5 wt % Ni, and less than 0.1 wt % Pb. Also disclosed is use of a solder having a composition comprising 0.5 wt % or more indium to solder a nickel plated electrical connector to an electrically conductive component on the surface of a ply of glass. The aspects of the invention improve the durability of electrical connections on glazing.
Machine arrangement
A machine arrangement, including at least one bearing ring, wherein a glass fiber is connected with the machine arrangement. To allow a proper measurement of stresses even at curved surfaces of the machine arrangement as it is typical in the case of bearing rings, the connection between the glass fiber and the machine arrangement is established by a metallic material which metal material is connected by material bonding with the machine arrangement as well as with the glass fiber.
Continuous and fully-automatic energy-saving production line and method for vacuum glass
A continuous and fully-automatic energy-saving production line and method for vacuum glass are provided. The production line includes conveying roller tables that run through the entire production line, and includes a feeding platform, a low-vacuum pumping chamber, a high-vacuum pumping chamber, a main processing chamber, a high-vacuum automatic cooling chamber, a first-stage boosting and automatic cooling chamber, and a second-stage boosting and automatic cooling chamber in sequence. The main processing chamber is integrally welded, and cylindrical in shape, with two sides respectively provided with inspection holes; the low-vacuum pumping chamber and the high-vacuum pumping chamber are connected to form a degassing section; the high-vacuum automatic cooling chamber, the first-stage boosting and automatic cooling chamber, and the second-stage boosting and automatic cooling chamber form a cooling section; and the degassing section and the cooling section are respectively connected to two ends of the main processing chamber through sealing doors.