A glazing includes a glass substrate on which is deposited a coating including at least one layer, the layer being formed from a material including metal nanoparticles dispersed in an inorganic matrix of an oxide, in which the metal nanoparticles are made of a metal chosen from the group formed by silver, gold, platinum, copper and nickel or of an alloy formed from at least two of these metals, in which the matrix including an oxide of at least one element chosen from the group of titanium, silicon and zirconium and in which the atomic ratio M/Me in the material is less than 1.5, M representing all atoms of the elements of the group of titanium, silicon and zirconium present in the layer and Me representing all of the atoms of the metals of the group formed by silver, gold, platinum, copper and nickel present in the layer.

An antiskid and wear-resistant glaze, an antiskid, wear-resistant and easy-to-clean ceramic tile and a preparation method thereof, relating to the technical field of building ceramics, are provided. This antiskid and wear-resistant glaze is prepared by antiskid and wear-resistant particles, a printing paste and sodium tripolyphosphate. This antiskid, wear-resistant and easy-to-clean ceramic tile comprises, from the bottom up, a green body layer, an overglaze layer, a decoration layer, an antiskid and wear-resistant layer and an easy-to-clean protection layer provided in turn, wherein the antiskid and wear-resistant layer is mainly prepared by antiskid and wear-resistant particles, and the easy-to-clean protection layer is mainly prepared by easy-to-clean protection particles.

A coated glazing includes a transparent glass substrate and a coating located on the glass substrate. The coating is provided with at least the following layers in sequence starting from the glass substrate: a first layer having a refractive index of more than 1.6, an optional second layer having a refractive index that is less than the refractive index of the first layer, a third layer based on tin dioxide, a fourth layer based on an oxide of silicon, and a fifth layer based on titanium dioxide, wherein the fifth layer is photocatalytic.

An antireflection structure comprising a transparent substrate having a plurality of holes with U-shaped or V-shaped cross-sectional shapes perpendicular to a flat surface portion and a metal oxide film disposed on the surface portion of the transparent substrate and in the space portions formed in an upward direction from the bottom portions of holes in the transparent substrate, wherein the average diameter of the openings of the holes is 50 nm to 300 nm, the average distance between the center points of openings of the adjacent holes is 100 nm to 400 nm, and the depth of each hole from the surface portion of the substrate is 80 nm to 250 nm; and the thickness of the metal oxide film disposed in each of the space portions increases as the depth of each of the holes becomes larger, thereby reducing the difference in depth between the holes from the uppermost surface portion of the metal oxide film disposed on the surface portion to the surface portions of the metal oxide films in the space portions.

The present disclosure relates to products and methods for modifying the reflection of a light source in a fireplace and other products.

A material includes a transparent substrate coated with a stack of thin layers acting on infrared radiation including at least one functional layer. The stack includes a carbon-based upper protective layer within which the carbon atoms are essentially in an sp.sup.2 hybridization state and the upper protective layer is deposited above at least a part of the functional layer and exhibits a thickness of less than 1 nm.

Provided are methods of forming stacks comprising a substrate and one or more sol-gel layers disposed on the substrate. Also provided are stacks formed by these methods. The sol-gel layers in these stacks, especially outer layers, may have a porosity of less than 1% or even less than 0.5%. In some embodiments, these layers may have a surface roughness (R.sub.a) of less than 1 nanometers. The sol-gel layers may be formed using radiative curing and/or thermal curing at temperatures of between 400° C. and 700° C. or higher. These temperatures allow application of sol-gel layers on new types of substrates. A sol-gel solution, used to form these layers, may have colloidal nanoparticles with a size of less than 20 Angstroms on average. This small size and narrow size distribution is believed to control the porosity of the resulting sol-gel layers.

A material includes a transparent substrate coated with a stack of thin layers acting on infrared radiation including at least one functional layer. The stack includes a protective coating deposited above at least a part of the functional layer. The protective coating includes at least one lower protective layer based on titanium and zirconium, these two metals being in the metal, oxidized or nitrided form, and at least one upper protective layer of carbon, within which layer the carbon atoms are essentially in an sp.sup.2 hybridization state, located above the layer based on titanium and zirconium.

A glazing includes a transparent substrate coated with a stack of thin layers including at least one functional metal layer and at least two antireflective coatings, each antireflective coating including at least one dielectric layer, so that each functional metal layer is positioned between two antireflective coatings. The stack includes at least one silver-based functional metal layer including at least 95.0% by weight of silver, with respect to the weight of the functional layer, and from 0.5 to 3.5% by weight of zinc, with respect to the weight of zinc and silver in the functional layer.

A material includes a transparent substrate coated with a stack of thin layers including at least one silver-based functional metal layer. The stack includes a dielectric layer based on silicon and/or aluminum nitride located above a silver-based functional metal layer and an upper protective layer based on zirconium titanium oxide located above the dielectric layer based on silicon and/or aluminum nitride and exhibiting a ratio by weight of titanium to zirconium Ti/Zr of between 60/40 and 90/10.