A method for forming a nickel oxide layer is disclosed herein. In some embodiments, a method includes depositing a nickel oxide precursor ink on a substrate, wherein the nickel oxide precursor ink comprises a solvent comprising diols, alcohol amines, and water, Ni(NO.sub.3).sub.2.Math.6H.sub.2O, and at least one metal acetate selected from the group consisting of Ni(CH.sub.3CO.sub.2).sub.2.Math.4H.sub.2O and Cu(CH.sub.3CO.sub.2).sub.2.Math.1H.sub.2O, annealing the nickel oxide precursor ink at a temperature between 250? to 400? Celsius for between 10 minutes and 6 hours to form a nickel oxide layer, and cooling the nickel oxide layer.

The invention relates to a glass substrate for chemical strengthening where a surface is coated by magnetron sputtering with a temporary thin film that reduces the extent of ion exchange upon chemical strengthening and where the temporary thin film can be removed after the chemical strengthening by treatment with an etchant solution. Other embodiments relate to a method for making a chemically strengthened glass substrate with controlled curvature comprising: providing a substrate with opposed surfaces that are durable to a given etchant solution, forming a temporary thin film upon at least part of a surface of the glass substrate, chemically strengthening the glass substrate bearing the temporary thin film, and removing the temporary thin film after said chemical strengthening with said etchant solution. The thickness of the temporary thin film is chosen such that a controlled curvature is obtained upon chemical strengthening.

A method for preparing a nickel oxide precursor ink comprising: preparing a solvent comprising diols and alcohol amines; adding nickel nitrate into the solvent to form a nickel nitrate containing solution; adding at least one metal acetate into the nickel nitrate containing solution to form a nickel nitrate and metal acetate containing solution; adding water to the nickel nitrate and metal acetate containing solution to form a nickel oxide precursor mixture; heating the nickel oxide precursor mixture to 60 to 75 Celsius; and cooling the nickel oxide precursor mixture to form the nickel oxide precursor ink.

A process for obtaining a material including a transparent substrate coated with a stack of thin layers which are deposited by cathode sputtering, optionally assisted by a magnetic field, including at least one silver-based functional metal layer and at least two antireflective coatings, each antireflective coating including at least one dielectric layer, so that each functional metal layer is positioned between two antireflective coatings, the process includes the sequence of following stages: (a) an antireflective coating including at least one thin layer based on crystalline nickel oxide is deposited, then (b) at least one silver-based functional metal layer is deposited above and in contact with the thin layer based on crystalline nickel oxide.

A method of making colored glass in a float glass process includes the steps of: melting glass batch materials in a furnace to form a glass melt; transporting the glass melt into a float glass chamber having a flame spray device, the glass melt forming a float glass ribbon; supplying at least one coating material to the flame spray device to form a spray having coating particles; and directing the spray onto the float glass ribbon to diffuse the particles into the surface of the float glass ribbon to form a glass sheet of a desired color.

A chemical vapor deposition process is provided for forming a layer based on nickel oxide over a glass substrate. A gaseous mixture is formed and includes a nickel-containing compound selected from the group consisting of nickel(II) acetylacetonate and derivatives thereof, and an oxygen-containing precursor selected from the group consisting of a carbonyl compound and molecular oxygen. The gaseous mixture is directed toward and along the glass substrate, and is reacted over the glass substrate to form a nickel oxide coating thereon.

The present invention provides scalable, solution based processes for manufacturing electrochromic materials comprising metal oxide films for use in electrochromic devices. The electrochromic material comprises a transparent conductive substrate coated with an electrochromic metal oxide film, wherein the metal oxide film is formed by a process comprising the steps of: a) providing the conductive substrate; b) coating the substrate with a solution of one or more metal precursors; and c) exposing the coated substrate to near-infrared radiation, UV radiation and/or ozone in an aerobic atmosphere. The present invention also provides electrochromic devices incorporating these electrochromic materials.

The disclosure belongs to a field of a micro-nano processing technology, and more specifically, relates to a method and application of isotropic shrinkage of a three-dimensional micro-nanostructure. In the disclosure, the high polymer film is prepared by mixing the high polymer material and the solvent, and then spin-coating it on a surface of a substrate. Then, the high polymer film is etched to expose a portion of the surface of the substrate, and a raw material of a three-dimensional structure is processed into a target three-dimensional structure with an etched area as an initial processing position. Then, the target three-dimensional structure is subjected to a stiffness strengthening treatment, immersed in a solvent, and pyrolyzed and calcined to obtain an isotropically shrunk three-dimensional micro-nanostructure.

The disclosure belongs to a field of a micro-nano processing technology, and more specifically, relates to a method and application of isotropic shrinkage of a three-dimensional micro-nanostructure. In the disclosure, the high polymer film is prepared by mixing the high polymer material and the solvent, and then spin-coating it on a surface of a substrate. Then, the high polymer film is etched to expose a portion of the surface of the substrate, and a raw material of a three-dimensional structure is processed into a target three-dimensional structure with an etched area as an initial processing position. Then, the target three-dimensional structure is subjected to a stiffness strengthening treatment, immersed in a solvent, and pyrolyzed and calcined to obtain an isotropically shrunk three-dimensional micro-nanostructure.