The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

Methods of metalizing vias are disclosed. A method of metalizing at least one via includes contacting a substrate with a sacrificial metal sheet. The substrate includes a first surface, a second surface, and the at least one via extending between the first surface and the second surface and the first surface or the second surface of the substrate contacts a surface of the sacrificial metal sheet. The method further includes applying a solution comprising metal ions to the substrate and the sacrificial metal sheet such that a Galvanic displacement reaction occurs between the sacrificial metal sheet and the metal ions in the solution until the metal ions form a metal coating on at least one surface of the at least one via.

A single glass panel for a fire door and a double glazed glass panel for a fire door that have a fireproofness with which the glass sheet passes an international standard ISO 0834 flame insulating performance test and are as inexpensive as possible. For example, the single glass panel for a fire door is obtained by forming a heat reflecting coating with a low emissivity on at least one surface of a glass sheet that is a heat strengthened glass sheet or is more thermally strengthened than a heat strengthened glass sheet, and the double glazed glass panel for a fire door includes a first glass sheet (2B) obtained by forming a heat reflecting coating (4) with an emissivity of 0.07 or less on at least one surface of a glass sheet that is a heat strengthened glass sheet or is more thermally strengthened than a heat strengthened glass sheet and a second glass sheet (2C) that is a heat strengthened glass sheet or is a glass sheet more thermally strengthened than a heat strengthened glass sheet, the first glass sheet (2B) and the second glass sheet (2C) being arranged to face each other with a gap therebetween such that at least one layer of said heat reflecting coating (4) is placed between the two glass sheets (2B) and (2C).

Articles comprise a substrate and a conductive film disposed on a surface of the substrate. The conductive film comprises a volume resistivity in a range from about 0.01 Ohm-centimeters to about 10-3 Ohm-centimeters. The conductive film comprises a pencil hardness of about 8H or more. The conductive film comprises a scratch resistance of about 3 Newtons or more. Methods of forming articles comprise disposing a conductive ink on a surface of the substrate. Methods comprise heating the conductive ink at a first temperature from about 100 C. to about 250 C. for a first period of time to form a conductive film. The conductive ink comprises a conductive filler, a reactive, silane-containing binder, and a solvent.