Herein are disclosed wall repair compounds comprising at least one or more polymeric binder latex emulsions, one or more inorganic fillers, and comprising an amount of organic polymeric thickener that is less than about 0.1 percent by weight based on the total weight of the wall repair compound. In certain embodiments, the wall repair compound comprises an inorganic filler system selected such that such that synthetic inorganic fillers comprise essentially 100 percent of the inorganic filler used. In certain embodiments, the wall repair compound comprises one or more glycol ether smoothing agents.

Herein are disclosed wall repair compounds comprising at least one or more polymeric binder latex emulsions, one or more inorganic fillers, and comprising an amount of organic polymeric thickener that is less than about 0.1 percent by weight based on the total weight of the wall repair compound. In certain embodiments, the wall repair compound comprises an inorganic filler system selected such that such that synthetic inorganic fillers comprise essentially 100 percent of the inorganic filler used. In certain embodiments, the wall repair compound comprises one or more glycol ether smoothing agents.

Disclosed herein are synthetic microparticles substantially free of monovalent and divalent metal elements and a method of forming such synthetic microparticles. The synthetic microparticle may be suitable for use as a density modifying filler. The synthetic microsphere can be made from an agglomerate precursor that includes an aluminosilicate material, such as fly ash, a blowing agent such as sugar, carbon black, and silicon carbide, and a binding agent. The synthetic microsphere is produced when the precursor is fired at a pre-determined temperature profile so as to form either solid or hollow synthetic microspheres depending on the processing conditions and/or components used. The synthetic microparticle is capable of being formed into a large range of predetermined shapes.