Patent classifications
C04B35/057
Dielectric thin film, integrated device including the same, and method of manufacturing the dielectric thin film
Provided are a dielectric thin film, an integrated device including the same, and a method of manufacturing the dielectric thin film. The dielectric thin film includes an oxide having a perovskite-type crystal structure represented by Formula 1 below and wherein the dielectric thin film comprises 0.3 at % or less of halogen ions or sulfur ions.
A.sub.2-xB.sub.3-yO.sub.10-z <Formula 1> In Formula 1, A, B, x, y, and z are disclosed in the specification.
Dielectric thin film, integrated device including the same, and method of manufacturing the dielectric thin film
Provided are a dielectric thin film, an integrated device including the same, and a method of manufacturing the dielectric thin film. The dielectric thin film includes an oxide having a perovskite-type crystal structure represented by Formula 1 below and wherein the dielectric thin film comprises 0.3 at % or less of halogen ions or sulfur ions.
A.sub.2-xB.sub.3-yO.sub.10-z <Formula 1> In Formula 1, A, B, x, y, and z are disclosed in the specification.
ADDITIVELY-MANUFACTURED STRUCTURE FOR REACTIONARY PROCESSES
A method of additively manufacturing a structure for use in a reactionary process includes forming a material from metal or metal oxide particles, a dispersion solvent, and a binder. The method also includes depositing the material onto a build platform and curing the material to form a structure for use in a reactionary process. The structure includes the metal or metal oxide particles and is configured to provide a reaction when exposed to a reactant.
THERMOSET CERAMIC COMPOSITIONS, INORGANIC POLYMER COATINGS, INORGANIC POLYMER MOLD TOOLING, INORGANIC POLYMER HYDRAULIC FRACKING PROPPANTS, METHODS OF PREPARATION AND APPLICATIONS THEREFORE
Thermoset ceramic compositions and a method of preparation of such compositions. The compositions are advanced organic/inorganic hybrid composite polymer ceramic alloys. The material combines strength, hardness and high temperature performance of technical ceramics with the strength, ductility, thermal shock resistance, density, and easy processing of the polymer. Consisting of a branched backbone of silicon, and alumina, with highly coordinated Si—O—Si or Al—O—Al bonds, the material undergoes sintering at 7 to 300 centigrade for 2 to 94 hours from water at a pH between 0 to 14, humidity of 0 to 100%, with or without vaporous solvents.
THERMOSET CERAMIC COMPOSITIONS, INORGANIC POLYMER COATINGS, INORGANIC POLYMER MOLD TOOLING, INORGANIC POLYMER HYDRAULIC FRACKING PROPPANTS, METHODS OF PREPARATION AND APPLICATIONS THEREFORE
Thermoset ceramic compositions and a method of preparation of such compositions. The compositions are advanced organic/inorganic hybrid composite polymer ceramic alloys. The material combines strength, hardness and high temperature performance of technical ceramics with the strength, ductility, thermal shock resistance, density, and easy processing of the polymer. Consisting of a branched backbone of silicon, and alumina, with highly coordinated Si—O—Si or Al—O—Al bonds, the material undergoes sintering at 7 to 300 centigrade for 2 to 94 hours from water at a pH between 0 to 14, humidity of 0 to 100%, with or without vaporous solvents.
DIELECTRIC THIN FILM, INTEGRATED DEVICE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE DIELECTRIC THIN FILM
Provided are a dielectric thin film, an integrated device including the same, and a method of manufacturing the dielectric thin film. The dielectric thin film includes an oxide having a perovskite-type crystal structure represented by Formula 1 below and wherein the dielectric thin film comprises 0.3 at % or less of halogen ions or sulfur ions.
A.sub.2-xB.sub.3-yO.sub.10-z <Formula 1>
In Formula 1, A, B, x, y, and z are disclosed in the specification.
Dielectric composition and electronic component
A dielectric composition having a high relative dielectric constant and high Q value even at high frequencies, and an electronic component including a dielectric film configured from the dielectric composition. This dielectric composition includes the composite oxide represented by general formula (aCaO+bSrO)—ZrO.sub.2 as a main component, and by a and b satisfying the relationships a≥0, b≥0, and 1.50<a+b≤4.00.
CAST MOLD FORMING COMPOSITIONS AND USES THEREOF
The present invention provides a composition for forming a casting mold or a mold liner, comprising solid particles of CaO, SiO, MgO, Al.sub.2O.sub.3 having an average particle size of 20 to 60 μm.
COMPOSITION FOR FDM 3D PRINTERS
The present invention relates to a paste-type composition for a fused deposition modeling (FDM) 3D printer comprising: a ceramic powder including CaO and SiO.sub.2; and a binder solution, wherein the composition may be injected into the FDM 3D printer in the form of a paste to rapidly manufacture a molded article without a melting process and may precisely implement a variety of geometries to be utilized as a biological replacement for medical use.
DIELECTRIC CERAMIC COMPOSITION AND CERAMIC ELECTRONIC COMPONENTS
Provided is a dielectric ceramic composition including a first component and a second component, wherein the first component comprises an oxide of Ca of 0.00 mol % to 35.85 mol % an oxide of Sr of 0.00 mol % to 47.12 mol %, an oxide of Ba of 0.00 mol % to 51.22 mol %, an oxide of Ti of 0.00 mol % to 17.36 mol %, an oxide of Zr of 0.00 mol % to 17.36 mol %, an oxide of Sn of 0.00 mol % to 2.60 mol %, an oxide of Nb of 0.00 mol % to 35.32 mol %, an oxide of Ta of 0.00 mol % to 35.32 mol %, and an oxide of V of 0.00 mol % to 2.65 mol %, and the second component includes at least (a) an oxide of Mn of 0.005% by mass to 3.500% by mass and (b) an oxide of Cu and/or an oxide of Ru.