C04B41/4517

Fibers fabricated to incorporate metals for high temperature applications

A fiber comprises a bulk material comprising one or more materials selected from the group consisting of carbon, silicon, boron, silicon carbide, and boron nitride; and a metal whose affinity for oxygen is greater than the affinity for oxygen of any of the one or more materials. The metal may be selected from the group consisting of beryllium, titanium, hafnium and zirconium. At least a first portion of the metal may be present in un-oxidized form at the entrance to and/or within grain boundaries within the fiber. A method of improving at least one of the strength, creep resistance, and toughness of a fiber comprises adding to a fiber, initially comprising a bulk material having a first affinity for oxygen, a metal that has a second affinity for oxygen higher than the first affinity. The metal may be selected from the group consisting of beryllium, titanium, hafnium and zirconium.

DOPED OR ALLOYED MATERIALS AND HOT ISOSTATIC PRESSING METHOD OF MAKING SAME

A doped substrate having a substrate comprising at least one of a glass material, a single crystal material, a poly-crystalline material, a ceramic material, or a semiconductor material. The doped substrate includes a dopant comprising one or more transition metals, one or more rare earth elements, or a combination of both, the doped substrate characterized in that a spectral laser output of the doped substrate exhibits a nominally single frequency having a linewidth less than about 5 nm.

Electroconductive paste, electronic substrate, and method for manufacturing said substrate
10575412 · 2020-02-25 · ·

An electroconductive paste comprises high melting point metal particles having a melting point that exceeds the firing temperature; molten metal particles containing a metal or an alloy that melts at the firing temperature, for which the melting point is 700 C. or less; active metal particles containing an active metal; and an organic vehicle.

Electroconductive paste, electronic substrate, and method for manufacturing said substrate
10575412 · 2020-02-25 · ·

An electroconductive paste comprises high melting point metal particles having a melting point that exceeds the firing temperature; molten metal particles containing a metal or an alloy that melts at the firing temperature, for which the melting point is 700 C. or less; active metal particles containing an active metal; and an organic vehicle.

CORROSION-RESISTANT MEMBER

A corrosion-resistant member according to the present disclosure includes a substrate that is composed of an aluminum-oxide-based ceramic and a covering layer that is composed of an OAlC layer that is located on the substrate.

Electronic component and method for producing same
11903144 · 2024-02-13 · ·

The purpose of the present invention is to provide an electronic component in which a copper electrode and an inorganic substrate exhibit strong adhesion to each other. A method for producing an electronic component according to the present invention comprises: an application step wherein a paste is applied onto an inorganic substrate, which paste contains copper particles, copper oxide particles and/or nickel oxide particles, and inorganic oxide particles having a softening point; a sintering step wherein a sintered body which contains at least copper is formed by means of heating in an inert gas atmosphere at a temperature that is less than the softening point of the inorganic oxide particles but not less than the sintering temperature of the copper particles; and a softening step wherein heating is carried out in an inert gas atmosphere at a temperature that is not less than the softening point of the inorganic oxide particles.

Electronic component and method for producing same
11903144 · 2024-02-13 · ·

The purpose of the present invention is to provide an electronic component in which a copper electrode and an inorganic substrate exhibit strong adhesion to each other. A method for producing an electronic component according to the present invention comprises: an application step wherein a paste is applied onto an inorganic substrate, which paste contains copper particles, copper oxide particles and/or nickel oxide particles, and inorganic oxide particles having a softening point; a sintering step wherein a sintered body which contains at least copper is formed by means of heating in an inert gas atmosphere at a temperature that is less than the softening point of the inorganic oxide particles but not less than the sintering temperature of the copper particles; and a softening step wherein heating is carried out in an inert gas atmosphere at a temperature that is not less than the softening point of the inorganic oxide particles.

Ceramic article with reduced surface defect density

A machined ceramic article having an initial surface defect density and an initial surface roughness is provided. The machined ceramic article is heated to a temperature range between about 1000 C. and about 1800 C. at a ramping rate of about 0.1 C. per minute to about 20 C. per minute. The machined ceramic article is heat-treated in air atmosphere. The machined ceramic article is heat treated at one or more temperatures within the temperature range for a duration of up to about 24 hours. The machined ceramic article is then cooled at the ramping rate, wherein after the heat treatment the machined ceramic article has a reduced surface defect density and a reduced surface roughness.

Ceramic article with reduced surface defect density

A machined ceramic article having an initial surface defect density and an initial surface roughness is provided. The machined ceramic article is heated to a temperature range between about 1000 C. and about 1800 C. at a ramping rate of about 0.1 C. per minute to about 20 C. per minute. The machined ceramic article is heat-treated in air atmosphere. The machined ceramic article is heat treated at one or more temperatures within the temperature range for a duration of up to about 24 hours. The machined ceramic article is then cooled at the ramping rate, wherein after the heat treatment the machined ceramic article has a reduced surface defect density and a reduced surface roughness.

Electroconductive Paste, Electronic Substrate, and Method for Manufacturing Said Substrate
20190132961 · 2019-05-02 · ·

A conductive paste includes a high melting point metal particle having a melting point exceeding a baking temperature, a molten metal particle containing a metal or an alloy which melts at a temperature equivalent to or lower than the baking temperature and has a melting point of 700 C. or lower, an active metal particle containing an active metal, and an organic vehicle.