Patent classifications
C04B41/5016
Microbial Conductive Ceramics and Preparation Method and Application thereof
The disclosure discloses microbial conductive ceramics and a preparation method and application thereof, and belongs to the technical field of microorganisms and the technical field of semiconductor materials. The disclosure is based on ordinary insulating macroporous ceramics, using the means of cell immobilization and the principle of microbial adsorption, to prepare the microbial conductive ceramics including macroporous ceramics, microbes immobilized on the macroporous ceramics and metal ions adsorbed to the microbes. The microbial conductive ceramics have excellent performance, and the conductivity of the microbial conductive ceramics can reach 2.91×10.sup.6 S/m. At the same time, the cost of the microbial conductive ceramics is low, only 10% of the cost of conductive ceramics with the same conductivity.
HIGH TEMPERATURE OXIDATION PROTECTION FOR COMPOSITES
The present disclosure provides a method for coating a composite structure, comprising forming a first slurry by combining a first pre-slurry composition with a first carrier fluid, applying the first slurry on a surface of the composite structure, and heating the composite structure to a temperature sufficient to form a base layer on the composite structure. The first pre-slurry composition may comprise a first phosphate glass composition and a low coefficient of thermal expansion material, wherein the low coefficient of thermal expansion material is a material with a coefficient of thermal expansion of less than 1010.sup.6 C.
HIGH TEMPERATURE OXIDATION PROTECTION FOR COMPOSITES
The present disclosure provides a method for coating a composite structure, comprising forming a first slurry by combining a first pre-slurry composition with a first carrier fluid, applying the first slurry on a surface of the composite structure, and heating the composite structure to a temperature sufficient to form a base layer on the composite structure. The first pre-slurry composition may comprise a first phosphate glass composition and a low coefficient of thermal expansion material, wherein the low coefficient of thermal expansion material is a material with a coefficient of thermal expansion of less than 1010.sup.6 C.
High temperature oxidation protection for composites
The present disclosure provides a method for coating a composite structure, comprising forming a first slurry by combining a first pre-slurry composition with a first carrier fluid, applying the first slurry on a surface of the composite structure, and heating the composite structure to a temperature sufficient to form a base layer on the composite structure. The first pre-slurry composition may comprise a first phosphate glass composition and a low coefficient of thermal expansion material, wherein the low coefficient of thermal expansion material is a material with a coefficient of thermal expansion of less than 1010.sup.6 C..sup.1.
High temperature oxidation protection for composites
The present disclosure provides a method for coating a composite structure, comprising forming a first slurry by combining a first pre-slurry composition with a first carrier fluid, applying the first slurry on a surface of the composite structure, and heating the composite structure to a temperature sufficient to form a base layer on the composite structure. The first pre-slurry composition may comprise a first phosphate glass composition and a low coefficient of thermal expansion material, wherein the low coefficient of thermal expansion material is a material with a coefficient of thermal expansion of less than 1010.sup.6 C..sup.1.
SLIP RESISTANT PRODUCT
A method is described for increasing the slip resistance of a substrate. In embodiments, the method deposits a liquid treatment composition including at least one acid on a substrate that has at least one external surface that includes a salifiable alkaline or alkaline earth compound.
WATER BASED COATING
A heat curable aqueous composition comprising: (a) water; (b) at least 5 wt % sodium pyrophosphate, at least 5 wt % sodium phosphate monobasic, at least 5 wt % sodium triphosphate, at least 5 wt % monoammonium phosphate, at least 5 wt % diammonium phosphate, or at least 5 wt % of a mixture thereof, based on the total weight of the composition including the weight of the water; and (c) at least one pigment, or at least one metal-containing ingredient, or a mixture of at least one pigment and at least one metal-containing ingredient.
COMPOSITION AND METHODS FOR WOOD CONCRETE BOARD
A wood fiber composite with improved adhesion is made using the method described herein. The uncoated substrate is coated with a pretreatment, followed by coating of a sealer and a topcoat over the pretreatment. Preheating the substrate prior to pretreatment appears to increase adhesion.
COMPOSITION AND METHODS FOR WOOD CONCRETE BOARD
A wood fiber composite with improved adhesion is made using the method described herein. The uncoated substrate is coated with a pretreatment, followed by coating of a sealer and a topcoat over the pretreatment. Preheating the substrate prior to pretreatment appears to increase adhesion.
CUTTING STRUCTURE OF CUTTING ELEMENTS FOR DOWNHOLE CUTTING
A cutting element may include a substrate; and an ultrahard layer on the substrate, the substrate and the ultrahard layer defining a non-planar working surface of the cutting element such that the ultrahard layer forms a cutting portion and the substrate is at least laterally adjacent to the ultrahard layer. Another cutting element includes a pointed region having a side surface extending from the pointed region outer perimeter to a peak. An ultrahard material body forms a portion of the pointed region including the peak, and a base region extends a depth from the pointed region outer perimeter. The ultrahard material body has a height to width aspect ratio with the height and width measured between two points of the body having the greatest distance apart along a dimension parallel with a longitudinal axis (i.e., height) along a dimension perpendicular to the longitudinal axis (i.e., width).