The present invention provides a ceramic wafer with a surface shape and a manufacturing method thereof. The ceramic wafer has an upper surface and a lower surface, and at least one of the upper surface and the lower surface has an irregular surface shape. The total thickness variation (TTV) value between the two surfaces ranges from 0.1 to 100 m. The ceramic wafer with the surface shape of the present invention, by controlling the total thickness variation of the wafer, not only helps the coating, but also improves the flow of the fluid, and can improve the bonding force of the coating and reduce the surface defects in the subsequent process.

A method for removing a ceramic coating from a substrate is presented. The method includes contacting the ceramic coating with a composition including a fluoride source and nitric acid. A method of forming a component having a variation in saturation magnetization is presented. The method includes masking selected portions of a surface of a metallic component using a ceramic coating to form a masked metallic component; selectively diffusing nitrogen into the metallic component by exposing the masked metallic component to a nitrogen-rich atmosphere; and removing the ceramic coating from the surface of the metallic component by contacting the ceramic coating with a composition including the fluoride source and nitric acid.

A surface treatment method of a material, comprising: respectively immersing a material to be treated into a first inorganic acid solution and a fluoride acidic solution to perform surface etching, so that nano-sized holes are formed in the surface of the material to be treated. Further disclosed are a material product and a composite material.

Methods for forming holes in a substrate by reducing back reflections of a quasi-non-diffracting beam into the substrate are described herein. In some embodiments, a method of processing a substrate having a first surface and a second surface includes applying an exit material to the second surface of the substrate, wherein a difference between a refractive index of the exit material and a refractive index of the substrate is 0.4 or less, and focusing a pulsed laser beam into a quasi-non-diffracting beam directed into the substrate such that the quasi-non-diffracting beam enters the substrate through the first surface. The substrate is transparent to at least one wavelength of the pulsed laser beam. The quasi-non-diffracting beam generates an induced absorption within the substrate that produces a damage track within the substrate.

An etchant composition is presented. The composition includes: 18 wt % to 25 wt % of a first organic acid compound; 15 wt % to 20 wt % of a second organic acid compound; 8.1 wt % to 9.9 wt % of an inorganic acid compound; 1 wt % to 4.9 wt % of a sulfonic acid compound; 10 wt % to 20 wt % of a hydrogen sulfate salt compound; 1 wt % to 5 wt % of a nitrogen-containing dicarbonyl compound; 1 wt % to 5 wt % of an amino acid derivative compound; 0.1 wt % to 2 wt % of an iron-containing oxidizing agent compound; and a balance amount of water.

A method for removing a ceramic coating from a substrate is presented. The method includes contacting the ceramic coating with a composition including a fluoride source and nitric acid. A method of forming a component having a variation in saturation magnetization is presented. The method includes masking selected portions of a surface of a metallic component using a ceramic coating to form a masked metallic component; selectively diffusing nitrogen into the metallic component by exposing the masked metallic component to a nitrogen-rich atmosphere; and removing the ceramic coating from the surface of the metallic component by contacting the ceramic coating with a composition including the fluoride source and nitric acid.

A method for etching a light absorbing material permits directly writing a pattern of etching of silicon nitride and other light absorbing materials, without the need of a lithographic mask, and allows the creation of etched features of less than one micron in size. The method can be used for etching deposited silicon nitride films, freestanding silicon nitride membranes, and other light absorbing materials, with control over the thickness achieved by optical feedback. The etching is promoted by solvents including electron donor species, such as chloride ions. The method provides the ability to etch silicon nitride and other light absorbing materials, with fine spatial and etch rate control, in mild conditions, including in a biocompatible environment. The method can be used to create nanopores and nanopore arrays.

A method for etching a light absorbing material permits directly writing a pattern of etching of silicon nitride and other light absorbing materials, without the need of a lithographic mask, and allows the creation of etched features of less than one micron in size. The method can be used for etching deposited silicon nitride films, freestanding silicon nitride membranes, and other light absorbing materials, with control over the thickness achieved by optical feedback. The etching is promoted by solvents including electron donor species, such as chloride ions. The method provides the ability to etch silicon nitride and other light absorbing materials, with fine spatial and etch rate control, in mild conditions, including in a biocompatible environment. The method can be used to create nanopores and nanopore arrays.

A method of forming a substrate support for use in a processing chamber includes forming a porous region in each of a plurality of ceramic green sheets, stacking the plurality of ceramic green sheets, each having the porous region formed therein, to form a ceramic laminate, and sintering the ceramic laminate to form a monolithic ceramic body having a porous plug formed therein. The porous plug includes the porous regions in the plurality of ceramic green sheets that are sintered.

The present disclosure relates to a tantalum carbide-coated carbon material and a method for manufacturing the same, and an aspect of the present disclosure provides a tantalum carbide-coated carbon material including: a carbon substrate; and a tantalum carbide coating layer formed on the carbon substrate by a CVD method, wherein microcracks included in the tantalum carbide coating layer have a maximum width of 1.5 ?m to 2.6 ?m.