A ceramic structure 10 includes a heater electrode 14 within a disk-shaped AlN ceramic substrate 12. The heater electrode 14 contains a metal filler in the main component WC. The metal filler (such as Ru or RuAl) has a lower resistivity and a higher thermal expansion coefficient than AlN. An absolute value of a difference |ΔCTE| between a thermal expansion coefficient of the AlN ceramic substrate 12 and a thermal expansion coefficient of the heater electrode 14 at a temperature in the range of 40° C. to 1000° C. is 0.35 ppm/° C. or less.

In a diamond polycrystal, a value of a ratio (d′/d) of d′ to d is less than or equal to 0.98 in a Vickers hardness test performed under a condition defined in JIS Z 2244:2009, where the d represents a length of a diagonal line of a first Vickers indentation formed in a surface of the diamond polycrystal when a Vickers indenter with a test load of 4.9 N is pressed onto the surface of the diamond polycrystal, and the d′ represents a length of a diagonal line of a second Vickers indentation remaining in the surface of the diamond polycrystal after releasing the test load.

A sialon sintered body and a cutting insert each having thermal shock resistance and VB wear resistance. The sialon sintered body and the cutting insert contain β-sialon and 21R-sialon and exhibit an X-ray diffraction peak intensity ratio R[(I.sub.21R/I.sub.A)×100] of 5% or greater and smaller than 30%, wherein I.sub.A represents the sum of the peak intensities of the sialon species, and I.sub.21R represents the peak intensity of 21R-sialon, the ratio being calculated from the peak intensities of the sialon species obtained by using X-ray diffractometry.

A cubic boron nitride sintered material includes: more than or equal to 50 volume % and less than 80 volume % of cubic boron nitride grains; and more than 20 volume % and less than or equal to 50 volume % of a binder phase, and when an oxygen content is measured in a direction perpendicular to an interface between cubic boron nitride grains using TEM-EDX, a first region having an oxygen content larger than an average value of an oxygen content of a cubic boron nitride grain exists, the interface exists in the first region, and a length of the first region along the direction perpendicular to the interface is more than or equal to 0.1 nm and less than or equal to 10 nm.

The object of the present invention is to provide a large-sized gallium nitride-based sintered body having a small oxygen amount and high strength, a large-sized gallium nitride-based sintered body having a small oxygen amount and containing a dopant, to obtain a highly crystalline gallium nitride thin film which has become a n-type or p-type semiconductor by a dopant, and methods for producing them.

A gallium nitride-based sintered body, which has an oxygen content of at most 1 atm % and an average particle size (D50) of at least 1 μm and at most 150 μm.

A sintered body containing polycrystalline grains of a metal oxynitride containing at least two metal elements, wherein Ba and at least one metal element of a crystal phase of the sintered body are contained in a triple point that is not a void between the polycrystalline grains. A method for producing the sintered body includes sintering a mixture of at least a metal oxynitride as a main component and a sintering aid containing cyanamide in an atmosphere containing nitrogen or a rare gas or in a reduced-pressure atmosphere of 10 Pa or less while applying a mechanical pressure with a retention time at a maximum heating temperature during the sintering set to 1 minute to 10 minutes.

A silicon nitride substrate includes silicon nitride and magnesium, in which when a surface of the silicon nitride substrate is analyzed with an X-ray fluorescence spectrometer under the specific Condition I, XB/XA is 0.8 or more and 1.0 or less.

Color unevenness generated on a surface of a silicon nitride substrate is reduced. A silicon nitride substrate formed by nitriding silicon containing in a sheet-shaped green body includes a first surface and a second surface opposite to the first surface. In this case, when color difference between a center and an edge of at least one surface of the first surface and the second surface is expressed to be “ΔE*ab”, a relation “ΔE*ab≤1.5” is established.

An aluminum nitride sintered body with improved mechanical strength without compromised thermal dissipating properties. The aluminum nitride sintered body contains 100 parts by weight of AlN, 3 to 20 parts by weight on an oxide basis of at least one type of nitride selected from the group consisting of Zr and Ti as an additive, and 1 to 10 parts by weight of Y.sub.2O.sub.3 as a sintering aid. The oxygen content in the sintered body is 1.8 wt % or less, and the thermal conductivity is 130 W/m.Math.K or higher.

High-purity gallium nitride particles having a low oxygen content suitable for a raw material or a sintered body is provided. Gallium nitride particles characterized in that the oxygen content is 0.5 at % or less and the total impurity amount of elements, Si, Ge, Sn, Pb, Be, Mg, Ca, Sr, Ba, Zn and Cd, is less than 10 wtppm are used.