The invention relates to a method of producing an optically transparent film, the method comprising the steps of: providing a ceramic material, wherein the ceramic material is transparent to light having a wavelength of from 380 nm to 1000 nm; and using electromagnetic radiation to adhere together at least some of the components of the ceramic material, wherein the electromagnetic radiation has a wavelength shorter than 450 nm.

A sintered body includes a ceramic substrate including sintered oxide particles, a through-hole formed in the ceramic substrate such that the side surfaces of the oxide particles exposed from an inner wall of the through-hole form a flat surface, and a porous body disposed in the through-hole, the porous body including spherical oxide ceramic particles and a mixed oxide configured to bind the spherical oxide ceramic particles.

A moldable green-body composite includes milling silicon nitride powder with a solvent and adding a surface modifier to the milled slurry to modify a surface of the silicon nitride particles. A polysiloxane in a solvent and a binder are also added to create a green body slurry. The solvents may be polar or non-polar solvents. A sintering aid, such as yttria-alumina, may be added to the slurry as well. A reduced density silicon nitride ceramic is made from the moldable green-body composite by molding the moldable green-body composite in a mold and curing at a curing temperature to convert the moldable green-body composite to a converted composite. The converted composite can then be sintered to form a reduced density silicon nitride ceramic that has a smooth surface finish and requires no post machining or polishing. The reduced density silicon nitride ceramic may also have very good dielectric properties.

A shower plate according to the present disclosure includes a ceramic sintered body, the ceramic sintered body comprising a first surface, a second surface facing the first surface, and a through hole positioned between the first surface and the second surface. An inner surface of the through hole includes a protruding crystal grain which protrudes more than an exposed part of a grain boundary phase existing between crystal grains. In addition, a semiconductor manufacturing apparatus according to the present disclosure includes the shower plate mentioned above.

Provided is a nuclear fuel pellet having excellent impact resistance, the pellet being prepared with UO.sub.2 powder and having a cylindrical shape with a height of 9 to 13 mm and a horizontal cross-section diameter of 8 to 8.5 mm, and including: at each of a top surface and a bottom surface thereof, a dish configured as a spherical groove shape having a predetermined curvature and a groove diameter of 4.8 to 5.2 mm on a center; a shoulder configured as an annular plane along a rim of the dish; and a chamfer configured as a shape in which a corner is chamfered along a rim of the shoulder, wherein a width of the shoulder is 0.20 mm to 0.80 mm, and an angle between the chamfer and a horizontal plane is a 14-degree angle to 18-degree angle.

An assembly includes a first member, a second member adjacent to the first member, and an aluminum material. At least one of the first member and the second member defines at least one trench. The aluminum material is disposed within the trench and bonds the first member to the second member along adjacent faces. A spacing between the first member and the second member along the adjacent faces is less than 5 m and a surface roughness of the adjacent faces of the first and second ceramic members is between 5 mm and 100 nanometers.

This invention relates to a product and a method of preparing ceramic and/or ceramic hybrid materials through the construction of a printed die. The printed die being made by three dimensional printing or additive manufacturing processes possesses both an external geometry and an internal geometry.

A method of processing a CMC component includes preparing a fiber preform having a predetermined shape, and positioning the fiber preform with tooling having holes facing one or more surfaces of the fiber preform. After the positioning, a clamping pressure is applied to the tooling to force portions of the one or more surfaces of the fiber preform into the holes, thereby forming protruded regions of the fiber preform. During the application of the clamping pressure, the fiber preform is exposed to gaseous reagents at an elevated temperature, and a matrix material is deposited on the fiber preform to form a rigidized preform including surface protrusions. After removing the tooling, the rigidized preform is infiltrated with a melt for densification, and a CMC component having surface bumps is formed. When the CMC component is assembled with a metal component, the surface bumps may reduce diffusion at high temperatures.

A method of forming a ceramic matrix composite component with cooling channels includes embedding a plurality of wires into a preform structure, densifying the preform structure with embedded wires, and removing the plurality of wires to create a plurality of corresponding channels within the densified structure.

An assembly includes a first member, a second member adjacent to the first member, and an aluminum material. At least one of the first member and the second member defines at least one trench. The aluminum material is disposed within the trench and bonds the first member to the second member along adjacent faces. In one form, a spacing between the first member and the second member along the adjacent faces is less than 5 m.