An assembly for use in a gas turbine engine and method for making the same are described herein. The assembly comprising a CMC component, a metallic component spaced apart from the CMC component, and a spacer. The spacer having a first surface in contact with the CMC and a second surface opposite the first surface in contact with the metallic component, the spacer comprising a CMC substantially free of silicon metal with a porosity of between about 5 percent and about 40 percent by volume to chemically isolate the CMC component from the metallic component.

A joined body 20 includes a first member 22 having a thermal expansion coefficient of 8 ppm/K or less, a second member 24 having a thermal expansion coefficient of 12 ppm/K or more, and a joining portion 30 composed of an electrically conductive oxide containing 50% by mass or more of a spinel-type ferrite phase, the joining portion 30 joining the first member and the second member. The electrically conductive oxide preferably contains Fe and element A (where element A represents one or more selected from the group consisting of Mg, Mn, Co, Ni, Cu, and Zn). The molar ratio of element A to Fe, i.e., A/Fe, is 0.5 or less.

A copper/ceramic bonded body includes: a copper member made of copper or a copper alloy; and a ceramic member made of an aluminum oxide, wherein the copper member and the ceramic member are bonded to each other, a magnesium oxide layer is provided on a ceramic member side of an interface between the copper member and the ceramic member; and a Mg solid solution layer is provided between the magnesium oxide layer and the copper member and contains Mg in a state of a solid solution in a Cu primary phase.

Described is a process for preparing a ceramic substrate bonded with a metal foil. Moreover, described is a metal-ceramic-substrate provided with a thick-film layer and the use of a thick-film paste for bonding a metal foil onto a ceramic substrate.

A joined body 20 includes a porous ceramic 22 made of porous ceramic, a metal member 24 made of a metal, and a joint 30 formed of an oxide ceramic that penetrates into pores 23 of the porous ceramic 22 and joins the porous ceramic 22 to the metal member 24. The penetration depth of the oxide ceramic into the pores of the porous ceramic is preferably 10 m or more, and more preferably 15 to 50 m. The joined body 20 may be produced through a joining step of forming a joint by placing a metal raw material between a porous ceramic and a metal member and firing the metal raw material in the air at a temperature in the range of 400 C. to 900 C., where an oxide ceramic produced by oxidation of the metal raw material penetrates into the pores of the porous ceramic in the joint.

A composite body including a substrate and a forming portion which is composed of a composite phase containing a perovskite oxide and a metal oxide different from the perovskite oxide and which is formed on the substrate. The composite body may be a composite body manufactured by a manufacturing method including a forming step of firing in an oxidizing atmosphere, a laminated body in which an inorganic raw material powder containing a compound powder and a metal powder is disposed on a substrate so as to form a forming portion composed of a composite phase containing a perovskite oxide and a metal oxide different from the perovskite oxide on the substrate.

A laminated glazing having a first ply connected to a second ply by a polymeric interlayer; and a solar control coating located on at least one of the major surfaces thereof, the solar control coating including: a first phase adjustment layer; a first metallic layer located over the first phase adjustment layer; a first primer layer located over the first metallic layer; a second phase adjustment layer located over the first primer layer; a second metallic layer located over the second phase adjustment layer; a second primer layer located over the second metallic layer; a third phase adjustment layer located over the second primer layer; a third metallic layer located over the third phase adjustment layer; a third primer layer located over the third metallic layer; a fourth phase adjustment layer located over the third primer layer; and a protective layer located over the fourth phase adjustment layer.

A multilayer electronic component that includes a stacked body having therein a plurality of dielectric layers including a CZ-based perovskite phase and an element M2, a plurality of internal electrode layers including Ni, and an interface layer including the element M2 in at least a portion of an interface with the plurality of internal electrode layers. Element M2 is an element that has a binding energy between the CZ-based perovskite phase and Ni via the element M2 of less than or equal to ?12.3 eV by first-principles calculation using a pseudopotential method. When amounts of elements included in the dielectric layers are expressed as parts by mol, a ratio m2 of an amount of the element M2 to an amount of the Zr in the interface layer is 0.03?m2?0.25.

Electrostatic chucks and methods of forming electrostatic chucks are disclosed. Exemplary electrostatic chucks include a ceramic body, a device embedded within the ceramic body, and an interface layer formed overlying the device. Exemplary methods include providing ceramic precursor material within a mold, providing a device, coating the device with an interface material to form a coated device, placing the coated device on or within the ceramic precursor material, and sintering the ceramic precursor material to form the electrostatic chuck and an interface layer between the device and ceramic material formed during the step of sintering.

Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.