C04B2237/08

Process and Formulation to Join Ceramic Forms While Maintaining Structural and Physical Characteristics Across The Bond Surface
20200224003 · 2020-07-16 ·

A ceramic bonding material including at least one fibrous material, a flux agent and a thickening agent wherein the ceramic bonding material fired at a set temperature to bond the two adjacent substrate faces.

MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS
20200227291 · 2020-07-16 · ·

A member for a semiconductor manufacturing apparatus includes a ceramic plate having an upper surface serving as a wafer mounting surface and incorporating an electrode, a ceramic dense plug disposed adjacent to a lower surface side of the ceramic plate and ceramic-bonded to the ceramic plate by a ring-shaped joint portion, a metal cooling plate joined to the lower surface of the ceramic plate in a portion other than the ring-shaped joint portion, and a gas flow channel. The gas flow channel includes a gas discharge hole that passes completely through the ceramic plate in the thickness direction of the ceramic plate and an internal gas flow channel that passes from the upper surface to the lower surface of the dense plug while winding through the dense plug. The gas flow channel passes inside of an inner periphery of the joint portion.

Process and formulation to join ceramic forms while maintaining structural and physical characteristics across the bond surface
10703879 · 2020-07-07 · ·

A ceramic bonding material including at least one fibrous material, a flux agent and a thickening agent wherein the ceramic bonding material fired at a set temperature to bond the two adjacent substrate faces.

SOLID STATE BATTERY FABRICATION
20200185780 · 2020-06-11 ·

Embodiments of the invention generally relate to solid state battery structures, such as Li-ion batteries, methods of fabrication and tools for fabricating the batteries. One or more electrodes and the separator may each be cast using a green tape approach wherein a mixture of active material, conductive additive, polymer binder and/or solid electrolyte are molded or extruded in a roll to roll or segmented sheet/disk process to make green tape, green disks or green sheets. A method of fabricating a solid state battery may include: preparing and/or providing a green sheet of positive electrode material; preparing and/or providing a green sheet of separator material; laminating together the green sheet of positive electrode material and the green sheet of separator material to form a laminated green stack; and sintering the laminated green stack to form a sintered stack comprising a positive electrode and a separator.

Engine component having support with intermediate layer

Disclosed is a gas turbine engine component, and a method for forming the component. The component includes a first portion, a second portion formed separately from the first portion, and an intermediate layer provided between the first portion and the second portion.

Ceramic/aluminum joined body, insulating circuit board, power module, LED module, and thermoelectric module

A joined body according to the invention is a ceramic/aluminum joined body including: a ceramic member; and an aluminum member made of aluminum or an aluminum alloy, in which the ceramic member and the aluminum member are joined to each other, the ceramic member is formed of silicon nitride containing magnesium, and a joining layer in which magnesium is contained in an aluminum-silicon-oxygen-nitrogen compound is formed at a joining interface between the ceramic member and the aluminum member.

CERAMIC/ALUMINUM BONDED BODY, INSULATING SUBSTRATE, LED MODULE, CERAMIC MEMBER, METHOD FOR PRODUCING CERAMIC/ALUMINUM BONDED BODY, AND METHOD FOR PRODUCING INSULATING SUBSTRATE
20200006168 · 2020-01-02 ·

In a ceramic/aluminum bonded body according to the present invention, a ceramic member and an aluminum member formed of aluminum or an aluminum alloy are bonded to each other, the ceramic member has a ceramic main body formed of silicon nitride, and an aluminum nitride layer or an aluminum oxide layer formed on the surface of the ceramic main body to which the aluminum member is bonded, the ceramic member and the aluminum member are bonded to each other through the aluminum nitride layer or the aluminum oxide layer, the ceramic main body is provided with silicon nitride phases and a glass phase formed between the silicon nitride phases, Al is present in a portion of the glass phase of the ceramic main body at an interface with the aluminum nitride layer or aluminum oxide layer.

COPPER/CERAMIC JOINED BODY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC JOINED BODY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
20200006213 · 2020-01-02 ·

There is provided a copper/ceramic bonded body of the present invention in which a copper member made of copper or a copper alloy and a ceramic member made of aluminum nitride or silicon nitride are bonded to each other, in which an active metal nitride layer containing a nitride of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on the ceramic member side between the copper member and the ceramic member, a Mg solid solution layer in which Mg is dissolved in a Cu matrix phase is formed between the active metal nitride layer and the copper member, and the active metal is present in the Mg solid solution layer.

FORMING A SURFACE LAYER OF A CERAMIC MATRIX COMPOSITE ARTICLE

The disclosure describes techniques for forming a surface layer of an article including a CMC using a cast. In some examples, the surface layer includes three-dimensional surface features, which may increase adhesion between the CMC and a coating on the CMC. In some examples, the surface layer may include excess material, with or without three-dimensional surface features, which is on the CMC. The excess material may be machined to remove some of the excess material and facilitate conforming the article to dimensional tolerances, e.g., for fitting the article to another component. The excess material may reduce a likelihood that the CMC (e.g., reinforcement material in the CMC) is damaged by the machining.

BATCH SINTERING METHOD FOR HIGH-PROPERTY SILICON NITRIDE CERAMIC SUBSTRATE

The present disclosure relates to a batch sintering method for a high-property silicon nitride ceramic substrate. The batch sintering method includes: (1) silicon nitride ceramic substrate green bodies are stacked and put into a boron nitride crucible, and a layer of boron nitride powder is applied between adjacent silicon nitride ceramic substrate green bodies; (2) after step-by-step vacuumization, debinding is performed in a nitrogen atmosphere or a reducing atmosphere at 500 C. to 900 C.; (3) gas pressure sintering is then performed in a nitrogen atmosphere at 1800 C. to 2000 C., completing the batch preparation of the high-property silicon nitride ceramic substrate.