In a copper-ceramic bonded body of the present invention, at a bonding interface of a copper member and a ceramic member, there are formed a nitride compound layer containing one or more nitride forming elements selected from Ti, Nb, Hf, and Zr, and an AgCu eutectic layer, in order from the ceramic member side, the thickness of the nitride compound layer is 0.15 m or more and 1.0 m or less, an intermetallic compound phase formed of an intermetallic compound that contains the nitride forming element and Si is present between the copper member and the ceramic member, and Cu and Si are present at the grain boundary of the nitride compound layer.

A honeycomb structure includes honeycomb segments each having a porous partition wall defining a plurality of cells, and includes a porous bonding layer containing a crystalline anisotropic ceramic and disposed so as to bond side surfaces of the honeycomb segments to each other. A ratio of a pore volume (cc/g) of a fine pore defined as a pore in the bonding layer having a pore diameter of 10 m or more and less than 50 m with respect to a pore volume (cc/g) of a coarse pore defined as a pore in the bonding layer having a pore diameter of 50 m or more and 300 m or less is from 2.0 to 3.5, the pore volume of the fine pore is from 0.15 to 0.4 cc/g, and the pore volume of the coarse pore is from 0.05 to 0.25 cc/g.

A ceramic honeycomb structure comprising pluralities of honeycomb segments each having pluralities of longitudinally penetrating flow paths partitioned by porous cell walls and plugs formed in the end portions of the flow paths, and a bonding material layer boding the peripheral walls of the honeycomb segments, the bonding material layer comprising silicon carbide particles as aggregate and a bonding phase bonding the silicon carbide particles, the bonding phase comprising at least a cordierite phase and a spinel phase, the molar ratio M1 of the cordierite phase [=cordierite phase/(cordierite phase+spinel phase)] being 0.50 or more and less than 1.0, and the content of (cordierite phase+spinel phase) in the bonding phase being 50% or more by mass.

A honeycomb structure has a plurality of pillar honeycomb segments with a porous partition wall that defines a plurality of cells extending from an inflow end face as one end face to an outflow end face as another end face and becoming channels for a fluid and a bonding layer that bonds side surfaces of the plurality of honeycomb segments one another, the bonding layer contains a plurality of plate-shaped particles, the plate-shaped particles are laminated in a thickness direction X of the bonding layer at a cross section of the bonding layer cut off to the thickness direction of the bonding layer, the number of particles meets Expression: number of particles >10, and the number of particles and the number of particles meet a relationship of Expression: (number of particles /number of particles )>3.

In some examples, a method including forming a layer of a slurry composition between a first ceramic or CMC part and a second ceramic or CMC part. The slurry composition includes a carrier material; and a plurality of solid particles in the carrier material. The plurality of solid particles includes first silicon carbide (SiC) particles defining a first average particle size, second SiC particles defining a second average particles size that is less than the first average particles size, and reactive additive particles. The method includes heating the layer of slurry composition to react the plurality of reactive additive particles to fuse the plurality of first SiC particles and the plurality of second SiC particles together with the reactive additive particles, wherein the fused layer of the slurry composition forms a joint layer that joins the first ceramic or CMC part to the second ceramic or CMC part.

A metal-on-ceramic substrate comprises a ceramic layer, a first metal layer, and a bonding layer joining the ceramic layer to the first metal layer. The bonding layer includes thermoplastic polyimide adhesive that contains thermally conductive particles. This permits the substrate to withstand most common die attach operations, reduces residual stress in the substrate, and simplifies manufacturing processes.

Segmented silicon carbide liners for use in a fluidized bed reactor for production of polysilicon-coated granulate material are disclosed, as well as methods of making and using the segmented silicon carbide liners. Non-contaminating bonding materials for joining silicon carbide segments also are disclosed. One or more of the silicon carbide segments may be constructed of reaction-bonded silicon carbide.

There is provided a honeycomb structure where a crack at honeycomb segments, which constitute a honeycomb bonded assembly, is reduced. A honeycomb structure has a pillar-shaped honeycomb bonded assembly that has a plurality of pillar-shaped honeycomb segments having a porous partition wall defining a plurality of cells extending from an inflow end face as one end face to an outflow end face as another end face and becoming channels for a fluid, and a bonding layer bonding side surfaces of the plurality of honeycomb segments, and in the honeycomb bonded assembly, at 25 to 800 C., a thermal expansion coefficient of the bonding layer is larger than a thermal expansion coefficient of the honeycomb segment.

There is provided a honeycomb structure where a crack at a honeycomb substrate is reduced. A honeycomb structure has a honeycomb substrate that has a porous partition wall defining a plurality of cells extending from an inflow end face as one end face to an outflow end face as another end face and becoming channels for a fluid, and an outer circumference coating layer disposed at an outer circumference of the honeycomb substrate. At 25 to 800 C., a thermal expansion coefficient of the outer circumference coating layer is larger than a thermal expansion coefficient of the honeycomb substrate. The thermal expansion coefficients of the outer circumference coating layer and the thermal expansion coefficient at 25 to 800 C. preferably meet a relationship represented by the expression: 1.1<(the thermal expansion coefficient of the outer circumference coating layer/the thermal expansion coefficient of the honeycomb substrate)<40.

There is disclosed a plugged honeycomb structure. A plugged honeycomb structure includes a honeycomb structure body of a segment structure and plugging portions disposed in open ends of cells formed in the honeycomb structure body, the honeycomb structure body has outer segments and inner segments disposed on an inner side than the outer segments in a cross section of the honeycomb structure body, and a material constituting the outer segments has a smaller heat capacity per unit volume than a material constituting the inner segments.