Patent classifications
C04B2237/121
Aluminum Encapsulation of Ceramic Spheres for Armor Applications
Body armor composite material that includes a substrate, a tempered aluminum binder, and ceramic spheres embedded in the binder. The ceramic spheres have interstitial space that are filled by the aluminum binder.
Method for manufacturing ceramic-metal layer assembly, method for manufacturing ceramic circuit board, and metal-board-joined ceramic base material board
Provided is a method for manufacturing a metal-layer-joined ceramic base material board, in which at least one scribe line is formed, on each of the front and back surfaces of a ceramic base material board, along dividing lines for dividing the ceramic base material board into a plurality of ceramic boards, a metal board covering at least a portion of the dividing lines is joined to each of the front and back surface of the ceramic base material board, the metal boards are etched along the dividing lines to form a plurality of metal layers, and the plurality of metal layers are joined to each of the front and back surfaces of the ceramic base material board.
BONDED BODY AND INSULATING CIRCUIT SUBSTRATE
A bonded body is formed to configured to join a ceramic member formed of a Si-based ceramic and a copper member formed of copper or a copper alloy, in which, in a joint layer formed between the ceramic member and the copper member, a crystalline active metal compound layer formed of a compound including an active metal is formed on the ceramic member side.
Method for producing a metal-ceramic substrate with at least one via
A method for producing a metal-ceramic substrate with at least one electrically conductive via, in which one metal layer, respectively, is attached in a planar manner to a ceramic plate or a ceramic layer to each of two opposing surface sides of the ceramic layer is provided. The method includes introducing a metal-containing, powdery and/or liquid substance into a hole in the ceramic layer delimiting the via prior to the attachment of both metal layers, or subsequent to the attachment of one of the two metal layers to form an assembly. Prior to the attachment of the other one of the two metal layers, and the assembly is subjected to a high-temperature step above 500 C. in which the metal-containing substance wets the ceramic layer at least partially with a wetting angle of less than 90.
BONDED BODY, INSULATED CIRCUIT BOARD WITH HEAT SINK, AND HEAT SINK
An aluminum alloy member is made of an aluminum alloy having a Mg concentration set in a range of 0.4 mass % or more and 7.0 mass % or less and a Si concentration set to less than 1 mass %, the aluminum alloy member and a copper member are bonded to each other through solid-phase diffusion, and a compound layer made up of a first intermetallic compound layer that is disposed on the aluminum alloy member side and made of a phase of an intermetallic compound of Cu and Al, a second intermetallic compound layer that is disposed on the copper member side and made of a .sub.2 phase of an intermetallic compound of Cu and Al, and a CuAlMg layer provided between the first intermetallic compound layer and the second intermetallic compound layer is provided in a bonding interface between the aluminum alloy member and the copper member.
Method of bonding a metallic component to a non-metallic component using a compliant material
A means for attaching a metallic component to a non-metallic component using a compliant material having thermal properties intermediate those of the metallic component to a non-metallic component is provided. The method can accommodate CTE mismatches and wear-type problems common to many assemblies of dissimilar materials. In particular, the method provides a sufficient wear surface to accommodate relative motion and provide a durable wear surface that does not excessively wear/gall/mico-weld itself together and provides the necessary damping and motion for proper operation in aeronautical applications.
Low Temperature Direct Bonding Of Aluminum Nitride To AlSiC Substrates
Disclosed herein are power electronic modules formed by directly bonding a heat sink to a dielectric substrate using transition liquid phase bonding.
Double-sealed fuel rod end plug for ceramic-containing cladding
The invention relates to sealing a fuel rod composite cladding tube composed of silicon carbide regardless of the fuel rod cladding design architecture (e.g., monolithic, duplex with monolithic SiC on the inside and a composite made with SiC fibers and SiC matrix on the outside) preferably with sealed SiC end plug caps, additionally sealed with an interior braze and exterior SiC final coating, thus providing a double sealed end plug barrier effective at retaining gas tightness and providing mechanical strength for the sealed end joint while providing high chemical resistance.
CERAMIC-ALUMINUM ASSEMBLY WITH BONDING TRENCHES
A method of joining is provided. the method includes preparing a first member, preparing a second member, and forming at least one trench in at least one of the first member and the second member. The method further includes placing a strip of solid aluminum material between the first member and the second member across the trench, bringing the first member and the second member together to contact the solid aluminum material and to form an assembly, and applying a force and heat to the assembly above a melting point of the solid aluminum material such that the solid aluminum material flows into the trench. Additionally, the method further includes applying additional heat to the assembly at or above a wetting temperature of the member in which the trench is formed to bond the first member to the second member along adjacent faces and cooling the assembly.
Semiconductor Substrate Support With Multiple Electrodes And Method For Making Same
A method for manufacturing an electrostatic chuck with multiple chucking electrodes made of ceramic pieces using metallic aluminum as the joining. The aluminum may be placed between two pieces and the assembly may be heated in the range of 770C to 1200C. The joining atmosphere may be non-oxygenated. After joining the exclusions in the electrode pattern may be machined by also machining through one of the plate layers. The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.