C04B2237/122

Ceramic matrix composite component and method of producing the same

A ceramic matrix composite component includes a first substrate and a second substrate each formed of a silicide-containing ceramic matrix composite, silicon carbide layers respectively coating a bonding surface of the first substrate and a bonding surface of the second substrate, and a bonding layer formed of a silicon-containing alloy and provided between the silicon carbide layer coating the bonding surface of the first substrate and the silicon carbide layer coating the bonding surface of the second substrate.

Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste

This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic substrate 11; and an AgCu eutectic structure layer 32 having a thickness of 15 m or less that is formed between the nitride layer and the copper plate.

Active metal braze joint with stress relieving layer
10363624 · 2019-07-30 · ·

The present disclosure relates to a brazed superabrasive assemblies and method of producing brazed superabrasive assemblies. The brazed superabrasive assemblies may include a plurality of braze alloy layers that are positioned opposite a stress relieving layer. The stress relieving layer may have a solidus temperature that is greater than a solidus temperature of the plurality of braze alloy layers.

BRAZED JOINT AND SEMICONDUCTOR PROCESSING CHAMBER COMPONENT HAVING THE SAME
20190226512 · 2019-07-25 ·

Methods of forming a metallic-ceramic brazed joint are disclosed herein. The method of forming the brazed joint includes deoxidizing the surface of metallic components, assembling the joint, heating the joint to fuse the joint components, and cooling the joint. In certain embodiments, the brazed joint includes a conformal layer. In further embodiments, the brazed joint has features in order to reduce stress concentrations within the joint.

Ceramic pressure measurement cell and method for production thereof
10330549 · 2019-06-25 · ·

A pressure measurement cell, comprising: a ceramic measurement membrane and a ceramic counterpart. The measurement membrane is joined to the counterpart in a pressure-tight manner forming a pressure chamber between the measurement membrane and the counterpart by means of an active brazing solder. The pressure measurement cell furthermore has a solder stop layer on a surface of the measurement membrane and/or the counterpart, wherein the solder stop layer has a metal oxide or a reduced form of the metal oxide. The metal oxide has at least one oxidation stage, which, assuming an activity coefficient of R.sub.akt=1 at an inverse temperature of 8.Math.10.sup.4/K, has an oxygen coexistence decomposition pressure of not less than 1.sup.23 MPa (10.sup.23.Math. bar) and not more than 1.sup.12 MPa (10.sup.12.Math. bar) and which, assuming an activity coefficient of R.sub.akt=1, at an inverse temperature of 9.Math.10.sup.4/K has an oxygen coexistence decomposition pressure of not less than 1.sup.27 MPa (10.sup.27 bar) and not more than 1.sup.15 MPa (10.sup.15 bar). Suitable metal oxides are, for example, oxides of chromium, tungsten or titanium.

POWER MODULE SUBSTRATE
20190189548 · 2019-06-20 ·

A power module substrate of the present invention includes a ceramic substrate and a circuit layer having a circuit pattern. In an interface between the circuit layer and the ceramic substrate, a CuSn layer and a Ti-containing layer are laminated in this order from the ceramic substrate side. In a cross-sectional shape of an end portion of the circuit pattern of the circuit layer, an angle formed between a surface of the ceramic substrate and an end face of the CuSn layer is set in a range equal to or greater than 80 and equal to or smaller than 100, and a maximum protrusion length L of the CuSn layer or the Ti-containing layer from an end face of the circuit layer is set in a range equal to or greater than 2m and equal to or smaller than 15 m.

HYDROPHOBIC MATERIALS INCORPORATING RARE EARTH ELEMENTS AND METHODS OF MANUFACTURE

This invention relates generally to an article that includes a base substrate, an intermediate layer including at least one element or compound selected from titanium, chromium, indium, zirconium, tungsten, and titanium nitride on the base substrate, and a hydrophobic coating on the base substrate, wherein the hydrophobic coating includes a rare earth element material (e.g., a rare earth oxide, a rare earth carbide, a rare earth nitride, a rare earth fluoride, and/or a rare earth boride). An exposed surface of the hydrophobic coating has a dynamic contact angle with water of at least about 90 degrees. A method of manufacturing the article includes providing the base substrate and forming an intermediate layer coating on the base substrate (e.g., through sintering or sputtering) and then forming a hydrophobic coating on the intermediate layer (e.g., through sintering or sputtering).

METHODS FOR JOINING MATERIALS, AND MATERIAL COMPOSITE

A method for joining materials, includes: providing a first material and a second material, providing the first material with a grid structure at a joining point, and joining, in particular soldering, the second material to the grid structure such that a material composite of the first material and the second material is produced, wherein the grid structure is designed in such a way that stresses in the material composite are at least partly compensated by the grid structure.

Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices

A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be on a non-diffusable type, such as aluminum nitride, alumina, beryllium oxide, and zirconia, and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

CERAMIC-METAL STRUCTURE

A ceramic-metal structure in which a metallic body (2) is inserted into or disposed above a through hole (4h) of a ceramic substrate (4) and which includes an annular pad layer (6) disposed around the through hole; an annular ring member (8) joined to the pad layer via a first brazing filler portion (10) and having a coefficient of thermal expansion smaller than that of the metallic body; a second brazing filler portion (12) intervening between the ring member and metallic body; and brazing filler flow prevention layers (7a, 7b) covering an outer surface of the pad layer so as to expose a central region (6c) of the outer surface of the pad layer facing the first brazing filler portion. The first brazing filler portion joins the central region and the ring member without projecting to a radially inner or outer side of the flow prevention layers.