Provided is a member for a power storage device that, even when the amount of electrode active material supported is increased, enables charge and discharge and thus achieves a high capacity. A member 6 for a power storage device includes: a solid electrolyte layer 1; and an electrode layer 2 provided on the solid electrolyte layer 1 and made of a sintered body of an electrode material layer 2A containing an electrode active material precursor powder having an average particle diameter of not less than 0.01 μm and less than 0.7 μm.

A method for manufacturing a metal-ceramic substrate (1) includes providing a ceramic layer (10), a metal layer (20) and a solder layer (30) coating the ceramic layer (10) and/or the metal layer (20) and/or the solder layer (30) with an active metal layer (40), arranging the solder layer (30) between the ceramic layer (10) and the metal layer (20) along a stacking direction (S), forming a solder system (35) comprising the solder layer and the active metal layer (40), wherein a solder material of the solder layer (30) is free of a melting point lowering material and bonding the metal layer (20) to the ceramic layer (10) via the solder system (35) by means of an active solder process.

A copper-ceramic composite: includes a ceramic substrate containing alumina and a copper or copper alloy coating on the ceramic substrate. The alumina has a mean grain shape factor R.sub.a(Al.sub.2O.sub.3), defined as the arithmetic mean of the shape factors R of the alumina grains, of at least 0.4.

Herein disclosed is a method of making a fuel cell including forming an anode, a cathode, and an electrolyte using an additive manufacturing machine. The electrolyte is between the anode and the cathode. Preferably, electrical current flow is perpendicular to the electrolyte in the lateral direction when the fuel cell is in use. Preferably, the method comprises making an interconnect, a barrier layer, and a catalyst layer using the additive manufacturing machine.

A solder material (30) for bonding a metal layer (20) to a ceramic layer (10), in particular for forming a metal-ceramic substrate as a carrier for electrical components, comprising: a base material and an active metal, wherein the solder material (30) is a foil comprising the base material in a first layer (31) and the active metal in a second layer (32), and wherein the foil has a total thickness (GD) which is less than 50 μm, preferably less than 25 μm and particularly preferably less than 15 μm.

A method for manufacturing a sintered body, the method including heating a mixture that contains a plurality of particles of a metal oxide having a spinel-type structure, and a metal acetylacetonate under pressure at a temperature of from a melting point or higher of the metal acetylacetonate to 600° C. or lower, to form a sintered body that contains the metal oxide having the spinel-type structure.

Set forth herein are processes and materials for making ceramic thin green tapes by casting ceramic source powders and precursor reactants, binders, and functional additives into unsintered thin green tapes in a non-reactive environment.

Atomic diffusion bonding is carried out using a bonding film comprising a nitride formed at a bonding surface. Operating in a vacuum chamber, a bonding film comprising a nitride is formed on each of flat surfaces of two substrates that each have the flat surface, and, by overlapping the two substrates so the bonding films formed on the two substrates are in contact with each other, the two substrates are joined by the generation of atomic diffusion at a bonding interface between the bonding films.

Disclosed herein are embodiments of low temperature co-fireable barium tungstate materials which can be used in combination with high dielectric materials, such as nickel zinc ferrite, to form composite structures, in particular for isolators and circulators for radiofrequency components. Embodiments of the material can include flux, such as bismuth vanadate, to reduce co-firing temperatures.

A method for forming a ceramic-based material comprises depositing a ceramic-precursor composition comprising nanoparticles having at least one dimension less than 100 nm and an aspect ratio of 1.5 or greater, and a carrier fluid on a surface of a substrate to form an as-deposited layer of the ceramic precursor composition; and sintering the as-deposited layer of the ceramic precursor composition at a sintering temperature to form a ceramic-based material.