C04B2237/34

Soldering material for active soldering and method for active soldering
11338397 · 2022-05-24 · ·

A soldering material (1) for active soldering, in particular for active soldering of a metallization (3) to a carrier layer (2) comprising ceramics, wherein the soldering material comprises copper and is substantially silver-free.

CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-CLADDED COPPER PLATE
20230269879 · 2023-08-24 ·

A method for preparing a ceramic copper clad laminate is provided, including following steps: providing a copper material; forming a copper oxide layer on a surface of the copper material; thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms in the copper material; removing the copper oxide layer on the thermally treated copper material; and soldering the copper-oxide-layer-removed copper material to a ceramic substrate to obtain a ceramic copper clad laminate.

System and method for integrated deposition and heating

Herein disclosed is a method of manufacturing comprises depositing a composition on a substrate slice by slice to form an object; heating in situ the object using electromagnetic radiation (EMR); wherein said composition comprises a first material and a second material, wherein the second material has a higher absorption of the radiation than the first material. In an embodiment, the EMR has a wavelength ranging from 10 to 1500 nm and the EMR has a minimum energy density of 0.1 Joule/cm.sup.2. In an embodiment, the EMR comprises UV light, near ultraviolet light, near infrared light, infrared light, visible light, laser, electron beam. In an embodiment, said object comprises a catalyst, a catalyst support, a catalyst composite, an anode, a cathode, an electrolyte, an electrode, an interconnect, a seal, a fuel cell, an electrochemical gas producer, an electrolyser, an electrochemical compressor, a reactor, a heat exchanger, a vessel, or combinations thereof.

SEMICONDUCTOR SUBSTRATE SUPPORT WITH MULTIPLE ELECTRODES AND METHOD FOR MAKING SAME
20220143726 · 2022-05-12 · ·

A method for manufacturing an electrostatic chuck with multiple chucking electrodes made of ceramic pieces using metallic aluminum as the joining. The aluminum may be placed between two pieces and the assembly may be heated in the range of 770 C to 1200 C. The joining atmosphere may be non-oxygenated. After joining the exclusions in the electrode pattern may be machined by also machining through one of the plate layers. The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.

System and Method for Continuous Fabrication of Graded Structured Units Using Additive Manufacturing
20220149411 · 2022-05-12 · ·

A system and method of continuous fabrication of multi-material graded structures using additive manufacturing is disclosed. Using multi-material feedstocks and optimized processing parameters, the gradient on composition and structure are controlled to achieve smooth transition from one functional component to another functional component. A multi-material graded structure is produced as the feedstocks are transported from the feedstock reservoir system comprised of many different materials. Interface transition from one functional layer to the next is gradient, controlled by feedstock mixture ratios based on the flow rate control for the feedstock system. Composition includes chemical composition, physical composition, and porosity. Continuous automatic additive manufacturing method makes the fabrication more efficient and avoids joining problems. This method finds application in fabrication of a fuel cell, battery, reformer and other chemical reaction and process units, including structures made of multiple units, such as stacks, that incorporate multiple functional components.

HIGH OPTICAL POWER LIGHT CONVERSION DEVICE USING A PHOSPHOR ELEMENT WITH SOLDER ATTACHMENT

A light generator comprises a light conversion device and a light source arranged to apply a light beam to the light conversion element. The light conversion device includes an optoceramic or other solid phosphor element comprising one or more phosphors embedded in a ceramic, glass, or other host, a metal heat sink, and a solder bond attaching the optoceramic phosphor element to the metal heat sink. The optoceramic phosphor element does not undergo cracking in response to the light source applying a light beam of beam energy effective to heat the optoceramic phosphor element to the phosphor quenching point.

HIGH OPTICAL POWER LIGHT CONVERSION DEVICE USING A PHOSPHOR ELEMENT WITH SOLDER ATTACHMENT

A light generator comprises a light conversion device and a light source arranged to apply a light beam to the light conversion element. The light conversion device includes an optoceramic or other solid phosphor element comprising one or more phosphors embedded in a ceramic, glass, or other host, a metal heat sink, and a solder bond attaching the optoceramic phosphor element to the metal heat sink. The optoceramic phosphor element does not undergo cracking in response to the light source applying a light beam of beam energy effective to heat the optoceramic phosphor element to the phosphor quenching point.

Shell and processing method of shell

A shell and a method for processing the shell are provided. The method includes: coating a sol prepared in advance on an inner surface of a ceramic shell prepared in advance; sintering the ceramic shell coated with the sol by using a sintering process, and forming a transition layer having nano-sized micro-pores on the inner surface of the ceramic shell.

Process and formulation to join ceramic forms while maintaining structural and physical characteristics across the bond surface
11718731 · 2023-08-08 · ·

A ceramic bonding material including at least one fibrous material, a flux agent and a thickening agent wherein the ceramic bonding material fired at a set temperature to bond the two adjacent substrate faces.

Method of producing a multi-layer ceramic electronic component and multi-layer ceramic electronic component
11721487 · 2023-08-08 · ·

A method of producing a multi-layer ceramic electronic component includes: preparing a multi-layer unit including ceramic layers laminated in a direction of a first axis, internal electrodes disposed between the ceramic layers, and first and second side surfaces facing each other in a direction of a second axis orthogonal to the first axis, the internal electrodes being exposed from the first and second side surfaces; thermocompression-bonding a first side margin sheet to the first side surface; forming a first side margin by punching the thermocompression-bonded first side margin sheet with the first side surface; thermocompression-bonding a second side margin sheet to the second side surface, the second side margin sheet including a bonding surface having a higher flexibility than the first side margin formed on the first side surface; and forming a second side margin by punching the thermocompression-bonded second side margin sheet with the second side surface.