The invention relates to a copper/ceramic composite comprisinga ceramic substrate which contains aluminum oxide, a coating which lies on the ceramic substrate and which is made of copper or a copper alloy, wherein the copper or the copper alloy has a particle size number distribution with a median value d.sub.50, an arithmetic mean value d.sub.arith, and a symmetry value S(Cu)=d.sub.50/d.sub.arith; the aluminum oxide has a particle size number distribution with a median value d.sub.50, an arithmetic mean value d.sub.arith, and a symmetry value S(Al.sub.2O.sub.3)=d.sub.50/d.sub.arith; and S(Al.sub.2O.sub.3) and S(Cu) satisfy the following condition: 0.7<S(Al.sub.2O.sub.3)/S(Cu)1.4.

Systems and methods for imaging in the short wave infrared (SWIR), photodetectors with low dark current and associated circuits for reducing dark currents and methods for generating image information based on data of a photodetector array. A SWIR imaging system may include a pulsed illumination source operative to emit radiation pulses in the SWIR band towards a target resulting in reflected radiation from the target; (b) an imaging receiver including a plurality of Ge PDs operative to detect the reflected SWIR radiation and a controller, operative to control activation of the receiver for an integration time during which the accumulated dark current noise does not exceed the time independent readout noise.

The present invention is a thermoplastic polymer composition which contains 10-120 parts by mass of a polar group-containing polypropylene resin (B) per 100 parts by mass of a thermoplastic elastomer (A) that is a block copolymer having a polymer block containing an aromatic vinyl compound unit and a polymer block composed of a conjugated diene unit having 40% by mole or more of 1,2-bonds and 3,4-bonds in total, or a hydrogenated product of the block copolymer (provided that a thermoplastic polymer composition containing 1 part by mass or more of a polyvinyl acetal resin is excluded). This thermoplastic polymer composition is able to be bonded with a ceramic, a metal or a synthetic resin without requiring a primer treatment, and has excellent flexibility, mechanical characteristics, moldability, heat resistance and storage stability.

Disclosed herein are power electronic modules formed by directly bonding a heat sink to a dielectric substrate using transition liquid phase bonding.

The present invention is a thermoplastic polymer composition which contains 10-120 parts by mass of a polar group-containing polypropylene resin (B) per 100 parts by mass of a thermoplastic elastomer (A) that is a block copolymer having a polymer block containing an aromatic vinyl compound unit and a polymer block composed of a conjugated diene unit having 40% by mole or more of 1,2-bonds and 3,4-bonds in total, or a hydrogenated product of the block copolymer (provided that a thermoplastic polymer composition containing 1 part by mass or more of a polyvinyl acetal resin is excluded). This thermoplastic polymer composition is able to be bonded with a ceramic, a metal or a synthetic resin without requiring a primer treatment, and has excellent flexibility, mechanical characteristics, moldability, heat resistance and storage stability.

A semiconductor manufacturing device member according to the present invention includes a ceramic disc with an internal electrode and a ceramic shaft that supports the disc. The disc and the shaft are integrated without having a bonding interface.

A segmented composite exhaust flue which may be used to shield an area or object from convective, conductive, or radiated heat transfer from hot exhaust combustion gases is described. In certain embodiments, the composite exhaust flue may be used to protect structures from hot exhaust gases and particles such as those produced by cars, trucks, ships, boats, jets, rockets, as well as other vehicles with internal combustion engines, turbines, or rocket motors. In some embodiments, a composite exhaust flue may include an attachment frame removeably holding a plurality of ceramic composite panels where the ceramic composite panels have a ceramic fiber reinforced ceramic composite high temperature face sheet positioned over an insulating layer.

The present disclosure is directed to using MXene compositions as templates for the deposition of oriented perovskite films, and compositions derived from such methods. Certain specific embodiments include methods preparing an oriented perovskite, perovskite-type, or perovskite-like film, the methods comprising: (a) depositing at least one perovskite, perovskite-type, or perovskite-like composition or precursor composition using chemical vapor deposition (CVD), physical vapor deposition (PVD), or atomic layer deposition (ALD) onto a film or layer of a MXene composition supported on a substrate to form a layered composition or precursor composition; and either (b) (1) heat treating or annealing the layered precursor composition to form a layered perovskite-type structure comprising at least one oriented perovskite, perovskite-type, or perovskite-like composition; or (2) annealing the layered composition; or (3) both (1) and (2).

A ceramic bonding material including at least one fibrous material, a flux agent and a thickening agent wherein the ceramic bonding material fired at a set temperature to bond the two adjacent substrate faces.

Embodiments of the invention relate to polycrystalline diamond (PCD) exhibiting enhanced diamond-to-diamond bonding. In an embodiment, PCD includes a plurality of diamond grains defining a plurality of interstitial regions. A metal-solvent catalyst occupies at least a portion of the plurality of interstitial regions. The plurality of diamond grains and the metal-solvent catalyst collectively exhibit a coercivity of about 115 Oersteds (Oe) or more and a specific magnetic saturation of about 15 Gauss.Math.cm.sup.3/grams (G.Math.cm.sup.3/g) or less. Other embodiments are directed to polycrystalline diamond compacts (PDCs) employing such PCD, methods of forming PCD and PDCs, and various applications for such PCD and PDCs in rotary drill bits, bearing apparatuses, and wire-drawing dies.