Thermally-conductive ceramic and ceramic composite components suitable for high temperature applications, systems having such components, and methods of manufacturing such components. The thermally-conductive components are formed by a displacive compensation of porosity (DCP) process and are suitable for use at operating temperatures above 600 C. without a significant reduction in thermal and mechanical properties.

Provided is a polycrystalline ceramic substrate to be bonded to a compound semiconductor substrate with a bonding layer interposed therebetween, wherein at least one of relational expression (1) 0.7<.sub.1/.sub.2<0.9 and relational expression (2) 0.7<.sub.3/.sub.4<0.9 holds, where .sub.1 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30 C. to 300 C. and .sub.2 represents a linear expansion coefficient of the compound semiconductor substrate at 30 C. to 300 C., and .sub.3 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30 C. to 1000 C. and .sub.4 represents a linear expansion coefficient of the compound semiconductor substrate at 30 C. to 1000 C.

A ceramic article includes a flexible backing selected from paper, woven fabric, non-woven fabric, polymeric films, metal foils, and combinations thereof. A green ceramic layer is on a first side of the flexible backing, wherein the green ceramic layer includes a ceramic material and a polymeric binder. A major surface of the green ceramic layer includes a pattern of features.

The present invention is directed to a surface-coated cubic boron nitride sintered material tool including a cBN substrate and a hard coating layer formed on a surface of the cBN substrate and having an alternate laminated structure of A layer and B layer. A peak of the grain size distribution of cBN grains in the cBN sintered material is present within a range of a grain size from 0.50 to 1.00 m. The A layer has a composition of (Ti.sub.1-xAl.sub.x)N (0.4x0.7 in an atomic ratio). The B layer has a composition of (Cr.sub.1-y-zAl.sub.yM.sub.z)N (0.03y0.6 and 0z0.05 in an atomic ratio). An X-ray diffraction peak of a (200) plane is present at a position of a diffraction angle of 43.6 plus or minus 0.1 degrees, and a plastic deformation work ratio of the B layer is 0.35 to 0.50.

The present invention provides a gallium nitride sintered body and a gallium nitride molded article which have high density and low oxygen content without using a special apparatus. According to the first embodiment, a gallium nitride sintered body, which is characterized by having density of 2.5 g/cm.sup.3 to less than 5.0 g/cm.sup.3 and an intensity ratio of the gallium oxide peak of the (002) plane to the gallium nitride peak of the (002) plane of less than 3%, which is determined by X-ray diffraction analysis, can be obtained. According to the second embodiment, a metal gallium-impregnated gallium nitride molded article, which is characterized by comprising a gallium nitride phase and a metal gallium phase that exist as separate phases and having a molar ratio, Ga/(Ga+N), of 55% to 80%, can be obtained.

The invention relates to a copper-ceramic composite comprising: a ceramic substrate; and a copper or copper alloy coating on the ceramic substrate, the copper or copper alloy having grain sizes of 10 m to 300 m.

A brake component is disclosed. In various embodiments, the brake component includes a ceramic matrix composite (CMC) structure including a plurality of nominally dense plies, interleaved with a plurality of interlayers, wherein the plurality of nominally dense plies and the plurality of interlayers are bonded by at least one of a Field Assisted Sintering Technique (FAST), a Spark Plasma Sintering (SPS) process, or a localized heating process. In various embodiments, the brake component is a rotor disk or a stator disk.

Various embodiments of the present disclosure provide an additive manufacturing method. The method includes forming a first layer of a first ceramic material and forming a second layer of a second ceramic material. The method further includes contacting the first layer of the first ceramic material, the second layer of the second ceramic material, or both with a saturant. The method further includes heating the first layer of the first ceramic material, the second layer of the second ceramic material, or both to a temperature in a range of from about 50? C. to about 300? C. The method further includes applying pressure to the first layer of the first ceramic material, the second layer of the second ceramic material, or both. The pressure can be in a range of from about 10 kPa to about 800 MPa. The method further includes at least partially dissolving a portion of an external surface of a ceramic particle of the first layer of the first ceramic material, the second layer of the second ceramic material, or both. The method further includes fusing a portion of the dissolved portion of the external surface of the ceramic particle to from a product having a density in a range of from about 65% to about 100% relative to a corresponding fully densified product and optionally containing no organic binder.

A ceramic matrix composite component includes a first substrate and a second substrate each formed of a silicide-containing ceramic matrix composite, silicon carbide layers respectively coating a bonding surface of the first substrate and a bonding surface of the second substrate, and a bonding layer formed of a silicon-containing alloy and provided between the silicon carbide layer coating the bonding surface of the first substrate and the silicon carbide layer coating the bonding surface of the second substrate.

A pre-stressed curved plate comprising a curved plate having at least one concave surface, the curved plate being enveloped and adhesively bonded with tensioned reinforcing fibers, whereby the reinforcing fibers are first wound around the plate under tension being spaced apart from the concave surface and subsequently subjected to pressure to stretch and bond the reinforcing fibers to the surfaces of the plate, where upon bonding, the tensile strain of the fiber introduces stress in the plate.