A compact, a superabrasive compact and a method of making the compact and superabrasive compact are disclosed. A compact may include a plurality of carbide particles, a binder, and a species. The binder may be dispersed among the plurality of tungsten carbide particles. The species may be dispersed in the compact, wherein the binder has a melting point from about 600° C. to about 1350° C. at ambient pressure. A superabrasive compact may include a diamond table and a substrate. The diamond table may be attached to the substrate. The substrate may have a binder. The melting point of the binder is from about 600° C. to about 1350° C. at high pressure from about 30 kbar to about 100 kbar.

A ceramic composite can include a first ceramic phase and a second ceramic phase. The first ceramic phase can include a silicon carbide. The second phase can include a boron carbide. In an embodiment, the silicon carbide in the first ceramic phase can have a grain size in a range of 0.8 to 200 microns. The first phase, the second phase, or both can further include a carbon. In another embodiment, at least one of the first ceramic phase and the second ceramic phase can have a median minimum width of at least 5 microns.

One example includes a method for fabricating a compound material. The method includes providing a first discrete material layer having a first thickness dimension. The first discrete material layer includes a first material having a first magnetic susceptibility. The method also includes depositing a second discrete material layer having a second thickness dimension over the first discrete material layer. The second discrete material layer can include a second material having a second magnetic susceptibility. The relative first and second thickness dimensions can be selected to provide a desired magnetic susceptibility of the compound material.

A ceramic matrix composite seal is disclosed. The ceramic matrix composite seal including a ceramic matrix and a number of ceramic fiber fabrics embedded in the ceramic matrix. The ceramic matrix composite seal is formed into a strip with a desired geometry such that the seal strip is configured to be assembled with a number of components to create a seal between the components.

The present disclosure relates to a method for manufacturing a ceramic heater. The method for manufacturing a ceramic heater according to the present disclosure comprises: separately charging a ceramic powder into a center portion and multiple split edge portions in a formation mold and leveling the charged ceramic powder; manufacturing a molded body or pre-sintered body of the ceramic powder from the leveled ceramic powder; disposing a high-frequency electrode or a heating element on the molded body or pre-sintered body of the ceramic powder and filling a second ceramic powder; and integrally sintering the molded body or pre-sintered body of the ceramic powder and the second ceramic powder.

A brake component is disclosed. In various embodiments, the brake component includes a ceramic matrix composite (CMC) structure including a plurality of nominally dense plies, interleaved with a plurality of interlayers, wherein the plurality of nominally dense plies and the plurality of interlayers are bonded by at least one of a Field Assisted Sintering Technique (FAST), a Spark Plasma Sintering (SPS) process, or a localized heating process. In various embodiments, the brake component is a rotor disk or a stator disk.

An epitaxy substrate and a method of manufacturing the same are provided. The epitaxy substrate includes a device substrate and a handle substrate. The device substrate has a first surface and a second surface opposite to each other, and a bevel disposed between the first and the second surfaces. The handle substrate is bonded to the second surface of the device substrate, wherein the oxygen content of the device substrate is less than the oxygen content of the handle substrate, and a bonding angle greater than 90° is between the bevel of the device substrate and the handle substrate.

A wiring substrate includes an insulating substrate, a conductor and an Ni film. The insulating substrate has a first surface and a second surface on a side opposite the first surface, and contains AlN. The conductor is disposed on the first surface and contains Cu. The Ni film is disposed so as to extend across an upper surface and a side surface of the conductor to the first surface. Ti oxide is scattered so as to be at a plurality of points on the first surface.

A gas plug of the present disclosure is composed of a columnar porous composite in which a plurality of silicon compound phases containing silicon carbide as a main component are connected to each other via a silicon phase having silicon as a main component. The porous composite is housed inside a tubular body made from a dense ceramic.

A method to form a machinable ceramic matrix composite comprises forming a porous ceramic multilayer on a surface of a fiber preform. In one example, the porous ceramic multilayer comprises a gradient in porosity in a direction normal to the surface. In another example, the porous ceramic multilayer includes low-wettability particles having a high contact angle with molten silicon, where an amount of the low-wettability particles in the porous ceramic multilayer varies in a direction normal to the surface. After forming the porous ceramic multilayer, the fiber preform is infiltrated with a melt, and the melt is cooled to form a ceramic matrix composite with a surface coating thereon. An outer portion of the surface coating is more readily machinable than an inner portion of the surface coating. The outer portion of the surface coating is machined to form a ceramic matrix composite having a machined surface with a predetermined surface finish and/or dimensional tolerance.