C04B2237/36

CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-CLADDED COPPER PLATE
20230269879 · 2023-08-24 ·

A method for preparing a ceramic copper clad laminate is provided, including following steps: providing a copper material; forming a copper oxide layer on a surface of the copper material; thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms in the copper material; removing the copper oxide layer on the thermally treated copper material; and soldering the copper-oxide-layer-removed copper material to a ceramic substrate to obtain a ceramic copper clad laminate.

Article having ceramic wall with flow turbulators
11333036 · 2022-05-17 · ·

An article includes a ceramic matrix composite wall that defines at least a side of a passage. The ceramic wall includes a ceramic matrix composite flow turbulator that projects into the passage. The flow turbulator is formed of ceramic matrix composite. The ceramic matric composite of the wall comprises woven fibers that are dispersed in a ceramic body matrix. An airfoil and a gas turbine engine are also disclosed.

SEMICONDUCTOR SUBSTRATE SUPPORT WITH MULTIPLE ELECTRODES AND METHOD FOR MAKING SAME
20220143726 · 2022-05-12 · ·

A method for manufacturing an electrostatic chuck with multiple chucking electrodes made of ceramic pieces using metallic aluminum as the joining. The aluminum may be placed between two pieces and the assembly may be heated in the range of 770 C to 1200 C. The joining atmosphere may be non-oxygenated. After joining the exclusions in the electrode pattern may be machined by also machining through one of the plate layers. The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.

LOW THERMAL EXPANSION FILM ADHESIVES FOR MULTILAYER TRANSPARENT ARMOUR AND RELATED APPLICATIONS

The present disclosure is directed to a composite material comprising a thermoplastic adhesive and nanotubes oriented in the in-plane orientation. In additional aspects, the disclosure includes a laminated armor material comprising the composite and armor materials.

Process and formulation to join ceramic forms while maintaining structural and physical characteristics across the bond surface
11718731 · 2023-08-08 · ·

A ceramic bonding material including at least one fibrous material, a flux agent and a thickening agent wherein the ceramic bonding material fired at a set temperature to bond the two adjacent substrate faces.

Contact and Method for Making the Same

The present application discloses a contact, which comprises a contact opening, and a Ti layer, a glue layer and a tungsten layer which completely fill the contact opening; the Ti layer is subjected to annealing treatment; the tungsten layer comprises a tungsten seed layer and a tungsten body layer; the glue layer consists of a TiN layer which is divided into a plurality of TiN sub-layers, all or part of the TiN sub-layers are subjected to the annealing treatment, and the size of grains of the TiN sub-layer subjected to the annealing treatment is limited by the thickness of the corresponding TiN sub-layer. The present application further discloses a method for making a contact. The present application can prevent the annealing treatment of the TiSi layer from producing large lattice grains in the glue layer, thus can make the tungsten seed layer be a continuous structure.

Semiconductor substrate support with multiple electrodes and method for making same

A method for manufacturing an electrostatic chuck with multiple chucking electrodes made of ceramic pieces using metallic aluminum as the joining. The aluminum may be placed between two pieces and the assembly may be heated in the range of 770 C to 1200 C. The joining atmosphere may be non-oxygenated. After joining the exclusions in the electrode pattern may be machined by also machining through one of the plate layers. The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.

METHODS AND SYSTEMS FOR IN-PLANE SLURRY INFILTRATION OF COMPOSITE PREFORMS
20210355038 · 2021-11-18 · ·

Systems and methods for infiltrating a fibrous preform in the in-plane direction and forming composite components are provided. A system for infiltrating a fibrous preform may include a slurry reservoir defining a cavity configured to receive a fibrous preform. The cavity may be configured such that an internal surface of the slurry reservoir is spaced apart from an outer diameter of the fibrous preform. A slurry inlet may be formed in the slurry reservoir. The slurry inlet and the cavity may be configured such that a slurry input into the cavity infiltrates the fibrous preform in an in-plane direction.

CERAMIC-COPPER COMPOSITE, METHOD OF PRODUCING CERAMIC-COPPER COMPOSITE, CERAMIC CIRCUIT BOARD, AND POWER MODULE

A ceramic-copper composite having a flat plate shape, including: a ceramic layer; a copper layer; and a brazing material layer present between the ceramic layer and the copper layer. When a region having a length of 1,700 μm in a long-side direction is a region P on a cut surface of the ceramic-copper composite obtained when the ceramic-copper composite is cut with a plane perpendicular to a main surface of the ceramic-copper composite, an average crystal grain size D1 of copper crystals at least partially present in a region P1 within 50 μm on a side of the copper layer from an interface between the ceramic layer and the brazing material layer in the region P is 30 μm or more and 100 μm or less.

PROCESS FOR OBTAINING COMPOSITE, ULTRA-REFRACTORY, FIBRE-REINFORCED CERAMIC MATERIALS

The present invention relates to a process for preparing a composite, ultra-refractory, fibre-reinforced ceramic material obtained through the infiltration of carbon and/or silicon carbide fibres with a ceramic suspension comprising yttrium, lanthanum and/or scandium compounds, and the subsequent densification of the composite. The fibre-reinforced UHTC compounds obtained by the process can be used for making items intended for use in extreme temperature and pressure conditions.