Patent classifications
C04B2237/36
DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING
A method includes applying a sintering precursor material layer to each of a first surface and a second surface of a ceramic tile, and assembling a precursor assembly of a direct bonded copper (DBC) substrate by coupling a first leadframe on the sinter precursor material layer on the first surface of the ceramic tile and a second leadframe on the second surface of the sinter precursor material layer on a second surface of the ceramic tile such that the ceramic tile is disposed between the first leadframe and the second leadframe. The method further includes sinter bonding the first leadframe and the second leadframe to the ceramic tile to form a sinter bonded DBC substrate.
PASSIVE Q-SWITCHED LASERS AND METHODS FOR OPERATION AND MANUFACTURE THEREOF
Systems and methods for imaging in the short wave infrared (SWIR), photodetectors with low dark current and associated circuits for reducing dark currents and methods for generating image information based on data of a photodetector array. A SWIR imaging system may include a pulsed illumination source operative to emit radiation pulses in the SWIR band towards a target resulting in reflected radiation from the target; (b) an imaging receiver including a plurality of Ge PDs operative to detect the reflected SWIR radiation and a controller, operative to control activation of the receiver for an integration time during which the accumulated dark current noise does not exceed the time independent readout noise.
DENSE COMPOSITE MATERIAL, METHOD FOR PRODUCING THE SAME, JOINED BODY, AND MEMBER FOR SEMICONDUCTOR MANUFACTURING DEVICE
According to the present invention, a dense composite material includes titanium silicide in an amount of 43 to 63 mass %; silicon carbide in an amount less than the mass percentage of the titanium silicide; and titanium carbide in an amount less than the mass percentage of the titanium silicide. In the dense composite material, a maximum value of interparticle distances of the silicon carbide is 40 μm or less, a standard deviation of the interparticle distances is 10 or less, and an open porosity of the dense composite material is 1% or less.
COPPER-CERAMIC COMPOSITE
The invention relates to a copper-ceramic composite comprising:—a ceramic substrate;—a copper or copper alloy coating in which the copper or copper alloy has grain sizes of 10 μm to 300 μm and a number distribution of the grain sizes with a median d.sub.50 and an arithmetic mean d.sub.arith, the ratio of d.sub.50 to d.sub.arith (d.sub.50/d.sub.arith) being between 0.75 and 1.10.
Self-healing matrix for a ceramic composite
A method for forming a self-healing ceramic matrix composite (CMC) component includes depositing a first self-healing particulate material in a first region of a CMC preform of the CMC component and depositing a second self-healing particulate material having a different chemical composition than the first self-healing particulate material in a second region of the CMC preform distinct from the first region.
Copper/ceramic composite
The invention relates to a copper/ceramic composite comprising—a ceramic substrate which contains aluminum oxide, —a coating which lies on the ceramic substrate and which is made of copper or a copper alloy, wherein the copper or the copper alloy has a particle size number distribution with a median value d.sub.50, an arithmetic mean value d.sub.arith, and a symmetry value S(Cu)=d.sub.50/d.sub.arith; the aluminum oxide has a particle size number distribution with a median value d.sub.50, an arithmetic mean value d.sub.arith, and a symmetry value S(Al.sub.2O.sub.3)=d.sub.50/d.sub.arith; and S(Al.sub.2O.sub.3) and S(Cu) satisfy the following condition: 0.7≤S(Al.sub.2O.sub.3)/S(Cu)≤1.4.
Copper-ceramic composite
The invention relates to a copper-ceramic composite comprising: a ceramic substrate; and a copper or copper alloy coating on the ceramic substrate, the copper or copper alloy having grain sizes of 10 μm to 300 μm.
Joint surface coatings for ceramic components
An example article may include a component, a substrate including a first ceramic, a joining layer between the component and the substrate, and a joint surface coating between the substrate and the joining layer. The joint surface coating may include a diffusion barrier layer including a second ceramic material, and a compliance layer including at least one of a metal or a metalloid. An example technique may include holding a first joining surface of a coated component adjacent a second joining surface of a second component. The example technique may further include heating at least one of the coated component, the second component, and a braze material, and brazing the coated component by allowing the braze material to flow in a region between the first joining surface and the second joining surface.
CERAMIC MATERIAL, METHOD OF PRODUCTION, LAYER AND LAYER SYSTEM
A ceramic material including at least erbium oxide (Er2O3)-stabilized zirconium oxide (ZrO2). The erbium oxide-stabilized zirconium oxide can be used as ceramic thermal barrier layer. Crack resistance of such ceramic materials is considerably increased by using erbium oxide-stabilized zirconium oxide.
HYDROTHERMAL-ASSISTED TRANSIENT JET FUSION ADDITIVE MANUFACTURING
Various embodiments of the present disclosure provide an additive manufacturing method. The method includes forming a first layer of a first ceramic material and forming a second layer of a second ceramic material. The method further includes contacting the first layer of the first ceramic material, the second layer of the second ceramic material, or both with a saturant. The method further includes heating the first layer of the first ceramic material, the second layer of the second ceramic material, or both to a temperature in a range of from about 50° C. to about 300° C. The method further includes applying pressure to the first layer of the first ceramic material, the second layer of the second ceramic material, or both. The pressure can be in a range of from about 10 kPa to about 800 MPa. The method further includes at least partially dissolving a portion of an external surface of a ceramic particle of the first layer of the first ceramic material, the second layer of the second ceramic material, or both. The method further includes fusing a portion of the dissolved portion of the external surface of the ceramic particle to from a product having a density in a range of from about 65% to about 100% relative to a corresponding fully densified product and optionally containing no organic binder.