A non-dense sintered ceramic molded body having at least two layers, wherein a first powdery ceramic material forming a layer is contacted with at least a second powdery material forming at least a second layer. The body has a color gradient and maintains dimensional stability during sintering and forming. An admixing component and a common sintering temperature are used to control the volume decrease of the layers during sintering.

A method of producing a ceramic matrix composite including a protective ceramic coating thereon comprises applying a surface slurry onto an outer surface of an impregnated fiber preform. The surface slurry includes particulate ceramic solids dispersed in a flowable preceramic polymer comprising silicon, and the impregnated fiber preform comprises a framework of ceramic fibers loaded with particulate matter. The flowable preceramic polymer is cured, thereby forming on the outer surface a composite layer comprising a cured preceramic polymer with the particulate ceramic solids dispersed therein. The cured preceramic polymer is then pyrolyzed to form a porous ceramic layer comprising silicon carbide, and the impregnated fiber preform and the porous ceramic layer are infiltrated with a molten material comprising silicon. After infiltration, the molten material is cooled to form a ceramic matrix composite body with a protective ceramic coating thereon.

A wiring board includes an insulating substrate and a wiring conductor. The insulating substrate includes a first layer having an upper surface and a lower surface and having a first content of aluminum oxide and containing mullite and a second layer stacked on the upper surface and/or the lower surface of the first layer and having a second content of aluminum oxide greater than the first content. The wiring conductor is located inside the first layer and contains a manganese compound and/or a molybdenum compound. A manganese silicate phase and/or a magnesium silicate phase in an interface area between the insulating substrate and the wiring conductor.

An intermediate member is a member which is directly or indirectly sandwiched between a first object and a second object. The intermediate member includes a plate-like supporting member having a lower surface which is one main surface opposed to the first object and a plurality of ceramic blocks fixed on an upper surface which is the other main surface of the supporting member in a state of being separated from one another. Thus, in a state where the plurality of ceramic blocks are collectively held by the supporting member having relatively high shape retention, by disposing the intermediate member between the objects, it is possible to easily arrange the plurality of ceramic blocks between the objects with high positioning accuracy.

The disclosure provides seals for devices that operate at elevated temperatures and have reactive metal vapors, such as lithium, sodium or magnesium. In some examples, such devices include energy storage devices that may be used within an electrical power grid or as part of a standalone system. The energy storage devices may be charged from an electricity production source for later discharge, such as when there is a demand for electrical energy consumption.

A ceramic member includes a voltage supply rod capable of reducing a local temperature drop of the ceramic member. The ceramic member comprises a ceramic base, a metal body disposed inside the ceramic base, and a voltage supply rod made of an electrically conductive material and having a far end portion electrically connected to the metal body. The far end portion is located at an end of the voltage supply rod in a longitudinal direction. The voltage supply rod also includes a heat-transfer reducing portion continuous with the far end portion. The heat-transfer reducing portion has thermal conductivity k2 and a cross-sectional area A2 in a cross section taken perpendicularly to the longitudinal direction. The thermal conductivity k2 and the cross-sectional area A2 satisfy a formula k2.Math.A2<k1.Math.A1, where k1 denotes thermal conductivity of the base end portion, and A1 denotes a cross-sectional area of the base end portion.

Disclosed herein are electrically conductive and hermetic vias disposed within an insulator substrate of a feedthrough assembly and methods for making and using the same. Such aspects of the present invention consequently provide for the miniaturization of feedthrough assemblies inasmuch as the feedthrough components of the present invention are capable of supporting very small and hermetic conductively filled via holes in the absence of additional components, such as, for example, terminal pins, leadwires, and the like.

An electric heating support includes an electrically conductive honeycomb structure having an outer peripheral wall and porous partition walls disposed on an inner side of the outer peripheral wall, the porous partition walls defining a plurality of cells, each cell penetrating from one end face to other end face to form a flow path. A pair of metal terminals are disposed so as to face each other across a central axis of the honeycomb structure, each metal terminal being joined to a surface of the honeycomb structure via a welded portion. The honeycomb structure is composed of ceramics and a metal. The honeycomb structure contains 40% by volume or less of the metal. The welded portion of the honeycomb structure has a surface containing 40% by volume or more of the metal.

Vessels selected from crucibles, pans, open cups and saggars essentially comprising of two components, from which (A) one component being a ceramic matrix composite, and (B) the second component being from metal or alloy, and wherein component (A) is the inner one.

A method of forming one or more high temperature co-fired ceramic articles, comprising the steps of:

a) forming a plurality of green compacts, by a process comprising dry pressing a powder comprising ceramic and organic binder to form a green compact;
b) disposing a conductor or conductor precursor to at least one surface of at least one of the plurality of green compacts to form at least one patterned green compact;
c) assembling the at least one patterned green compact with one or more of the plurality of green compacts or patterned green compacts or both to form a laminated assembly;
d) isostatically pressing the laminated assembly to form a pressed laminated assembly;
e) firing the pressed laminated assembly at a temperature sufficient to sinter the ceramic layers together.