An intermediate member is a member which is directly or indirectly sandwiched between a first object and a second object. The intermediate member includes a plate-like supporting member having a lower surface which is one main surface opposed to the first object and a plurality of ceramic blocks fixed on an upper surface which is the other main surface of the supporting member in a state of being separated from one another. Thus, in a state where the plurality of ceramic blocks are collectively held by the supporting member having relatively high shape retention, by disposing the intermediate member between the objects, it is possible to easily arrange the plurality of ceramic blocks between the objects with high positioning accuracy.

Methods of forming a metallic-ceramic brazed joint are disclosed herein. The method of forming the brazed joint includes deoxidizing the surface of metallic components, assembling the joint, heating the joint to fuse the joint components, and cooling the joint. In certain embodiments, the brazed joint includes a conformal layer. In further embodiments, the brazed joint has features in order to reduce stress concentrations within the joint.

A method of fabricating a curved surface bonding technique using low melting temperature nanoparticles or nanofilms/nanoparticles of reactive metals as eutectic compounds. The ability of nanomaterials to melt at low temperature lowers the bonding temperature and reduces/eliminates the residual stresses generated in bulk material during the bonding process of two materials with different coefficients of thermal expansion. The nanoscale materials will then be integrated and the new bond will assume properties of the bulk material, including its higher melting temperature.

A target is formed of a sintering-resistant material of high-melting point metal alloy, high-melting point metal silicide, high-melting point metal carbide, high-melting point metal nitride or high-melting point metal boride comprising a structure in which a material formed of a sintering-resistant material of high-melting point metal alloy, high-melting point metal silicide, high-melting point metal carbide, high-melting point metal nitride or high-melting point metal boride and a high-melting point metal plate other than the target are bonded. A production method of such a target is provided. Further the generation of cracks during the target production and high power sputtering, and the reaction of the target raw material with the die during hot pressing can be inhibited effectively, and the warpage of the target can be reduced.

A method of manufacturing a susceptor includes preparing an electrostatic chuck (ESC) and a base plate, each including a gas channel, preparing a bush-filter assembly disposed between the gas channel in the ESC and the gas channel in the base plate, and coupling the ESC to the base plate in such a manner that a portion of the bush-filter assembly is accommodated in a first accommodation part formed in a surface of the ESC and that a remaining portion of the bush-filter assembly is at least partially accommodated in a second accommodation part formed in a surface of the base plate.

A system for producing chemicals, such as, ethylene or gasoline, at high temperature (above 1100 degrees C.) having a feedstock source. The system includes a chemical conversion portion connected with the feedstock source to receive feedstock and convert the feedstock to ethylene or gasoline. The conversion portion includes a coil array and a furnace that heats the feedstock to temperatures in excess of 1100 C. or 1200 C. or even 1250 C. or even 1300 C. or even 1400 C. A method for producing chemicals, such as ethylene or gasoline, at high temperature.

A method for fabricating assemblies that includes providing a first component that further includes silicon carbide and that has an upper portion and a tapered lower portion; providing a second component that further includes silicon carbide and that has an upper portion that is adapted to receive the tapered lower portion of the first component; providing a predetermined amount of multiphase AlSi braze foil; grinding the AlSi braze foil into a powder; mixing a predetermined amount of braze paste binder with the AlSi powder to form a slurry; uniformly applying the slurry to the tapered lower portion of the first component; uniformly applying the slurry to the upper portion of the second component and inserting the tapered lower portion of the first component into the upper portion of the second component; and heating the applied slurry to a temperature of 725 C. to 1450 C. for a predetermined period of time.

Vitreous or at least partly crystallized sealing material is provided. The sealing material is from the system SiO.sub.2B.sub.2O.sub.3CaOMgO, which is free from BaO and/or SrO and which has an improved coefficient of thermal expansion and improved crystallization properties. The sealing material is employed to produce joint connections, electrical feedthroughs, and/or as a barrier layer.

A method of brazing a sintered zirconia ceramic body, comprises: providing a sintered zirconia ceramic body having a surface; chemically reducing the sintered zirconia ceramic body in whole or in part to form a reduced surface to the sintered zirconia ceramic body; applying a brazing material to at least part of the reduced surface to form an assembly comprising said brazing material and sintered zirconia ceramic body; heating said assembly to a temperature sufficient to at least partially melt the brazing material such that the brazing material wets the reduced surface; and cooling the assembly to solidify the brazing material.

A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of forming a ceramic body in a green state, or, stacking discrete layers of ceramic in a green state upon one another and laminating together. The ceramic body has a first side opposite a second side. At least one via hole is formed straight through the ceramic body extending between the first and second sides. At least one via hole is filled with a conductive paste. The ceramic body and the conductive paste are then dried. The ceramic body and the conductive paste are isostatically pressed at above 1000 psi to remove voids and to form a closer interface for sintering. The ceramic body and the conductive paste are sintered together to form the feedthrough dielectric body. The feedthrough dielectric body is hermetically sealed to a ferrule.