Patent classifications
C04B2237/405
Electrochemical energy storage devices
Provided herein are energy storage devices. In some cases, the energy storage devices are capable of being transported on a vehicle and storing a large amount of energy. An energy storage device is provided comprising at least one liquid metal electrode, an energy storage capacity of at least about 1 MWh and a response time less than or equal to about 100 milliseconds (ms).
CERAMIC COMPONENT AND THREE-DIMENSIONAL MANUFACTURING METHOD OF CERAMIC COMPONENT
A ceramic component is provided that is suitable to be placed in high temperature environment. The component includes a first member that is formed of a first material, and a ceramic layer that is bonded to a surface of the first member, which is a side exposed to the high temperature environment and that is formed of a ceramic material having a higher heat resistance than that of the first member. A bonding portion between the first member and the ceramic layer is formed of a composite material having the first material and the ceramic material, and a gradient composition in which an abundance ratio of the first material gradually decreases and an abundance ratio of the ceramic material gradually increases in a direction from the first member to the ceramic layer.
RAPID CERAMIC PROCESSING TECHNIQUES AND EQUIPMENT
Provided herein are rapid, high quality film sintering processes that include high-throughput continuous sintering of lithium-lanthanum zirconium oxide (lithium-stuffed garnet). The instant disclosure sets forth equipment and processes for making high quality, rapidly-processed ceramic electrolyte films. These processes include high-throughput continuous sintering of lithium-lanthanum zirconium oxide for use as electrolyte films. In certain processes, the film is not in contact with any surface as it sinters (i.e., during the sintering phase).
Method for producing a composite material
A method for producing a composite material comprising a planar base material to which an additional layer is applied on one side or both sides via a solder layer, characterized by: providing the base material, wherein the base material has a first surface on at least one side; providing the additional layer and arranging the solder layer between a second surface of the additional layer and the first surface such that when the additional layer is deposited on the first surface, the first surface of the base material is covered by the solder layer in a planar manner; wherein a thickness of the solder layer between the base material and the additional layer is smaller than 12 m; heating the base material and the additional layer on the first surface to at least partially melt the solder layer; and connecting the base material to the at least one additional layer.
Heating module of electronic cigarette atomizer
A heating module of an electronic cigarette atomizer includes a ceramic rod, a connecting element and a heating wire. The heating wire is wound around the ceramic rod, the connecting element is connected to two ends of the heating wire respectively, and the ceramic rod is of a hollow micro-porous structure.
METAL SOLID PRODUCTION METHOD
Provided is a method for producing a metal solid, the method being capable of easily producing a metal solid. A method for producing a metal solid, the method comprising covering at least a portion of the periphery of a metal powder with a high-melting-point material having a melting point higher than the melting point of the metal powder; and irradiating the metal powder, at least a portion of the periphery of which is covered with the high-melting-point material, with microwaves to heat the metal powder, thereby sintering or melt-solidifying the metal powder.
METAL SOLID PRODUCTION METHOD
Provided is a method for producing a metal solid, the method being capable of easily producing a metal solid. A method for producing a metal solid, the method comprising covering at least a portion of the periphery of a metal powder with a high-melting-point material having a melting point higher than the melting point of the metal powder; and irradiating the metal powder, at least a portion of the periphery of which is covered with the high-melting-point material, with microwaves to heat the metal powder, thereby sintering or melt-solidifying the metal powder.
JOINED SOLID PRODUCTION METHOD
A method for producing a joined solid, the method comprising placing a metal powder on a solid; covering at least a portion of the periphery of the metal powder with a high-melting-point material having a melting point higher than the melting point of the metal powder; and irradiating the metal powder, at least a portion of the periphery of which is covered with the high-melting-point material, with microwaves to heat the metal powder, thereby sintering or melt-solidifying the metal powder to form a metal solid on the solid.
BRAZED JOINT AND SEMICONDUCTOR PROCESSING CHAMBER COMPONENT HAVING THE SAME
Methods of forming a metallic-ceramic brazed joint are disclosed herein. The method of forming the brazed joint includes deoxidizing the surface of metallic components, assembling the joint, heating the joint to fuse the joint components, and cooling the joint. In certain embodiments, the brazed joint includes a conformal layer. In further embodiments, the brazed joint has features in order to reduce stress concentrations within the joint.
Joined body manufacturing method and joined body
In a step (a), a ceramic substrate, a brazing material including a metal having a large thermal expansion coefficient, a porous body having a smaller thermal expansion coefficient than the brazing material, and a feeding terminal are placed on a joint surface in such a way that a joint surface of the feeding terminal faces a joint surface of the ceramic substrate. In a step (b), the brazing material is fused to allow the brazing material to penetrate into the pores of the porous body. In this manner, a joint layer containing the brazing material and the porous body is formed, and the joint surface of the ceramic substrate and the joint surface of the feeding terminal are joined to each other through the joint layer.