Embodiments relate to polycrystalline diamond compacts (PDCs) and methods of manufacturing such PDCs in which an at least partially leached polycrystalline diamond (PCD) table is infiltrated with a low viscosity cobalt-based alloy infiltrant.

Provided herein are rapid, high quality film sintering processes that include high-throughput continuous sintering of lithium-lanthanum zirconium oxide (lithium-stuffed garnet). The instant disclosure sets forth equipment and processes for making high quality, rapidly-processed ceramic electrolyte films. These processes include high-throughput continuous sintering of lithium-lanthanum zirconium oxide for use as electrolyte films. In certain processes, the film is not in contact with any surface as it sinters (i.e., during the sintering phase).

A method for joining engine components includes positioning a first plurality of thermal protection structures across a thermal protection space between a first thermal protection surface and a second thermal protection surface. The first and second engine components are locally joined by forming a first plurality of transient liquid phase (TLP) or partial transient liquid phase (PTLP) bonds along corresponding ones of the first plurality of thermal protection structures between the first thermal protection surface and the second thermal protection surface. The second thermal protection surface is formed from a second surface material different from a first surface material of the first thermal protection surface.

A superconducting wire rod connection structure can comprise first and second superconducting wire rods, wherein the first and second superconducting wire rods are formed by layering a base material, an intermediate layer, and a superconducting conductor layer. The base materials of the first and second superconducting wire rods can be joined to each other, and the superconducting conductor layers of the first and second superconducting wire rods can be connected by a connection wire rod including a superconducting conductor layer. Further, the superconducting wire rod connection structure can comprise a separating portion in which connection ends of the first and second superconducting wire rods with the base materials joined to each other are separated from the connection wire rod.

A method for producing a joined solid, the method comprising placing a metal powder on a solid; covering at least a portion of the periphery of the metal powder with a high-melting-point material having a melting point higher than the melting point of the metal powder; and irradiating the metal powder, at least a portion of the periphery of which is covered with the high-melting-point material, with microwaves to heat the metal powder, thereby sintering or melt-solidifying the metal powder to form a metal solid on the solid.

The present disclosure concerns the removal of various species from the surface of films and bilayers comprising inorganic material.

The present disclosure concerns the removal of various species from the surface of films and bilayers comprising inorganic material.

The invention relates to a blank for the production of a molded body, in particular a dental reconstruction. The blank has a base and at least one region that emanates therefrom and projects above the base, from which at least a part of the molded body can be derived by working.

Provided is a method for producing a metal solid, the method being capable of easily producing a metal solid. A method for producing a metal solid, the method comprising covering at least a portion of the periphery of a metal powder with a high-melting-point material having a melting point higher than the melting point of the metal powder; and irradiating the metal powder, at least a portion of the periphery of which is covered with the high-melting-point material, with microwaves to heat the metal powder, thereby sintering or melt-solidifying the metal powder.

A member for semiconductor manufacturing device includes a susceptor which is a ceramic plate formed of AlN and a gas introduction pipe which is joined to the susceptor. An annular pipe joining bank is provided at a position of the susceptor facing a flange of the gas introduction pipe. In addition, a pipe brazed part is formed between the flange and the pipe joining bank. The flange has a width of 3 mm or more and a thickness of from 0.5 to 2 mm. It is preferable that the height of the pipe joining bank be 0.5 mm or more, the edge of the bank facing the outer edge of the flange. be chamfered as designated by C0.3 or more or rounded as designated by R0.3 or more.