Patent classifications
C
CHEMISTRY; METALLURGY
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C04
CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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C04B
LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
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2237/00
Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
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C04B2237/50
Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
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C04B2237/55
Pre-treatments of a coated or not coated substrate other than oxidation treatment in order to form an active joining layer
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C04B2237/555
on a substrate not containing an interlayer coating, leading to the formation of an interlayer coating
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C04B2237/555

HEAT DISSIPATION SUBSTRATE FOR A POWER SEMICONDUCTOR MODULE AND A CONVERTER INCLUDING THE SAME
20250316557 · 2025-10-09 · ·

A heat dissipation substrate for a power semiconductor module may include an insulating substrate; a first metal plate disposed on the insulating substrate; a second metal plate disposed under the insulating substrate; and a filler disposed within the insulating substrate. The filler may be in contact with a lower surface of the first metal plate.