A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be on a non-diffusable type, such as aluminum nitride, alumina, beryllium oxide, and zirconia, and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

A cover lid for use with a semiconductor package is disclosed. First, a polyamide mask is applied to one surface of the lid plate. Next, the exposed areas of the surface, as well as the sides of the lid plate, are metallized. The polyamide mask can then be removed. This reduces pullback and shrinkage of the metallized layer, while lowering the manufacturing cost and process times.

A method of manufacturing an electrostatic chuck includes: preparing a first ceramic plate having a first hole formed therein; preparing a second ceramic plate having a second hole formed at a position different from a position of the first hole in a horizontal direction; forming a first slurry layer on the first ceramic plate or the second ceramic plate with a first slurry, the first slurry layer having a flow path formed therein to connect the first hole and the second hole; stacking the first ceramic plate and the second ceramic plate one above the other via the first slurry layer, and bonding the first ceramic plate and the second ceramic plate stacked one above the other via the first slurry layer.

A cover lid for use with a semiconductor package is disclosed. First, a polyamide mask is applied to one surface of the lid plate. Next, the exposed areas of the surface, as well as the sides of the lid plate, are metallized. The polyamide mask can then be removed. This reduces pullback and shrinkage of the metallized layer, while lowering the manufacturing cost and process times.

In a copper-ceramic bonded body of the present invention, at a bonding interface of a copper member and a ceramic member, there are formed a nitride compound layer containing one or more nitride forming elements selected from Ti, Nb, Hf, and Zr, and an Ag—Cu eutectic layer, in order from the ceramic member side, the thickness of the nitride compound layer is 0.15 μm or more and 1.0 μm or less, an intermetallic compound phase formed of an intermetallic compound that contains the nitride forming element and Si is present between the copper member and the ceramic member, and Cu and Si are present at the grain boundary of the nitride compound layer.

Methods of forming ceramic matrix composite structures include joining at least two lamina together to form a flexible ceramic matrix composite structure. Ceramic matrix composite structures include at least one region of reduced inter-laminar bonding at a selected location between lamina thereof. Thermal protection systems include at least one seal comprising a ceramic matrix composite material and have at least one region of reduced inter-laminar bonding at a selected location between lamina used to form the seal. Methods of forming thermal protection systems include providing one or more such seals between adjacent panels of a thermal protection system.

A method for producing an acoustic attenuation panel from a composite material with a ceramic oxide matrix is provided that includes draping a plurality of plies having fibrous reinforcements including fibers of ceramic material in a mold to define a first skin, depositing blocks made of fugitive material on the first skin such that a space between two blocks is defined, and draping a second plurality of plies on a surface formed by the blocks such that a second skin is defined. Rounded corners of the blocks define radii for connecting the first and second skins with walls of a honeycomb core of the acoustic panel. The method further includes using a liquid medium to infiltrate the skins and spaces with a precursor of a ceramic phase, removing the liquid medium by evaporation or polymerization, and sintering to consolidate the ceramic oxide material and removal the fugitive material.

An assembly includes a first member, a second member adjacent to the first member, and an aluminum material. At least one of the first member and the second member defines at least one trench. The aluminum material is disposed within the trench and bonds the first member to the second member along adjacent faces. A spacing between the first member and the second member along the adjacent faces is less than 5 m and a surface roughness of the adjacent faces of the first and second ceramic members is between 5 mm and 100 nanometers.

A thermally-actuatable gas valve assembly comprising a ceramic heater is shown and described. The gas valve assembly comprises a housing with a gas inlet and a gas outlet. A bimetal thermal actuator has a valve plug that removably seals the gas outlet from the interior of the housing. The ceramic heater is energizable to cause the thermal actuator to deflect which unseats the valve plug from the gas outlet, thereby placing the gas outlet in fluid communication with the gas inlet and the interior of the housing. A gas heating system is also shown and described in which the gas valve assembly selectively supplies cooking gas to a silicon nitride ceramic igniter. The igniter and the heater are in series such that when a source of alternating current is applied across the igniter and the heater, the igniter reaches the autoignition temperature of the combustion gas before the valve assembly opens

An assembly includes a first member, a second member adjacent to the first member, and an aluminum material. At least one of the first member and the second member defines at least one trench. The aluminum material is disposed within the trench and bonds the first member to the second member along adjacent faces. In one form, a spacing between the first member and the second member along the adjacent faces is less than 5 m.