In a copper-ceramic bonded body of the present invention, at a bonding interface of a copper member and a ceramic member, there are formed a nitride compound layer containing one or more nitride forming elements selected from Ti, Nb, Hf, and Zr, and an AgCu eutectic layer, in order from the ceramic member side, the thickness of the nitride compound layer is 0.15 m or more and 1.0 m or less, an intermetallic compound phase formed of an intermetallic compound that contains the nitride forming element and Si is present between the copper member and the ceramic member, and Cu and Si are present at the grain boundary of the nitride compound layer.

Provided is a polycrystalline ceramic substrate to be bonded to a compound semiconductor substrate with a bonding layer interposed therebetween, wherein at least one of relational expression (1) 0.7<.sub.1/.sub.2<0.9 and relational expression (2) 0.7<.sub.3/.sub.4<0.9 holds, where .sub.1 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30 C. to 300 C. and .sub.2 represents a linear expansion coefficient of the compound semiconductor substrate at 30 C. to 300 C., and .sub.3 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30 C. to 1000 C. and .sub.4 represents a linear expansion coefficient of the compound semiconductor substrate at 30 C. to 1000 C.

According to an aspect of the invention, there is provided a plasma-resistant member including: a base member; and a layer structural component formed at a surface of the base member, the layer structural component including an yttria polycrystalline body and being plasma resistant, the layer structural component including a first uneven structure, and a second uneven structure formed to be superimposed onto the first uneven structure, the second uneven structure having an unevenness finer than an unevenness of the first uneven structure.

A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

A method for fabricating assemblies that includes providing a first component that further includes silicon carbide and that has an upper portion and a tapered lower portion; providing a second component that further includes silicon carbide and that has an upper portion that is adapted to receive the tapered lower portion of the first component; providing a predetermined amount of multiphase AlSi braze foil; grinding the AlSi braze foil into a powder; mixing a predetermined amount of braze paste binder with the AlSi powder to form a slurry; uniformly applying the slurry to the tapered lower portion of the first component; uniformly applying the slurry to the upper portion of the second component and inserting the tapered lower portion of the first component into the upper portion of the second component; and heating the applied slurry to a temperature of 725 C. to 1450 C. for a predetermined period of time.

An apparatus can include a ceramic component, a metal component, and a glass sealing material that bonds the ceramic and metal components to each other. In an embodiment, the coefficients of thermal expansion of the components and glass sealing material can be within 4 ppm/ C. of one another. The metal component may be relatively oxidation resistant. The glass sealing material may have a relatively low amount of an amorphous phase as compared to one or more crystalline phases within the glass sealing material. The apparatuses can exhibit good bond strength even after long term exposure to high temperature, thermal cycling to a high temperature, or both. In an embodiment, the metal component may allow another metal component of a different composition to be used without a significant impact on the integrity of the bonded apparatus.

Described is a process for preparing a ceramic substrate bonded with a metal foil. Moreover, described is a metal-ceramic-substrate provided with a thick-film layer and the use of a thick-film paste for bonding a metal foil onto a ceramic substrate.

A unitary ceramic component is provided that includes a first ceramic component; a second ceramic component; and a series-hybrid joint coupling the first ceramic component to the second ceramic component. The series-hybrid joint includes a first bonding interface coupling the first ceramic component and the second ceramic component and a second bonding interface coupling the first ceramic component and the second ceramic component. The first bonding interface exhibits properties that are different from the second bonding interface.

Method of manufacturing a metal-ceramic substrate (1) which, in the finished state, has a ceramic layer (11) and a metal layer (12) extending along a main extension plane (HSE) and arranged one above the other along a stacking direction (S) extending perpendicularly to the main extension plane (HSE) comprising providing the metal layer (12) and the ceramic layer (11) and bonding the metal layer (12) to the ceramic layer (11) in regions to form a first region (B1), which has a materially bonded connection between the metal layer (12) and the ceramic layer (11), and a second region (B2), in which the metal layer (12) and the ceramic layer (11) are arranged one above the other without a materially bonded connection, as seen in the stacking direction (S).

Provided is a gas sensor free from an unbonded space being in communication with an internal space. A gas sensor, which includes a sensor element including a plurality of layers that are bonded and formed of an oxygen-ion conductive solid electrolyte and which reduces a predetermined gas component of a measurement gas to identify a concentration of the gas component on the basis of a current flowing through the solid electrolyte, includes an internal space in which a measurement gas having the ability to reduce the gas component is provided. Of the plurality of layers, an interlaminar bonding layer, which bonds a layer forming a bottom surface of the internal space and a layer forming a side surface of the internal space, projects into the internal space.