A process for manufacturing a composite material part includes formation of a fibrous texture from refractory ceramic fibres, placement of the fibrous texture in a mould with interposition of a filtration layer between the fibrous texture and a discharge port, the filtration layer including a partially densified fibrous structure, pressure injection of a slurry containing a powder of refractory ceramic particles into the fibrous texture, drainage by the filtration layer of the slurry solvent having passed through the fibrous texture and retention of the powder of refractory ceramic particles within the texture by the filtration layer to obtain a fibrous preform including the fibrous texture filled with refractory ceramic particles and the filtration layer, heat treatment of the refractory ceramic particles present in the fibrous texture of the preform to form a composite material part including the fibrous texture densified by a refractory ceramic matrix and the filtration layer.

A joined body 10 is manufactured by joining a Mo- or Ti-made terminal 14 having a Ni coating, a Au coating, a NiAu coating (with Ni Serving as a base) to a recess 12a formed in a plate-shaped ceramic member 12 made of alumina or aluminum nitride through a joint layer 16. The joint layer 16 contains Au, Sn, Ag, Cu, and Ti and is in contact with a bottom surface of the recess 12a and with at least part of a side surface of the recess 12a (the entire side surface in this case). In the joint layer 16, its joint interface with the ceramic member 12 is Ti-rich. When the joined body 10 is cut in its thickness direction, the ratio of the total cross sectional area of pores to the cross-sectional area of the joint layer 16 (porosity) is 0.1 to 15%.

The present application discloses a packaging structure for a power module, comprising: a heat dissipation substrate; at least one first power device disposed on a first substrate having an insulating layer, the first substrate disposed on the heat dissipating substrate; and at least one second power device including a jumping electrode having a jumping potential, wherein the at least one second power device is disposed on at least one second substrate having an insulating layer, and the at least one second substrate is disposed on the first substrate, to reduce a parasitic capacitance between the jumping electrode and the heat dissipation substrate. The packaging structure for the power module according to the present application can reduce the parasitic capacitance between the jumping electrode of the power module and the heat dissipation substrate, thereby greatly reducing the EMI noise of the power module in operation.

A joining material used for joining side surfaces of a plurality of silicon carbide-based honeycomb segments to each other to produce a silicon carbide-based honeycomb structure. The joining material contains from 0.1 to 50% by mass of processed powder generated in the production of the silicon carbide-based honeycomb segments and/or the silicon carbide-based honeycomb structure. The joining material has an average particle diameter D50 of from 0.5 to 60 m.

A ceramic bonding material including at least one fibrous material, a flux agent and a thickening agent wherein the ceramic bonding material fired at a set temperature to bond the two adjacent substrate faces.

A ceramic bonding material including at least one fibrous material, a flux agent and a thickening agent wherein the ceramic bonding material fired at a set temperature to bond the two adjacent substrate faces.

The present application discloses a packaging structure for a power module, comprising: a heat dissipation substrate; at least one first power device disposed on a first substrate having an insulating layer, the first substrate disposed on the heat dissipating substrate; and at least one second power device including a jumping electrode having a jumping potential, wherein the at least one second power device is disposed on at least one second substrate having an insulating layer, and the at least one second substrate is disposed on the first substrate, to reduce a parasitic capacitance between the jumping electrode and the heat dissipation substrate. The packaging structure for the power module according to the present application can reduce the parasitic capacitance between the jumping electrode of the power module and the heat dissipation substrate, thereby greatly reducing the EMI noise of the power module in operation.

A joined body 20 according to the present invention includes a first member 22 made of a porous ceramic, a second member 24 made of a metal, and a joint 30 formed of an oxide ceramic of a transition metal, the joint 30 joining the first member 22 to the second member 24. Alternatively, a joined body may include a first member made of a dense material, a second member made of a dense material, and a joint formed of an oxide ceramic of a transition metal, the joint joining the first member to the second member.

In a step (a), a ceramic substrate, a brazing material including a metal having a large thermal expansion coefficient, a porous body having a smaller thermal expansion coefficient than the brazing material, and a feeding terminal are placed on a joint surface in such a way that a joint surface of the feeding terminal faces a joint surface of the ceramic substrate. In a step (b), the brazing material is fused to allow the brazing material to penetrate into the pores of the porous body. In this manner, a joint layer containing the brazing material and the porous body is formed, and the joint surface of the ceramic substrate and the joint surface of the feeding terminal are joined to each other through the joint layer.

A joined body 20 includes a porous ceramic 22 made of porous ceramic, a metal member 24 made of a metal, and a joint 30 formed of an oxide ceramic that penetrates into pores 23 of the porous ceramic 22 and joins the porous ceramic 22 to the metal member 24. The penetration depth of the oxide ceramic into the pores of the porous ceramic is preferably 10 m or more, and more preferably 15 to 50 m. The joined body 20 may be produced through a joining step of forming a joint by placing a metal raw material between a porous ceramic and a metal member and firing the metal raw material in the air at a temperature in the range of 400 C. to 900 C., where an oxide ceramic produced by oxidation of the metal raw material penetrates into the pores of the porous ceramic in the joint.